Configurations for cooling systems are disclosed. In at least one embodiment, a fluid manifold is positioned to couple directly to one or more liquid-cooled server connections to form a connection when the liquid-cooled server is in an installed position within a server rack.

The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.

An immersion system includes an immersion tank configured to store a coolant liquid and contain an electronic device, a heat exchanger coupled to the immersion tank through first piping, a first pump provided in the first piping and configured to circulate the coolant liquid between the immersion tank and the heat exchanger, a tank coupled to the immersion tank through second piping, a second pump provided in the second piping and configured to move the coolant liquid between the immersion tank and the tank, a level sensor provided in the immersion tank and configured to detect a liquid level in the immersion tank, and a controller configured to control the second pump in accordance with a detection signal of the level sensor.

A cooling system (50) including an immersion case, a bladder and a controller is disclosed. The immersion case (54) is configured to house an immersion cooling liquid, and an electronic component (80) configured to be submerged in the immersion cooling liquid. The bladder (56) is configurable between an expanded state and a contracted state and positioned such that the bladder (56) can be at least partially submerged in the immersion cooling liquid when in any one of the expanded state and the contracted state. The controller (58) is connected to the bladder (56) for modulating the bladder (56) between the expanded state and the contracted state to modulate a fluid level of the immersion cooling liquid in the immersion case (54).

A cooling system comprises a main cooling arrangement thermally coupled to the heat generating component, and configured for collecting thermal energy of the heat generating component via a main heat transfer fluid, and a backup cooling arrangement thermally coupled to the main cooling arrangement and comprising at least one fluid path configured for conducting a backup heat transfer fluid. The cooling system comprises a thermal fuse disposed within at least a portion of the at least one fluid path, the thermal fuse changing from a solid state to a melted state and selectively enabling a flow of the backup heat transfer fluid in the at least one fluid path of the backup cooling arrangement in response to its temperature being above a temperature threshold, the backup heat transfer fluid being configured to, upon flowing in the at least one fluid path, collect thermal energy from the main cooling arrangement.

According to one aspect, an apparatus includes a first system that generates heat, and a cooling arrangement. The cooling arrangement cools the first system, and includes a coolant source and a distribution arrangement. The coolant source provides a coolant in a first state that is distributed by the distribution arrangement to absorb the heat. The cooling arrangement includes a control arrangement and a heating arrangement. The control arrangement maintains the coolant in the first state at least a set point, the set point being a temperature that is above a dew point, by determining when to activate the heating arrangement to warm the coolant in the first state and, when it is determined by the control arrangement that the heating arrangement is to be activated, activating the heating arrangement to warm the coolant in the first state to maintain the temperature of the coolant at the set point.

The present disclosure relates to a silicon-controlled rectifier water-cooling heat dissipation device, including: a water-cooling cavity body; a silicon-controlled rectifier; and a heat dissipation plate. The heat dissipation plate includes: a first heat dissipation part configured to contact the water-cooling cavity body; and a second heat dissipation part connected to the first heat dissipation part and configured to contact the silicon-controlled rectifier. A preset included angle is formed between a plane where the first heat dissipation part is located and a plane where the second heat dissipation part is located. The heat of the silicon-controlled rectifier is transferred to the water-cooling cavity body through the heat dissipation plate. An occupied volume can be effectively reduced because the first heat dissipation part and the second heat dissipation part form the included angle. The cooling water takes away the heat by the flowability of the water to improve heat dissipation efficiency.

Embodiments of the invention provide a system and method for housing electrical components of a high-density liquid cooling unit to liquid cool electrical components. The system includes a first electrical cabinet housing at least one electrical switch and a controller. The first electrical cabinet is swingable outward to open, and the first electrical cabinet opens while the high density liquid cooling system continues to operate to liquid cool electrical components. The system includes a second electrical cabinet housing a first motor drive and a second motor drive. The second electrical cabinet is accessible when the first electrical cabinet swings outward. One of the first motor drive and the second motor drive are replaceable while the high density liquid cooling unit continues to operate.

A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.