An immersion cooling thermal management system includes a heat duct thermally coupled to a heat-generating electronic component. The heat duct has an inlet at a first longitudinal end of a channel and an outlet at an opposite second longitudinal end of the channel. The heat-generating electronic component is thermally coupled with the channel longitudinally between the inlet and the outlet. The outlet of the channel is higher than the inlet relative to a direction of gravity.

An information technology (IT) equipment cooling system includes a coolant unit to be coupled to an electronic rack, the coolant unit to supply a two phase liquid coolant to one or more IT equipment cooling sets mounted within on an electronic rack. Each of the one or more IT equipment cooling sets includes an IT unit having one or more pieces of IT equipment configured to provide IT services and is at least partially submerged within the two phase liquid coolant, where, while the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the two phase liquid coolant thereby causing at least some of the two phase liquid coolant to turn into vapor phase. The IT equipment cooling set includes an IT condensing unit having a condenser positioned above the IT unit and the condenser is to condense the vapor back into liquid state.

An electronics system packaging/enclosure can include an external chassis, an internal chassis housed within the external chassis, and a condenser chassis housed within the external chassis, where the condensing chassis is situated on top of the internal chassis. The electronics system packaging can include a condenser unit housed in the condensing chassis to condense a vapor into a two-phase liquid coolant, and IT electronics housed within the internal chassis, where the internal chassis is at least partially submerged within the two-phase liquid coolant, where, heat generated within the internal chassis is transferred to the two-phase liquid coolant thereby causing at least some of the two-phase liquid coolant to turn into a vapor.

An electronic rack includes one or more servers, where each server is contained within a respective server container, and each server is at least partially submerged in two-phase liquid coolant, where, while the server generates heat that is transferred to the two phase liquid coolant thereby causing some of the two phase liquid coolant to turn into a vapor. The electronic rack includes a condenser container and condensing coils mounted at a top portion of the electronic rack to condense the vapor into the two-phase liquid coolant. The electronic rack includes a vapor manifold along a length of the electronic rack, the vapor manifold coupling the condenser container to a respective server, where the vapor manifold carries the vapor from the servers to the condensing coils. The electronic rack includes a first return line coupled to the condenser container, to return the two-phase liquid coolant to a coolant unit.

A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with dielectric liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the dielectric liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. The resupply tank may also be positioned within the containment passageway.

An immersion cooling system and methods for operating the system are described. The system can comprise a vessel configured to hold thermally conductive, condensable dielectric fluid; a pressure controller to reduce or increase an interior pressure of the vessel; a computer component configured to be at least partially submerged within the dielectric fluid; and a fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter and deliver the dielectric fluid to a bath area of the vessel.

A method and system for controlling operation of an immersion cooling system having an immersion cooling tank adapted to contain a heat transfer fluid used to immersion cool a heat-generating object contained therein, the method including: sampling a volume of the heat transfer fluid while the object remains in an operating state; measuring at least one property or parameter of the sampled heat transfer fluid; generating and transmitting measurement data to a control unit; comparing measurement data with respective threshold data using the control unit; and controlling operation of the immersion cooling system with the control unit based on the comparison.

A method of producing a fluoroolefin includes contacting a compound of formula (1), R.sub.fCX.sub.1═CHCF.sub.3, with a fluorinated ethylene compound of formula (2), CX.sub.2X.sub.3═CX.sub.4X.sub.5 in the presence of a catalyst. In the compound of formula (1), R.sub.f is a linear or branched C.sub.1-C.sub.10 perfluorinated alkyl group and Xi is H, Br, Cl, or F. In the compound of formula (2), X.sub.2, X.sub.3, X.sub.4, and X.sub.5 are each independently H, Br, Cl, or F and at least three of X.sub.2, X.sub.3, X.sub.4, and X.sub.5 are F. The resulting composition comprises a compound of formula (3), R.sub.f(CF.sub.2).sub.nCX.sub.6═CH(CF.sub.2).sub.mCX.sub.7X.sub.8CFX.sub.9X.sub.10. In the compound of formula (3), X.sub.6, X.sub.7, X.sub.8, X.sub.9, and X.sub.10 are each independently H, Br, Cl, or F, and the total number of each of H, Br, Cl, and F corresponds to the total number of each of H, Br, Cl, and F provided by the compounds of formulae (1) and (2).

A gas storage device includes a casing, a lift platform, a lift mechanism, a driving mechanism, an exhaust valve and a gas joint. The lift platform is movably disposed in the casing, wherein a gas storage space is between a bottom of the casing and the lift platform. The lift mechanism is disposed in the casing and connected to the lift platform. The driving mechanism is connected to the lift mechanism. The driving mechanism drives the lift mechanism to drive the lift platform to move. The exhaust valve is connected to the lift platform and communicates with the gas storage space. The gas joint is connected to the bottom of the casing and communicates with the gas storage space.

A system includes a vessel, a cooling fluid in the vessel, and at least one power magnetics assembly in the vessel and immersed in the cooling fluid. The system further includes at least one heat sink having a surface in contact with the cooling fluid in the vessel and at least one power semiconductor device mounted on the at least one heat sink. The cooling fluid may be electrically insulating and the vessel may be sealed.