A cooling apparatus for a medium voltage switchgear includes an evaporator section; a fluid conduit; and a condenser section. The evaporator section surrounds a current carrying contact and is configured such that fluid within the evaporator section can contact an outer surface of the current carrying contact. The evaporator section is fluidly connected to the fluid conduit. At least part of the evaporator section is electrically insulating and is connected to the fluid conduit. The fluid conduit is fluidly connected to the condenser section. In use, a working fluid in the evaporator section is heated to a vapor state, the vapor is transferred by the fluid conduit to the condenser section, and the vapor in the condenser section is condensed to the working fluid. The working fluid is passively returned to the evaporator section.

A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.

The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed and then flow downward along wave-pattern flow paths having zigzag shapes, thereby providing an advantage of improving heat dissipation performance without increasing a size thereof.

Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.

A heat dissipation cabinet includes a cabinet body and a heat dissipation apparatus. A first accommodation region of the cabinet body can accommodate a plugboard in a stacked manner, and heat source components of the plugboard dissipate heat through the heat dissipation apparatus. An evaporator, a condenser, and an evaporation pipeline of the heat dissipation apparatus are connected to a liquid return pipeline to form a heat exchange loop, and the evaporator is in thermal contact with an outer surface of a heat source component. The condenser is disposed in a second accommodation region and located above the evaporator. A refrigerant flows in the heat exchange loop, to draw heat of the heat source component far to the condenser, and take away heat of the condenser using air generated by a fan. A second accommodation region is used as an independent air duct whose path is relatively short.

A passive hybrid heat transfer system for cooling a heat source, such as an integrated circuit, includes a thermosiphon heat transfer subsystem that operates in combination with a supplemental heat transfer subsystem to transfer heat away from and thereby cool the integrated circuit. The heat transfer system includes the thermosiphon heat transfer subsystem including a condenser coupled to an evaporator. The evaporator is coupled to the integrated circuit or other heat source and is positioned below the condenser relative to a direction of gravity. The supplemental heat transfer subsystem is thermally coupled to the evaporator of the thermosiphon heat transfer subsystem and has at least a portion extending below the evaporator relative to the direction of gravity. A network device like a switch or router may include the hybrid heat transfer system to cool high power integrated circuits without the need to resort to active cooling systems.

The present invention relates to a wireless charging device and a mobile means including same. Specifically, according to an embodiment of the present invention, a wireless charging device comprises: a coil unit, a magnetic unit arranged on the coil unit; and a heat transfer unit arranged in contact with at least a portion of the magnetic unit, thereby efficiently transferring heat generated in the magnetic unit to the outside and further improving heat dissipation and charging efficiency. Therefore, the wireless charging device can be advantageously used in a mobile means such as an electric vehicle requiring a large amount of power transmission between a transmitter and a receiver.

In one embodiment, a cooling system comprises an information technology (IT) cluster layer with multiple immersion tanks, each immersion tanks including electronic components submerged in a two-phase liquid coolant; and a cooling capacity layer that includes a vapor subsystem, a liquid subsystem, and a condensing cooler. The system further includes a distribution layer that include vapor lines for transmitting vapor from each of the immersion tanks to the vapor subsystem, and liquid lines for distributing liquid from the liquid subsystem to each immersion tank in the IT cluster layer. The two subsystems operate independently to maintain proper fluid level in the immersion tanks efficiently.

A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

A distributed composite refrigeration system includes a multichannel heat exchanger and at least two refrigeration units. The at least two refrigeration units are connected to at least two indoor areas in one-to-one correspondences. Each refrigeration unit includes a refrigeration part, a heat exchange part, and a heat dissipation part. A refrigerant flows between the refrigeration part and the heat exchange part, an intermediate medium flows in the heat exchange part, and the refrigerant and the intermediate medium implement heat exchange at the heat exchange part. The heat exchange part delivers the intermediate medium obtained after heat exchange to the heat dissipation part and/or the multichannel heat exchanger for heat dissipation. The multichannel heat exchanger is thermally connected to an external pipe network, and the intermediate medium performs heat exchange with a heat carrying body in the external pipe network.