A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

Methods and system are provided for a heat exchanger. In one example, a system, comprises a mobile electronic device comprising a front cover and a rear cover, a heat exchanger arranged between the front cover and the rear cover, the heat exchanger comprising a fluid chamber arranged between an inner surface of a first plate and an inner surface of a second plate, and a wick material arranged within the fluid chamber, the wick material comprising a sintered material configured to allow a plurality of fluid passages to extend therethrough.

The present disclosure comprises an evaporative cooling assembly (200) for cooling an apparatus (220), and a method for cooling an apparatus (220). The evaporative cooling assembly comprises a refrigerant tank (202), the refrigerant tank (202) containing refrigerant (204). The apparatus also comprises a first evaporator (210) configured to be positioned proximal to the apparatus (220), and a second evaporator (216) positioned to cool the refrigerant tank (202). Each of the first evaporator (210) and the second evaporator (216) are in fluid communication with the refrigerant tank (202), and the second evaporator (216) is positioned downstream of the first evaporator (210). The method for cooling a heated apparatus (220) comprises passing a refrigerant (204) from a refrigerant tank (202) to a first evaporator (210), which is located proximal to the apparatus (220). At least part of the refrigerant is evaporated, and then passed to a second evaporator (216), which is positioned to cool the refrigerant tank (202).

This application provides a composite cooling system. The composite cooling system includes an indoor air duct and an outdoor air duct that are independent of each other. The indoor air duct and the outdoor air duct intersect in a heat exchange area of the composite cooling system. A first-stage heat exchanger core, a second-stage heat exchanger core, and a first side air duct are disposed in the heat exchange area. The heat exchange area is constructed as a part of the outdoor air duct. The first-stage heat exchanger core, the first side air duct, and the second-stage heat exchanger core are sequentially arranged along a flow direction of the outdoor air duct. An inner cavity of the first-stage heat exchanger core and an inner cavity of the second-stage heat exchanger core each are further constructed as a part of the indoor air duct.

A heat dissipation member includes a condensation area, an evaporation area, and a capillary structure layer. The condensation area is arranged away from a heating element of an electronic apparatus in an application state. The evaporation area is arranged close to the heating element in the application state. A capillary force of the capillary structure layer in the evaporation area is greater than a capillary force of the capillary structure layer in the condensation area.

An air conditioner for an enclosure that can include a housing that partly defines an ambient air exchange cavity and a tub that further defines the ambient air exchange cavity and partly defines a cooling cavity. The tub can support a first heat exchanger within the ambient air exchange cavity, and a second heat exchanger and a fan within the cooling cavity. The second heat exchanger can be included in a coolant flow loop with the first heat exchanger and the fan can move air across the second heat exchanger and into the inlet of the enclosure. The second heat exchanger can be located above the fan. A fluid trap can be provided below the second heat exchanger and adjacent the fan to capture condensate from the second heat exchanger and can direct the condensate into the ambient air exchange cavity for disposal.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate is coupled to a condenser section of a heat pipe and to a primary computing device, with the heat pipe coupled to an auxiliary computing device at an evaporator section of the heat pipe, so that the cold plate draws heat from the primary computing device and from the heat pipe.

A system and method for controlling a cooling system for an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

A vapor chamber includes a main body, a first vertical structure, and an enhanced boiling surface. The main body has a first surface and defines a first portion of an interior volume. The first vertical structure protrudes transverse to the main body and defines a second portion of the interior volume. The enhanced boiling surface is on at least a portion of the first vertical structure.

An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A connection surface of the porous metal heat dissipation material and a connection surface of the thermal interface material have a sealing layer or a sealing material arranged therebetween.