Embodiments disclosed include a heat exchange apparatus and method comprising, in an electronic device, a first heat exchanger for exchanging heat with the device wherein the heat exchanger comprises a flow duct for receiving a fluid, and at least a portion of the flow duct is arranged for thermal communication with the device. Preferred embodiments include a pressure reducing unit comprising a pump associated with the flow duct and a Venturi tube configured for reducing the pressure of the fluid in the portion of the flow duct arranged in thermal communication with the device and less than the pressure external to the duct. An embodiment includes a fluid reservoir, and a second heat exchanger for removing heat from the fluid reservoir wherein the second heat exchanger comprises an evaporator in a refrigerant system through which refrigerant is passed in a closed loop via an expansion valve from a gas cooler and back into a compressor.

A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.

Systems, apparatuses and methods to provide a hybrid cooling for servers of a data center are described. A cooling plate comprises an inlet port to receive a coolant from a coolant source. The coolant is a two-phase coolant that transforms from a liquid state into vapor when being attached to an electronic device to extract heat from the electronic device. The cooling plate comprises an outlet port to output at least a portion of the coolant back to the coolant source. The cooling plate comprises a vapor port to output the vapor generated from the coolant to a condenser that is configured to condense the vapor back to the liquid state.

Embodiments disclosed include a data center comprising a first reconfigurable utility module comprising interfaces for facilitating electrical power supply, data connectivity, and cooling media supply, and further comprising a plurality of interfaces through which components may be connected to said first reconfigurable utility module. Additionally, a plurality of server modules are connected to the reconfigurable utility module through the interfaces, each of said server modules comprising one or more racks of servers, each of said server modules receiving said power supply, said data connectivity, and said cooling media through an interface through which it is connected to said reconfigurable utility module. Embodiments include one or more second reconfigurable utility modules, each of the one or more second reconfigurable utility modules being connected to the data center by: (a) being attached to one of said server modules; or (b) being attached to another one of the second reconfigurable utility modules; or (c) being attached to said first reconfigurable utility module, a first one of said second reconfigurable modules being extensible to accommodate an additional number of modules, and being reducible to accommodate fewer modules.

A computing system includes a housing, processing circuitry, one or more additional components, and a cryogen evaporator plate. The housing includes a cryogen input port, a cryogen output port, and an interior chamber. The processing circuitry and the one or more additional components are in the interior chamber of the housing. The cryogen evaporator plate is thermally coupled to the processing circuitry and configured to receive a cryogen via the cryogen input port, cool the processing circuitry using the cryogen such that the cryogen is evaporated during the cooling of the processing circuitry to provide evaporated cryogen, and provide the evaporated cryogen into the interior chamber of the housing such that the evaporated cryogen is distributed over the one or more additional components to cool the one or more additional components.

The embodiments of the present application provide a cooling system for data center based on a hyperbola cooling tower. The cooling system includes a compressor, a condenser, a primary fluorine pump, a secondary fluorine pump, a throttling apparatus, an evaporator, and a server. The server is configured to receive data information uploaded from the compressor, the condenser, the primary fluorine pump, the secondary fluorine pump, the throttling apparatus, and the evaporator, calculates the operation frequency of the compressor based on the data information, and control the condenser, the primary fluorine pump, the secondary fluorine pump and the throttling apparatus to transport the refrigerant to the evaporator.

A refrigeration system and refrigeration method for a data center are disclosed. The refrigeration system includes: a first heat exchanger disposed on a back plate of an indoor cabinet of the data center, and a phase-change heat-exchange cooling tower disposed outdoor of the data center. The first heat exchanger and the phase-change heat-exchange cooling tower are communicated by a secondary refrigerant delivery pipeline. The phase-change heat-exchange cooling tower transfers heat carried in the secondary refrigerant into air and condenses the secondary refrigerant to a liquid again; the secondary refrigerant employs a phase-change heat-exchange working medium. An air pump is disposed in the phase-change heat-exchange cooling tower and on a by-pass of the secondary refrigerant delivery pipeline to pressurize the secondary refrigerant in gas-state delivered in the secondary refrigerant delivery pipeline to increase the condensing pressure for condensing the secondary refrigerant to a liquid again.

Provided is a cooling system wherein a first two-phase refrigerant can be circulated by a pump through an evaporator, to a first condenser, to a refrigerant-to-refrigerant heat exchanger and back to the pump. By providing the refrigerant-to-refrigerant heat exchanger in series with the condenser, a first environment can be cooled without having to operate a vapor compression circuit when an ambient temperature outside the first environment is a predetermined amount below an ambient temperature in the first environment.

The purpose of the present invention is to more efficiently cool exhaust heat, of an apparatus or the like that emits heat, by preventing a situation where a gas-phase medium is cooled and turns into a liquid-phase medium and thereby transfer of the gas-phase medium is hindered. For this purpose, a cooling system includes a heat receiving means for receiving a gas heated by heat emitted by an electronic apparatus and changing a liquid-phase heat medium into a gas-phase heat medium. a heat radiation means for cooling the gas-phase heat medium so as to be changed into the liquid-phase heat medium. a first transfer means for transferring the gas-phase heat medium from the heat receiving means to the heat radiation means. and a second transfer means for transferring the liquid-phase heat medium from the heat radiation means to the heat receiving means. wherein at least part of the first transfer means is heated by the heat emitted by the electronic apparatus.

If a gas-liquid separation structure is introduced into a phase-change cooling device to prevent the cooling performance from decreasing, manufacturing costs increase; therefore, a refrigerant intermediary device according to an exemplary aspect of the present invention includes a refrigerant container configured to contain refrigerant; a first inlet, provided for an outer periphery of the refrigerant container, through which a vapor-phase refrigerant and a first liquid-phase refrigerant flowing in; a first outlet, provided for the outer periphery of the refrigerant container, through which the vapor-phase refrigerant flowing out; a second inlet, provided for the outer periphery of the refrigerant container, through which a second liquid-phase refrigerant flowing in; and a second outlet, provided for the outer periphery of the refrigerant container, through which the first liquid-phase refrigerant and the second liquid-phase refrigerant flowing.