A power electronics device comprises a power semiconductor, a first circuit board controllingly connected to the power semiconductor, a lead frame connecting the power semiconductor and the first circuit board. The power semiconductor is connected to at least one contacting region of the lead frame in such a way that heat can be transferred from the power semiconductor to the lead frame and can be conducted away from the lead frame by the power semiconductor The power electronics device further comprises a housing , which borders at least regions of a fluid reservoir accommodating a coolant fluid. The power semiconductor and the lead frame are arranged in the fluid reservoir and are configured to transfer heat to the coolant fluid.

A method and system for controlling operation of an immersion cooling system to filter a heat transfer fluid having an immersion cooling tank adapted to contain the heat transfer fluid used to immersion cool a heat-generating object contained therein, the method and system comprises: sampling the heat transfer fluid in the tank; measuring at least one property or parameter of the sampled heat transfer fluid; generating and transmitting measurement data to a control unit; comparing measurement data with respective threshold data using the control unit; and filtering the heat transfer fluid with a filter based on the comparison results of the control unit.

A heat dissipation member includes a condensation area, an evaporation area, and a capillary structure layer. The condensation area is arranged away from a heating element of an electronic apparatus in an application state. The evaporation area is arranged close to the heating element in the application state. A capillary force of the capillary structure layer in the evaporation area is greater than a capillary force of the capillary structure layer in the condensation area.

An air conditioner for an enclosure that can include a housing that partly defines an ambient air exchange cavity and a tub that further defines the ambient air exchange cavity and partly defines a cooling cavity. The tub can support a first heat exchanger within the ambient air exchange cavity, and a second heat exchanger and a fan within the cooling cavity. The second heat exchanger can be included in a coolant flow loop with the first heat exchanger and the fan can move air across the second heat exchanger and into the inlet of the enclosure. The second heat exchanger can be located above the fan. A fluid trap can be provided below the second heat exchanger and adjacent the fan to capture condensate from the second heat exchanger and can direct the condensate into the ambient air exchange cavity for disposal.

According to one embodiment, an immersion cooling system may include a container to receive one or more server blades, each having electronics, at least partially submerged within a two-phase coolant contained within the container. The immersion cooling system may also include a cover panel to cover the phase change area. This area may include a liquid region defined to contain the two-phase coolant therein, and a vapor region defined between the cover panel and a surface of the two-phase coolant. The cover panel includes a plurality of slots, covered with rotatable panels. At least one of the slots is configured to allow a server blade to be inserted into the liquid region and at least partially submerged into the two-phase coolant. The slots may be configured to allow a condensing unit to be inserted into the vapor region.

An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.

A system and method for controlling a cooling system for an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

An immersion cooling system includes a catch pan, a heat-generating electronic device, a housing, and a fluid pump. The housing is positioned around the heat-generating electronic device, and at least part of the housing is positioned above the catch pan. The fluid pump is configured to circulate a working fluid from the catch pan to the housing.

A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller (“PLC”). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.

Disclosed is an immersion cooling unit including an immersion cell, defining an internal cavity. An electrical component is positioned in the internal cavity. A dielectric working fluid partially fills the internal cavity and at least partially immerses the electrical component. A condensing coil is positioned above the dielectric working fluid. The dielectric working fluid comprises at least one of 1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene, (HFO-153-10mczz), or 1,1,1,4,5,5,5-heptafluoro-4-trifluoromethyl-2-pentene, (HFO-153-10mzzy). Also disclosed is a method of cooling an electrical component, comprising partially immersing an electrical component in a working fluid; and transferring heat from the electrical component using the working fluid