An electronics system packaging/enclosure can include an external chassis, an internal chassis housed within the external chassis, and a condenser chassis housed within the external chassis, where the condensing chassis is situated on top of the internal chassis. The electronics system packaging can include a condenser unit housed in the condensing chassis to condense a vapor into a two-phase liquid coolant, and IT electronics housed within the internal chassis, where the internal chassis is at least partially submerged within the two-phase liquid coolant, where, heat generated within the internal chassis is transferred to the two-phase liquid coolant thereby causing at least some of the two-phase liquid coolant to turn into a vapor.

A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.

An electronic rack includes one or more servers, where each server is contained within a respective server container, and each server is at least partially submerged in two-phase liquid coolant, where, while the server generates heat that is transferred to the two phase liquid coolant thereby causing some of the two phase liquid coolant to turn into a vapor. The electronic rack includes a condenser container and condensing coils mounted at a top portion of the electronic rack to condense the vapor into the two-phase liquid coolant. The electronic rack includes a vapor manifold along a length of the electronic rack, the vapor manifold coupling the condenser container to a respective server, where the vapor manifold carries the vapor from the servers to the condensing coils. The electronic rack includes a first return line coupled to the condenser container, to return the two-phase liquid coolant to a coolant unit.

Provided is a heat dissipation structure, including a conductive member disposed on and thermally coupled to a heat source, a heat pipe including evaporating and condensing parts, a fan disposed in correspondence to the condensing part, and a heat storage component disposed on a circuit board. The evaporating part is disposed on and thermally coupled to the conductive member. The heat source is located between the conductive member and the circuit board. The conductive member is located between the heat pipe and the heat source. The circuit board is located between the heat source and the heat storage component, and is thermally coupled to the heat source. The heat storage component is thermally coupled to the circuit board and is filled with a working medium absorbing heat conducted from the heat source to the circuit board by latent heat of absorption during phase change. An electronic device is also provided.

A composite refrigeration system includes a refrigeration part, a heat dissipation part, a first pipeline, a second pipeline, and a refrigerant. The refrigeration part uses the refrigerant to cool air sent into indoor space, and the heat dissipation part is configured to perform heat dissipation on the refrigerant. In addition, in two heat dissipation modes, the heat exchanger may exchange heat between the refrigerant and a heat carrier in an external pipeline network to implement heat dissipation. The composite refrigeration system implements, by using the heat exchanger, a function of exchanging heat with the external pipeline network, so that heat generated during operation of the composite refrigeration system can be at least partially transferred to the heat carrier in the external pipeline network, to implement the energy recycle and reuse.

A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with dielectric liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the dielectric liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. The resupply tank may also be positioned within the containment passageway.

A method and system for controlling operation of an immersion cooling system having an immersion cooling tank adapted to contain a heat transfer fluid used to immersion cool a heat-generating object contained therein, the method including: sampling a volume of the heat transfer fluid while the object remains in an operating state; measuring at least one property or parameter of the sampled heat transfer fluid; generating and transmitting measurement data to a control unit; comparing measurement data with respective threshold data using the control unit; and controlling operation of the immersion cooling system with the control unit based on the comparison.

An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel. First and second tube parts are in fluid communication with evaporation portion.

A heat dissipating device includes a thermosyphon, a first liquid cooling tube and a first heat dissipating fin set. The thermosyphon has an evaporation portion and a condensation portion. The first liquid cooling tube is sleeved on the condensation portion. The first heat dissipating fin set is sleeved on the first liquid cooling tube.