The disclosure relates to a housing comprising at least one composite wall comprising woven or braided carbon fibers covered with a thermoplastic or thermosetting resin, an electronic card carrying electronic components, and a heat transfer device having at least one portion facing an electronic component to be cooled of the electronic card, said heat transfer device being inserted inside the composite wall, the heat transfer device comprising at least one cooling conduit containing a cooling fluid.

An immersion cooling system includes a box body, a condensing structure and a pressure adjusting module. The box body has a first containing space, the first containing space is adapted to contain a heat dissipation medium, and at least one heat generating component is disposed in the first containing space to be immersed in the heat dissipation medium which is in liquid state. The condensing structure is disposed in the first containing space and above the heat dissipation medium which is in liquid state. The pressure adjusting module is adapted to actively drive a liquid in the first containing space to flow into the second containing space, such that a pressure in the first containing space is reduced to be less than an external pressure. In addition, an electronic apparatus having the immersion cooling system and a pressure adjusting module are also provided.

An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.

A refrigeration system for a data center includes an indoor module, a main outdoor heat-dissipation module and an auxiliary outdoor heat-dissipation module, inlets of the first compressor and the second compressor are respectively connected to an outlet of the indoor module, outlets of the first compressor and the second compressor are respectively connected to a gaseous refrigerant inlet of the first condenser, liquid refrigerant outlets of the first condenser and the second condenser are respectively connected to an inlet of the indoor module, in which a refrigeration cycle passage for the data center is formed by the indoor module, the first condenser and the first compressor when the main outdoor heat-dissipation module is in a normal condition, and the refrigeration cycle passage for the data center is formed by the indoor module, the second condenser and the second compressor when the main outdoor heat-dissipation module fails.

An electronics cabinet cooling system may include multiple cabinet heat exchangers mounted at an air discharge of respective different electronic cabinets. Heat from a flow of air heated by electronic components in the electronic cabinets may be received by respective cabinet heat exchangers. A liquid refrigerant flowing through the heat exchangers in parallel may be at least partially changed from liquid to gas and absorb the heat from the flow of air. A three-way tee in a common outlet header downstream from the cabinet heat exchangers may direct the gas refrigerant to a condenser and the liquid refrigerant to a receiver. The condenser may condense the gas refrigerant to liquid refrigerant, which may be routed to the receiver.

A rack cooling system includes a primary cooling condenser and a secondary cooling condenser. The primary cooling condenser is positioned above servers of a server rack and the secondary cooling condenser is position above the primary cooling condenser. Each of the severs, the primary cooling condenser, and the secondary cooling condenser is connected to a liquid manifold via one of a plurality of liquid ports on the liquid manifold, and to the vapor manifold via one of a plurality of vapor ports on the vapor manifold. A cooling capacity of the rack cooling system can be extended by switching on a vapor flow between the secondary cooling condenser and the primary cooling condenser using a first valve on the vapor manifold. Further, a second valve on a primary cooling loop can be used to control cooling fluid flowing into the secondary cooling condenser after the first valve is trigged open.

A projector includes a first cooling target, a cooling device, and an exterior housing that houses the first cooling target and the cooling device. The cooling device includes a first compressor configured to compress working fluid, a condenser configured to condense the working fluid, a first expander configured to decompress the working fluid, a first evaporator configured to change the working fluid to the working fluid in the gas phase with heat transferred from the first cooling target, a first connection pipe configured to lead the working fluid discharged from the first expander to the first evaporator, a second connection pipe configured to lead the working fluid discharged from the first evaporator to the first compressor, and a first case configured to seal the first expander, the first connection pipe, the first evaporator, and the second connection pipe on an inside.

A data center and a data center cluster have plurality of immersion cooling systems and a plurality of coolant units that provide two-phase coolant to one or more of the plurality of immersion cooling systems. Each coolant unit dispatches and manages two-phase coolant to two or more of the plurality of immersion cooling systems. The coolant units can fill or empty an immersion tank of an immersion cooling system, and can empty or fill a coolant tank in the coolant unit. A single-phase cooling fluid cools the vapor phase of the two-phase coolant in each immersion cooling system. The coolant units are modular, with a common interface to other coolant units and to immersion cooling systems to create a scalable cooling system and data center.

A coolant management unit for providing liquid cooling for backup battery unit (BBU) modules of an electronic rack includes a BBU return manifold, a BBU supply manifold, a balance loop, and a power bus. For example, a BBU supply manifold having a rack supply connector to receive cooling fluid from a rack supply manifold and a BBU supply connector to be connected to one of the BBU modules to distribute the cooling fluid. A BBU return manifold to be coupled to a rack return manifold, wherein the BBU return manifold is to receive vapor from the BBU modules. A balance loop connected to each of the BBU modules to establish a fluid connection amongst the BBU modules, such that a level of the cooling fluid in each of the BBU modules remains similar.

The cooling system for a data center includes an information technology (IT) container, secondary condensing system, and a coolant distribution unit. In particular, an IT container includes a liquid region to store cooling liquid, a vapor region to receive vapor evaporated from the cooling liquid, and a primary condenser disposed within the vapor region to condense the vapor. For example, the external cooling air or cooling liquid is controlled to be delivered to condensers. Further, a secondary condenser is coupled to the IT container via a vapor line to receive at least a portion of the vapor from the vapor region of the IT container and to condense the portion of the vapor. Furthermore, a coolant distribution unit is coupled to the IT container and the secondary condenser to store and to distribute the cooling liquid to the IT container.