Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an in-rack refrigerant distribution unit (RDU) distributes refrigerant to one or more colds plates in association with a pressure control system to enable a pressure-drop before an expansion valve for a liquid-phase of a refrigerant based in part on a pressure of a liquid-phase of a refrigerant exceeding a first threshold and based in part on a temperature associated with one or more cold plates being below a second threshold.

A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.

An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment, the IT equipment is configured to provide IT services and is at least partially submerged within a first phase change liquid within the immersion tank, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the first phase change liquid thereby causing at least some of the first phase change liquid to turn into vapor phase. The cooling system includes a condenser unit having a second phase change liquid circulating at the condenser unit. The condenser unit includes a vacuum port, a sealing valve at the vacuum port. The cooling system includes a heat exchange core, coupling within the immersion tank connecting with the condenser unit to carry heat from the first phase change liquid to the second phase change liquid.

In one embodiment, a cooling system comprises an information technology (IT) cluster layer with multiple immersion tanks, each immersion tanks including electronic components submerged in a two-phase liquid coolant; and a cooling capacity layer that includes a vapor subsystem, a liquid subsystem, and a condensing cooler. The system further includes a distribution layer that include vapor lines for transmitting vapor from each of the immersion tanks to the vapor subsystem, and liquid lines for distributing liquid from the liquid subsystem to each immersion tank in the IT cluster layer. The two subsystems operate independently to maintain proper fluid level in the immersion tanks efficiently.

A thermal management system includes a cooling unit, a condenser, and a processor. The processor is located within a server, and the system also includes a phase change cooling device in thermal communication with the processor, and in fluid communication with the condenser. The system also includes a single phase cooling device in thermal communication with the phase change cooling device, and in fluid communication with the liquid cooling unit. The system also includes a temperature sensor in thermal communication with the single phase cooling device, and a fluid pump to move fluid between the liquid cooling unit and the single phase cooling device. A TEC device may also be implemented between the phase change cooling device and the single phase cooling device.

A reverse-return parallel loop system is provided, including a cooling cycle comprised of a plurality of heat sinks, at least one heat exchanger, and at least one liquid pump to carry liquid coolant through the system. Each heat sink has a vapor inlet, a liquid inlet, a vapor outlet, and a liquid outlet. The liquid coolant is pumped into the heat sink through the liquid inlet where the coolant splits in to two streams, where one stream flows out of the liquid outlet towards the next heat sink downstream, and the other stream flows through the heat sink, and through the heat exchanger core to absorb heat from the heat sources and become at least partially vaporized by the heat. This stream then merges with vapor from other heat sinks upstream and flows out through the vapor outlet back towards the heat exchanger of the system.

In one embodiment, an immersion cooling system comprising one or more electronic devices submerged in a two-phase liquid coolant, a first cooling loop to provide cooling liquid to the immersion system, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line, and a second cooling loop to provide cooling liquid to the immersion system, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line. The apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line and at least one main cooling source comprising a fluid control valve controlled based on the first pressure sensor and the second pressure sensor.

An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment situated within the immersion tank. The IT equipment is configured to provide IT services and is at least partially submerged within a phase change liquid, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the phase change liquid thereby causing at least some of the phase change liquid to turn into vapor phase. The immersion cooling system includes a primary condenser unit positioned above the immersion tank and a secondary condenser unit, where, either a single, or both the primary and secondary condenser units are configured to receive cooling liquid from an external cooling unit to condense the phase change liquid in vapor phase back into liquid phase.

The disclosure provides a system, for designing and developing immersion cooling in data centers. The system includes an internet technology (IT) tank that houses a computing device immersed in a two phase coolant; an aisle, in which the immersion tank is disposed, that captures a first vaporized portion of the two phase coolant escaped from the immersion tank; a condenser that transforms the first vaporized portion of the two phase coolant that escaped from the immersion tank into a first liquid portion of the two phase coolant; a second condenser captures and condenses a second portion of vapor; and a liquid distributor manages the cooling fluid and coolant fluid for the IT tank and two condensers.

In one embodiment, a liquid cooling apparatus includes a first cooling loop to provide cooling liquid to a heat load, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line and a second cooling loop to provide cooling liquid to the heat load, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line, wherein the first vapor return line and the second vapor return line are coupled by an interconnection loop. The liquid cooling apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line, and at least one main cooling source controlled based on the first pressure sensor and the second pressure sensor.