An electronic rack includes condensing, coolant distribution, and server regions. The condensing region includes a condensing container housing condensing coils and a coolant container to contain two phase coolant. The coolant distribution region includes a set of rack manifolds having at least a rack liquid supply line to receive coolant from the coolant distribution region, and a vapor line to return vapor to the coolant distribution region, a liquid return line. The server region is coupled to the condensing region and the coolant distribution region, the server region includes a number of server slots to receive a number of servers, where each of the servers is at least partially submerged within two phase liquid coolant, where, when the servers operate, the servers generate heat that is extracted by the two phase liquid coolant thereby causing at least some of the two phase liquid coolant to turn into a vapor.

A system for cooling a circuit component on an electronic device includes a closed-loop cooling circuit and a coolant filling device. The closed-loop cooling circuit includes a coolant block, a first pump and a radiator. The coolant filling device includes a container, a base and a second pump disposed inside the base. The coolant filling device is configured for attachment to the cooling circuit. In some embodiments, when the coolant filling device is attached to the cooling circuit, coolant may be circulated from the coolant filling device to the cooling circuit while the cooling circuit circulates coolant. In further embodiments, when the coolant filling device is attached to the cooling circuit, coolant may be circulated from the coolant filling device to the cooling circuit while the electronic device remains powered on.

A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.

Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

The present invention discloses a three-chambered constant pressure apparatus for liquid immersion cooling of servers. The apparatus comprises a housing within which two partitions are disposed. The two partitions divide the housing into a first chamber, a second chamber and a third chamber. A coolant is maintained within the first chamber, and an isolating liquid is maintained within the second chamber and the third chamber. At least one heat-generating device is submerged within the coolant maintained within the first chamber. During the operation of a server, a coolant is heated to a boiling point temperature generating a coolant vapor that causes the pressure in chambers to rise. By adjusting the air pressure in chambers prior to use, the rising pressure in chambers caused by the coolant vapor can be efficiently relieved. Therefore, the immersion cooling apparatus is maintained at a constant pressure during operation, ensuring the reliability of the immersion cooling apparatus and the sustainability of cooling capacity.

An immersion cooling system includes a box body, a condensing structure and a pressure adjusting module. The box body has a first containing space, the first containing space is adapted to contain a heat dissipation medium, and at least one heat generating component is disposed in the first containing space to be immersed in the heat dissipation medium which is in liquid state. The condensing structure is disposed in the first containing space and above the heat dissipation medium which is in liquid state. The pressure adjusting module is adapted to actively drive a liquid in the first containing space to flow into the second containing space, such that a pressure in the first containing space is reduced to be less than an external pressure. In addition, an electronic apparatus having the immersion cooling system and a pressure adjusting module are also provided.

An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.

A refrigeration system for a data center includes an indoor module, a main outdoor heat-dissipation module and an auxiliary outdoor heat-dissipation module, inlets of the first compressor and the second compressor are respectively connected to an outlet of the indoor module, outlets of the first compressor and the second compressor are respectively connected to a gaseous refrigerant inlet of the first condenser, liquid refrigerant outlets of the first condenser and the second condenser are respectively connected to an inlet of the indoor module, in which a refrigeration cycle passage for the data center is formed by the indoor module, the first condenser and the first compressor when the main outdoor heat-dissipation module is in a normal condition, and the refrigeration cycle passage for the data center is formed by the indoor module, the second condenser and the second compressor when the main outdoor heat-dissipation module fails.

An electronics cabinet cooling system may include multiple cabinet heat exchangers mounted at an air discharge of respective different electronic cabinets. Heat from a flow of air heated by electronic components in the electronic cabinets may be received by respective cabinet heat exchangers. A liquid refrigerant flowing through the heat exchangers in parallel may be at least partially changed from liquid to gas and absorb the heat from the flow of air. A three-way tee in a common outlet header downstream from the cabinet heat exchangers may direct the gas refrigerant to a condenser and the liquid refrigerant to a receiver. The condenser may condense the gas refrigerant to liquid refrigerant, which may be routed to the receiver.

A rack cooling system includes a primary cooling condenser and a secondary cooling condenser. The primary cooling condenser is positioned above servers of a server rack and the secondary cooling condenser is position above the primary cooling condenser. Each of the severs, the primary cooling condenser, and the secondary cooling condenser is connected to a liquid manifold via one of a plurality of liquid ports on the liquid manifold, and to the vapor manifold via one of a plurality of vapor ports on the vapor manifold. A cooling capacity of the rack cooling system can be extended by switching on a vapor flow between the secondary cooling condenser and the primary cooling condenser using a first valve on the vapor manifold. Further, a second valve on a primary cooling loop can be used to control cooling fluid flowing into the secondary cooling condenser after the first valve is trigged open.