A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.

A thermal module includes a base seat, at least two heat pipes and multiple heat dissipation units. Each heat pipe has a heat absorption end and a heat dissipation end outward extending from the heat absorption end. The heat absorption ends are disposed on the base seat. The heat dissipation ends of the at least two heat pipes are positioned above the base seat at different heights and misaligned from each other. The multiple heat dissipation units are connected with the heat dissipation ends of the heat pipes and arranged at intervals. By means of arranging the multiple heat dissipation unit at intervals as multiple layers, the heat dissipation areas is enlarged to prevent the airflow from being interrupted so as to effectively greatly enhance the heat dissipation efficiency.

A temperature controlling method of a liquid cooling device includes a providing step, a disposing step and a processing and controlling step. In the providing step: a microprocessor and multiple flexible micro sensors are provided. In the disposing step: the microprocessor is disposed on the liquid cooling device (including an evaporator, a condenser, a cold water tube, a hot water tube, a pumping motor and a cooling fan motor), and the micro sensors are separately disposed in the cold water tube and the hot water tube to directly contact with the liquid. In the processing and controlling step: the microprocessor receives data sensed in the cold water tube and the hot water tube by the micro sensors to calculate, and controls the pumping motor and the cooling fan motor to modulate an operating performance according to a calculated result.

According to one embodiment, a cooling system includes a primary condenser, a primary supply line and a primary return line that couples the primary condenser to a cold plate that is arranged to be used for electronics cooling to create a primary heat-transfer loop in which the condenser supplies liquid coolant to the cold plate and receives vapor produced by the cold plate, a secondary condenser, a secondary supply line that couples the secondary condenser to the primary supply line, a secondary return line that couples the secondary condenser to the primary return line, and a primary valve that is coupled to the secondary return line, where, in response to vapor pressure exceeding a pressure threshold, the valve at least partially opens to create a secondary heat-transfer loop in which the secondary condenser condense vapor back into liquid coolant that is supplied to the primary supply line.

A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with phase change liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the two phase liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. An air mover generates pressure differential within the containment passageway to direct the vapor towards the condenser.

A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing unit removably locatable in first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable. A retractable cover sheet assembly, under computer control, is positioned to form a sized opening, which may include a containment structure, prior to opening the tank lid to minimize dielectric fluid loss.

A heat dissipation tooth piece and a preparation method therefor, a heat dissipation apparatus and an electronic device are disclosed. The heat dissipation tooth piece including a first heat dissipation assembly and a second heat dissipation assembly which are oppositely arranged, the first heat dissipation assembly includes a first heat dissipation part, and the second heat dissipation assembly includes a second heat dissipation part; the first heat dissipation part and the second heat dissipation part are oppositely arranged and define a first pipeline, the first heat dissipation assembly further includes a first connection part, the second heat dissipation assembly further includes a second connection part, the first connection part and the second connection part are connected and define a second pipeline, and the second pipeline is communicated with the first pipeline.

The present disclosure refers to an immersion cooling system and process. Representative embodiments include an interface for interconnecting the inside of the vessel to the outside using an exemplary pass through plates. Additional embodiments include carbon tapes at the opening areas of the vessel. In one example embodiment, a ledge for returning any fluid that is condensed on the top door of the vessel may be provided. Representative features also may include roller covering or overlays, pipes to deliver a spray to clean components, and/or cooling a pump to prevent premature failure. Other embodiments include mechanisms for pump life improvement, gap fillers to reduce fluid needed, and improved vapor management techniques.

A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid cool the computer components. Advantageously, a pH indicator is employed to monitor the acidity of the dielectric fluid via, for example, a color change.

Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes.