A heat-dissipating module including heat-dissipating fins and heat pipes is provided. The heat-dissipating fins include first and second heat-dissipating fins arranged in an interleaved, spaced apart manner, and arranged in parallel along a first direction. The first heat-dissipating fins have interleaved first vias and first breach holes. The second heat-dissipating fins have interleaved second vias and second breach hole. The first breach holes and the second breach holes are arranged along a second direction, and the second vias respectively correspond to the first vias. The first direction is not parallel to the second direction. The heat pipes are configured to pass through the first vias and the second vias. A position of the orthogonal projection of a first breach hole formed on the second heat-dissipating fins along the first direction and the corresponding second breach hole are not overlap or are partially overlapped, and are arranged in symmetry.

A first cooling apparatus includes a first heat sink having multiple first fins having a U-shaped opening and an O-shaped opening which are provide therein, a first heat receiving member configured to be brought into abutment with a heat source, and a first heat pipe which extends from one end which is connected with the heat receiving member towards the other end, and the first heat pipe has a first extending portion which extends from the one end, a bent portion which is bent from the first extending portion and at least a part of which is disposed inside the U-shaped opening, and a second extending portion which extends from the bent portion and at least a part of which is disposed inside the O-shaped opening.

Provided is a vapor-based heat transfer apparatus (e.g. a vapor chamber or a heat pipe), comprising: a hollow structure having a hollow chamber enclosed inside a sealed envelope or container made of a thermally conductive material, a wick structure in contact with one or a plurality of walls of the hollow structure, and a working liquid within the hollow structure and in contact with the wick structure, wherein the wick structure comprises a graphene material.

In aspects of processor heat dissipation in a stacked PCB configuration, a computing device includes a processor for executable instructions processing during which the processor generates heat. The computing device also includes a main printed circuit board (PCB) in a stacked PCB configuration, and the processor is affixed to the main printed circuit board. The stacked PCB configuration forms an enclosed cavity through which heat dissipation is restricted. The computing device includes a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration. The heat spreader exits the enclosed cavity via an opening in the enclosed cavity between the stacked PCB configuration, and the heat spreader transfers the heat away from the processor to the heat sink.

A wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a first vapor flow channel portion, a liquid flow channel portion provided on the second body surface, and the second vapor flow channel portion provided on the first body surface. The sheet body includes a land portion having the longitudinal direction being a first direction, and the first vapor flow channel portion is disposed around the land portion. The second vapor flow channel portion includes a vapor flow channel groove extending from one of side edges of the land portion to the other side edge in a second direction orthogonal to the first direction.

An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.

A mobile terminal includes middle frame assembly that is configured to bear an electronic component in the mobile terminal. The electronic component includes a heat source, and the middle frame assembly includes a middle frame, one or more heat pipes, and a first vapor chamber. The middle frame includes a heat dissipation region corresponding to the heat source. The first vapor chamber is accommodated in the heat dissipation region. The heat pipes are connected to the first vapor chamber, and are configured to dissipate heat from the first vapor chamber. This structure of the mobile terminal and the middle frame assembly of the mobile terminal improves heat dissipation performance of the mobile terminal.

An immersion cooling system includes a cooling tank, a housing and a valve. The coolant tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The housing covers a side of the cooling tank and thereby forms an enclosure. The valve has two ports, one of which communicates with the enclosure and the other communicates with a part of the cooling tank above the liquid coolant. The valve is configured to open in response to a gas pressure inside the cooling tank exceeding an upper limit.

An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.

An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.