A tight-fit riveting structure for a heat dissipation aluminum base and a heat pipe includes a heat dissipation aluminum base, a heat pipe, and a holder. When the heat dissipation aluminum base is to be manufactured, an upper surface of a thin aluminum plate is pressed downward to form an arched portion. The arched portion protrudes below the thin aluminum plate. A cavity is defined in the arched portion. The cavity has an upper end opening. The cavity has an inner width corresponding to an outer width of the heat pipe. The cavity has a depth greater than a thickness of the heat pipe.

A loop-type heat pipe includes a loop-type heat pipe main body including a loop-shaped flow path in which a working fluid is enclosed, a first magnet provided to the loop-type heat pipe main body, a heat dissipation plate thermally connected to the loop-type heat pipe main body, and a second magnet provided to the heat dissipation plate and provided to face the first magnet. The first magnet and the second magnet are provided so that different magnetic poles face to each other.

An air-liquid composite cooler for a memory module is provided. The memory module has a top portion and two side portions. The air-liquid composite cooler includes a liquid-cooling structure and a pair of air-cooling structures. The liquid-cooling structure is arranged on the top portion and has a liquid passage. The air-cooling structure is arranged on a side portion, and includes a phase-change thermo-conductive member. One end of the phase-change thermo-conductive member contacts the liquid-cooling structure to conduct heat and another end of the phase-change thermo-conductive member is extended in a direction away from the liquid-cooling structure. Therefore, the overall cooling efficiency of the cooler may be improved.

An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU) operatively coupled to the processor; a cooling fan operatively coupled to the processor to draw air into and direct air out of a base chassis of the information handling system, the cooling fan including a fan housing; and a radio module operatively coupled to the fan housing to be cooled by conduction to the fan housing and operation of the fan via convective cooling.

A vapor chamber and a mobile terminal are provided. The vapor chamber comprises a first cover plate, a second cover plate, a housing including the first cover plate and the second cover plate, wherein the first cover plate and the second cover plate are connected to form a sealed cavity, a cooling medium, a capillary structure disposed in the sealed cavity, and a supporting structure extending from an inner surface of the housing to an internal space of the housing. A material of the first cover plate and the second cover plate is a high-strength composite material, wherein the high-strength composite material comprises a first material layer and a second material layer. The vapor chamber has light weight, small thickness and structural strength.

An electronic device is provided, which may include a first housing; a second housing configured to accommodate at least a portion of the first housing and guide a sliding movement of the first housing; a display including a first display area disposed on the first housing and a second display area extending from the first display area; a PCB configured to accommodate at least one electronic component; a support member configured to support the PCB; a side wall member connected to the support member and facing at least a portion of the first housing; a heat dissipation sheet configured to receive heat from the at least one electronic component, the heat dissipation sheet being disposed on the support member and the side wall member; and a heat dissipation member disposed on the side wall member and facing the heat dissipation sheet.

Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.

A thermal module includes a base seat and multiple heat pipes. The base seat has a heat absorption side and a heat conduction side. Each heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end has a pair of long sides and a pair of short sides. The long sides and the short sides are connected with each other in the form of a loop to form the heat absorption end. The heat pipes are assembled with each other with the long sides attached to each other. The heat pipes are assembled with the base seat with the short sides attached to the heat conduction side of the base seat. By means of the above arrangement, the number of the heat pipes disposed in a limited area or space can be greatly increased to enhance the heat conduction efficiency.

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.