A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

A liquid-submersible thermal management system includes a shell, a heat-generating component, a working fluid, and at least one heat-dispersing element. The shell defines an immersion chamber where the heat-generating component is located in the immersion chamber. The working fluid is positioned in the immersion chamber and at least partially surrounds the heat-generating component so the working fluid receives heat from the heat-generating component. The at least one heat-dispersing element is positioned on exterior surface of the shell to conduct heat from the shell into the heat-dispersing element.

The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

A hybrid cooling system of an electric machine is contemplated. The hybrid cooling system comprises a propeller positioned on an exterior of an enclosure, at least one electronic component disposed within the enclosure, and a vapor chamber disposed within the enclosure, wherein the vapor chamber comprises an actuator configured to generate mist from a liquid coolant within the enclosure. In operation, in a first mode, the propeller rotates for generating air that is channeled into the enclosure via fins that are disposed on exterior portions of the enclosure, and in a second mode, the actuator generates mist within the vapor chamber, and the propeller rotates for generating air that is channeled into the enclosure via the fins disposed therein.

A liquid-submersible thermal management system includes a shell, a heat-generating component, a working fluid, and at least one heat-dispersing element. The shell defines an immersion chamber where the heat-generating component is located in the immersion chamber. The working fluid is positioned in the immersion chamber and at least partially surrounds the heat-generating component so the working fluid receives heat from the heat-generating component. The at least one heat-dispersing element is positioned on exterior surface of the shell to conduct heat from the shell into the heat-dispersing element.

A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

A heat exchange device for air cooling for conditioning and climate control systems for server rooms and the like, which comprises: an air/air heat exchanger, designed to be passed through by a primary air stream along a first trajectory from an intake region to an outflow region and by a secondary air stream along a second trajectory from a corresponding intake region to a corresponding outflow region, water dispensing elements adapted to wet the heat exchanger downward from above, elements of collecting the water that descends from the heat exchanger, a recirculation pump for returning the air-cooling water from the collection elements up to the dispensing elements arranged above the heat exchanger; the water dispensing elements comprise a plurality of nozzles arranged side by side, or rows of nozzles, which are adapted to dispense water with a flow-rate that decreases starting from the intake region for the primary air stream toward the outflow region of the heat exchanger.

A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone.

A server rack cooling arrangement may include a server rack enclosure defining a single undivided interior volume of space and configured to be sealable; two or more open-frame-server-units disposed within the interior volume of space and arranged in a multi-level arrangement, wherein heat-producing-electronic-components may be exposed to environmental conditions of the interior volume of space; a central condenser disposed towards a rear; a coolant reservoir for collecting condensate from the central condenser; at least one nozzle in fluid communication with the coolant reservoir and configured to deliver fine coolant droplets into the interior volume of space for impingement on the heat-producing-electronic-components; and a fan configured to generate an airflow through the two or more open-frame-server-units from a front to the rear in a manner so as to carry coolant vapour generated from impingement of the fine coolant droplets on the heat-producing-electronic-components to the central condenser.