A thermal management system for cooling electronics includes an immersion tank, a working fluid in the immersion tank, a heat exchanger, a first fluid conduit, and a second fluid conduit. The heat exchanger is configured to transfer thermal energy from the working fluid to ambient air to cool the working fluid. The first fluid conduit provides fluid communication from the immersion tank to the heat exchanger, and the second fluid conduit provides fluid communication from the heat exchanger to a spray nozzle to spray working fluid into the immersion tank.

An embodiment of the present disclosure provides a compound evaporative cooling tower and a data center, relating to the field of cooling tower technology. The compound evaporative cooling tower includes an air-inlet grille, a precooling module, a first spray module, a cooling module, a direct evaporative heat exchanger, a second spray module, a water collector, and an outdoor fan. The precooling module is arranged on an inner side of the air-inlet grille. The first spray module is arranged above the precooling module, and the second spray module is arranged above the direct evaporative heat exchanger. The cooling module is arranged below the direct evaporative heat exchanger and includes a plurality of cooling sub-modules.

A cooling device includes a frame structure housing an internal channel and an inlet port coupled to the frame structure. The inlet port is to receive a coolant fluid and to direct the coolant fluid to the internal channel. The cooling device includes one or more contactless cooling ports disposed on the frame structure and at a predetermined distance from an electronic chip. A contactless cooling port accelerates a stream of coolant fluid across a surface of the electronic chip to transfer heat from the electronic chip to the stream of coolant fluid. The cooling device includes a separator for segregating and diverging streams of coolant fluid. The cooling device includes a mounting structure secured to the frame structure, where the mounting structure is mounted to a server chassis or a server board.

A liquid-submersible thermal management system includes a shell, a heat-generating component, a working fluid, and at least one heat-dispersing element. The shell defines an immersion chamber where the heat-generating component is located in the immersion chamber. The working fluid is positioned in the immersion chamber and at least partially surrounds the heat-generating component so the working fluid receives heat from the heat-generating component. The at least one heat-dispersing element is positioned on exterior surface of the shell to conduct heat from the shell into the heat-dispersing element.

A system is disclosed for cooling telecommunications equipment. The system includes a nozzle disposed proximate a piece of telecommunication equipment to be cooled and a fluid conduit in fluid communication with the nozzle. A fluid supply is coupled to the fluid conduit and provides fluid to the fluid nozzle. A nozzle control system is coupled to the nozzle and configured to actuate the nozzle to cause fluid to emerge from the nozzle, thereby providing a fluid mist to cool the air surrounding at least a part of the telecommunication equipment.

A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone.

A data center cabinet includes a cabinet body, an oil distributor and a plurality of liquid distributors. The cabinet body is sequentially mounted with a plurality of server housings from high to low. A liquid distributor is provided above each of the plurality of server housings. The present invention also relates to a gravity spray system. On the one hand, as cooling liquid oil is concentrated in an oil distributor tank disposed above, the oil automatically flows along an oil passage under gravity, and there is no need to provide pressure in the oil passage, thus reducing the power consumption of an oil pump, improving the coefficient of performance (COP) of a heat dissipation system and reducing the overall PUE of a data center. An oil quantity regulator in an oil distribution unit is used to ensure consistent flow rate distributed to each layer of server.

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

Disclosed is a working contact cooling system for a high-power device (1), wherein the sealed case body (8) is a structure having inner and outer layers, a chamber between the inner and outer layers is filled with a heat-superconductive coolant (9), and an outer wall of the outer layer of the sealed case body (8) is provided with heat dissipating fins (10); the sealed case body (8) is provided with an insulating liquid heat-conductive coolant (2), the coolant pump (6) sinks in the insulating liquid heat-conductive coolant (2), the filter (7) is installed at an inlet of the coolant pump (6), the coolant pump (6) is connected to the spray main pipe (5), and a plurality of spray branch pipes (4) are connected in parallel with the spray main pipe (5), each of the spray branch pipes (4) is provided with a plurality of nozzles (3), and the nozzles (3) face the high-power device (1); the nozzles (3) spray against front and back surfaces of the high-power device (1).

A fluid cooling device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by an adhesive layer. In addition, the spray cooling cover includes a fluid inlet and a plurality of fluid outlets to utilize a working fluid to cool the chip directly.