A heat exchange device and an equipment system using the same are illustrated. A pipe unit is filled with a heat-transfer medium, and via cycling of a vapor/gas pressurizer, a heat dissipation device and a throttling device, the heat-transfer medium flows to a heat sink having a heat sinking surface, and the heat sinking surface contacts a heat source, such that the heat-transfer medium flowing to the heat sink passes the heat sinking surface to take away the heat of the heat source. The heat exchange device is disposed in an equipment having at least a power supply and at least a working unit, wherein the working unit forms a heat source when operating, and the working unit contacts the heat sinking surface, such that a direct heat absorption and an efficient heat cycle are performed to achieve a heat dissipation effect.

An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a component of the computer system, an ambient cooled condenser connected to the evaporator, a first pump to provide a coolant flow within the cooling loop, a pressure regulator configured to maintain a selected pressure in the primary cooling loop, and a controller responsive to changes in outdoor ambient conditions and an amount of heat dissipated by the computer system and configured to dynamically adjust the pump and pressure regulator in response thereto.

Internal interchangeable modular avionics platform assemblies and methods for removably mounting and interchanging modular avionics platforms within an aircraft. In some embodiments, modular avionics platform assemblies may include a modular avionics platform configured to support various avionics equipment, suitable for removable mounting within a forward fuselage, and interchangeable with a number of alternate platforms. A platform may include a frame structure, and mounting pins and a connector assembly disposed on the frame structure. The mounting pins may project outwardly from the frame structure to align with and detachably secure to corresponding airframe members of an aircraft when the frame structure is in a mounted position. The connector assembly may be disposed on the frame structure and have a plurality of connectors, including connectors for alternating current, direct current, and data. In some embodiments, the platform may also include an environmental cooling system disposed on the frame structure.

A heat exchanger assembly (1) is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit (100), the passive cooling circuit comprising an evaporator (110) connectable to a device (50) to be cooled for conducting heat from the device (50) to be cooled to the cooling fluid within the evaporator (110), thereby evaporating the cooling fluid, and a condenser (120) interconnected with the evaporator (110) for receiving the evaporated cooling fluid from the evaporator (110), releasing heat from the cooling fluid to an environment of the condenser (120), thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit (200) comprising a compressor (250) and an auxiliary condenser (220), the active partial circuit (200) being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit (200), the cooling fluid from the evaporator (110), for compressing the received cooling fluid by the compressor (250), for releasing heat, by the auxiliary condenser (220), from the compressed cooling fluid to an environment of the auxiliary condenser (220), and for returning the condensed cooling fluid to the evaporator (110). Furthermore, the passive cooling circuit (100) is a base-to-air type thermosiphon or an air-to-air type thermosiphon.

Embodiments disclosed include a heat exchange apparatus and method comprising, in an electronic device, a first heat exchanger for exchanging heat with the device wherein the heat exchanger comprises a flow duct for receiving a fluid, and at least a portion of the flow duct is arranged for thermal communication with the device. Preferred embodiments include a pressure reducing unit comprising a pump associated with the flow duct and a Venturi tube configured for reducing the pressure of the fluid in the portion of the flow duct arranged in thermal communication with the device and less than the pressure external to the duct. An embodiment includes a fluid reservoir, and a second heat exchanger for removing heat from the fluid reservoir wherein the second heat exchanger comprises an evaporator in a refrigerant system through which refrigerant is passed in a closed loop via an expansion valve from a gas cooler and back into a compressor.

The present disclosure discloses a cooling system employable in data centers. An specific embodiment of the cooling system comprises: a first refrigeration medium, a first evaporator, a first condenser, and an all-condition cooling tower, wherein: the first evaporator is installed in a to-be-cooled space, the first evaporator is connected to the first condenser, an installation position of the first condenser is higher than an installation position of the first evaporator; the first condenser is connected to the all-condition cooling tower, and the all-condition cooling tower is disposed outside the to-be-cooled space, the all-condition cooling tower is used for providing the first condenser with a cold source for cooling the first refrigeration medium in a gaseous state. The cooling system provided by the embodiment has the advantages of simple structure, convenient installation and maintenance and low cost.

A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a control unit within a rack has a pump or compressor unit to cause two-phase fluid to circulate through a cold plate associated with a computing device and to circulate through a heat exchanger associated with a rear door of a rack, so as to dissipate heat from a computing device through a heat exchanger by a control unit within a rack.

A cooling system for an electric vehicle that includes a cooling system loop including a refrigerant, a compressor, and a heat exchanger. The cooling system loop includes a plurality of sub-loops configured to receive the refrigerant after the refrigerant exits the heat exchanger, wherein the sub-loops include a component to be cooled by the refrigerant.

An electronics cabinet cooling system may include multiple cabinet heat exchangers mounted at an air discharge of respective different electronic cabinets. Heat from a flow of air heated by electronic components in the electronic cabinets may be received by respective cabinet heat exchangers. A liquid refrigerant flowing through the heat exchangers in parallel may be at least partially changed from liquid to gas and absorb the heat from the flow of air. A three-way tee in a common outlet header downstream from the cabinet heat exchangers may direct the gas refrigerant to a condenser and the liquid refrigerant to a receiver. The condenser may condense the gas refrigerant to liquid refrigerant, which may be routed to the receiver.