A power electronics unit, a vapor compression system incorporating the power electronics unit, and a method of cooling a power electronics unit are provided. The power electronics unit includes a semiconductor portion and an inductor portion. Approximately 80% of the heat generated by the power electronics unit may be derived from the semiconductor portion. Approximately 20% of the heat generated by the power electronics unit may be derived from the inductor portion. The semiconductor portion is cooled using at least one fan. The inductor portion is cooled using a working fluid (e.g., a refrigerant). The working fluid may be provided from upstream of the evaporator in the vapor compression system. Limiting the use working fluid to only cool the inductor portion of the power electronics unit may minimize the impact of the power electronics unit on the vapor compression system.

An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.

The invention relates to an explosion-proof arrangement (10) having an explosion-proof housing (11) which encloses a housing interior (13) and which is designed with the pressure-resistant encapsulation type of flame-proof protection. The housing interior (13) is subdivided into a first subregion (16) and a second subregion (17) by an intermediate wall (15) in such a way that the two subregions (16, 17) are explosion-proof relative to one another and consequently each subregion (16, 17) provides the pressure-resistant encapsulation type of flame-proof protection. At least one outer wall section (12a) of an outer wall (12) of the housing (11) is designed in a flame-proof and gas-permeable manner and allows gas exchange between the second subregion (17) and the surrounding area (14). A refrigeration machine (22) is arranged in the housing interior (13), wherein the evaporator (27) is located in the first subregion (16) and the condenser (24) is located in the second subregion (17). Heat from at least one electrical and/or electronic device (21) or another heat source in the first subregion (16) can therefore be dissipated into the second subregion (17) and from there to the surrounding area (14). This measure can prevent hotspots, which can ignite the explosion-hazard atmosphere in the surrounding area (14), from forming locally.

A power electronics unit, a vapor compression system incorporating the power electronics unit, and a method of cooling a power electronics unit are provided. The power electronics unit includes a semiconductor portion and an inductor portion. Approximately 80% of the heat generated by the power electronics unit may be derived from the semiconductor portion. Approximately 20% of the heat generated by the power electronics unit may be derived from the inductor portion. The semiconductor portion is cooled using at least one fan. The inductor portion is cooled using a working fluid (e.g., a refrigerant). The working fluid may be provided from upstream of the evaporator in the vapor compression system. Limiting the use working fluid to only cool the inductor portion of the power electronics unit may minimize the impact of the power electronics unit on the vapor compression system.

A projector includes first and second cooling targets and a cooling device. The cooling device includes a first compressor, a condenser, a first expander configured to decompress a part of the working fluid condensed by the condenser, a first evaporator configured to change the working fluid in a liquid phase flowing from the first expander into the working fluid in a gas phase by using heat from the first cooling target, a second expander configured to decompress the other part of the working fluid condensed by the condenser, a second evaporator configured to change the working fluid in a liquid phase flowing from the second expander into the working fluid in a gas phase by using heat from the second cooling target, and a second compressor configured to compress the working fluid in a gas phase flowing from the second evaporator.

The present disclosure discloses a cooling system, a control method and a data center computer room. The cooling system includes an evaporative cooling module, an oilless centrifugal compressor, a condensing module, a circulating pump module, and a throttling module. A first output end of the evaporative cooling module is connected to an input end of the oilless centrifugal compressor, an output end of the oilless centrifugal compressor is connected to an input end of the condensing module; an output end of the condensing module is connected to an input end of the circulating pump module, an output end of the circulating pump module is connected to an input end of the throttling module; and an output end of the throttling module is connected to an input end of the evaporative cooling module, and a second output end of the evaporative cooling module leads to an air supply channel.

Methods and systems for leak detection in a fluid compression system using a purge system are disclosed herein. In an embodiment, a method for detecting leaks includes determining, during a period of vacuum, a purge exhaust rate of non-condensables from a purge system integrated with a chiller unit. The method includes determining a differential pressure, the differential pressure based on a vacuum side pressure of the chiller unit, where the vacuum side pressure includes at least one of a pressure of a condenser and pressure of an evaporator. The method includes calculating, via a controller, the purge exhaust rate and the differential pressure to identify a leak size based at least in part on the purge exhaust rate.

An electric device includes a case, an electric component that is provided in the case and has a main body section and a lead terminal extending from the main body section, the main body section being supported on the case, a circuit board that is provided in the case and has a connecting hole through which the lead terminal is inserted, and a guide member that has a guide hole positioned relative to the connecting hole, the lead terminal being disposed to penetrate through the guide hole.

A cooling assembly includes a radiator, a pump and a casing. The radiator includes a plurality of refrigerant flow paths and a plurality of ventilation paths. The radiator is operable to cool a refrigerant circulating in the plurality of refrigerant flow paths with air flowing through the plurality of ventilation paths. The pump is connected to the radiator to pressurize the refrigerant. The casing accommodates the radiator and the pump. The radiator is inclined with respect to a first surface of the casing. At least a portion of the pump is positioned between the radiator and the first surface.

A modular cooling system comprising a plurality of chiller modules and a coolant circuit with flow paths having parts in each of the plurality of chiller modules. The coolant circuit cools a working fluid to meet a cooling demand, and the working fluid can be cooled in heat exchange with the heat absorbing heat exchangers of the free cooling circuits and heat exchange with the heat absorbing heat exchangers of the refrigeration circuits. The flow paths of the coolant circuit connect to the heat absorbing heat exchangers of the free cooling circuits in parallel and connect to the heat absorbing heat exchangers of the refrigeration circuits in series. The coolant circuit flow paths split along parallel flows through the heat absorbing heat exchangers of the free cooling circuits before recombining to flow sequentially in a combined flow path through the heat absorbing heat exchangers of the refrigeration circuits.