A system and a method are provided for cooling heat-generating devices. A plurality of heat exchangers are in thermal communication with a plurality electronic devices. Each of the plurality of heat exchangers includes at least one channel configured to receive and circulate a working liquid. Each of the plurality of heat exchangers may be a cold plate, an air cooler, and a combination thereof. The plurality of heat exchangers include at least one cold plate in direct contact with at least one of the plurality of electronic device. At least one air cooler circulates air and convectively absorbs heat from the remaining electronic devices.

A system and a method are provided for cooling devices and recovering waste heat. A plurality of heat absorption devices in direct or indirect thermal contact with a plurality electronic devices, and comprise channels to receive an evaporable working liquid, which becomes a first 2-phase mixture having a first liquid portion and a first vapor portion upon absorption of heat from the devices. At least one compressor compresses the first vapor portion to form a compressed vapor having elevated pressure and temperature. At least one heat exchanger condenses the compressed vapor to liquid so as to release the heat. An expansion device is used to expand the liquid to provide a second 2-phase mixture comprising a second liquid portion and a second vapor portion. In at least one vapor-liquid separator, the first liquid portion and the second liquid portion are fed back to the plurality of heat absorption devices. The second vapor portion is fed back to the at least one compressor.

The present invention relates to an air-vapor separation method for separating air from refrigerant vapor in an immersed liquid-cooling system. The immersed liquid-cooling system comprises an immersed server blade cabinet, a condensing device, an air-vapor separator and a refrigerant storage tank, wherein the refrigerant storage tank supplies a liquid refrigerant to the immersed server blade cabinet, and the liquid refrigerant undergoes a phase change to be vaporized into a refrigerant vapor for cooling of the heating element in the immersed server blade cabinet; the condensing device condenses the refrigerant vapor; the air-vapor separator separates a mixed gas in the immersed liquid-cooling system into the air and the refrigerant vapor. The cooling efficiency of the liquid-cooling system is improved by effectively separating the air from the refrigerant vapor in the liquid-cooling system.

A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.

An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a component of the computer system, an ambient cooled condenser connected to the evaporator, a first pump to provide a coolant flow within the cooling loop, a pressure regulator configured to maintain a selected pressure in the primary cooling loop, and a controller responsive to changes in outdoor ambient conditions and an amount of heat dissipated by the computer system and configured to dynamically adjust the pump and pressure regulator in response thereto.

The present invention relates to a system for cooling a vehicle electric component including: a compressor compressing a refrigerant; a condenser connected to the compressor to condense the refrigerant supplied from the compressor and formed to surround an outer periphery of the compressor; an expansion means connected to the condenser to expand the refrigerant supplied from the condenser; an evaporator connected to the expansion means and the compressor to evaporate the refrigerant supplied from the expansion means by a heat exchange and then introduce the evaporated refrigerant into the compressor; and a blower fan disposed on one side or the other side of the condenser which is opened, wherein the system for cooling a vehicle electric component may effectively cool electric components such as a variety of sensors and computers of an autonomous vehicle and may secure a sufficient cooling performance by using a vapor compression system.

The invention relates to a regulation method for an electrical enclosure cooling device, which has a refrigerating machine and a heat pipe arrangement, wherein the method comprises measuring a current internal electrical enclosure temperature and determining a target temperature for the internal electrical enclosure temperature, wherein said internal electrical enclosure temperature and target temperature form input signals of a regulator for actuating the electrical enclosure cooling device, and wherein said regulator outputs a control signal for determining manipulated variables of the refrigerating machine; determining the regulator control signal as a measured variable which is proportional to the respective current required cooling power; measuring the ambient electrical enclosure temperature and determining a respective energy efficiency for the refrigerating machine and the heat pipe arrangement either in the event that the required cooling power is to be provided by the refrigerating machine or in the event that the required cooling power is to be provided by the heat pipe arrangement; and selecting and activating that one of the two coolant circuits that can provide the required cooling power with greater energy efficiency.

A heat exchanger assembly is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit, the passive cooling circuit including an evaporator connectable to a device to be cooled for conducting heat from the device to be cooled to the cooling fluid within the evaporator, thereby evaporating the cooling fluid, and a condenser interconnected with the evaporator for receiving the evaporated cooling fluid from the evaporator, releasing heat from the cooling fluid to an environment of the condenser, thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit comprising a compressor and an auxiliary condenser, the active partial circuit being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit, the cooling fluid from the evaporator, for compressing the received cooling fluid by the compressor, for releasing heat, by the auxiliary condenser, from the compressed cooling fluid to an environment of the auxiliary condenser, and for returning the condensed cooling fluid to the evaporator. Furthermore, the passive cooling circuit is a base-to-air type thermosiphon or an air-to-air type thermosiphon.

Systems and methods for providing an electronic cooling apparatus comprising a chassis having an internal space that is sized/shaped to receive/structurally support circuit card(s). The internal space defined by sidewalls with a channel formed therein in which a coolant is disposed. The coolant is in thermal communication with the circuit card(s) via the sidewall(s) when the circuit card(s) is(are) disposed in the chassis. A refrigerant-based cooling system is disposed in the chassis and comprises an evaporator having inlet/outlet ports coupled to the channel of the chassis to define a first closed-loop channel for the coolant within the chassis. The evaporator facilitates heat transfer from the coolant to a refrigerant flowing through a second closed-loop channel of the chassis at least partially defined by the evaporator. A pump is disposed in the chassis and configured to cause the coolant to flow through the first closed-loop channel.

A fluid deployment unit includes an expandable container containing mixed fluids in a gaseous region and a liquid region, where the expandable container includes a gas-out port, a liquid-out port, a gas-in port, and a liquid-in port. The fluid deployment unit includes a first three-way valve having a first port coupled to the liquid-out port, a second port coupled to the gas-out port, and a third port matable to an inlet of an electronic rack. The fluid deployment unit includes a second three-way valve having a first port matable to an input port of a liquid-to-liquid exchange unit of a testing assistant unit, a second port coupled to the gas-in port, and a third port matable to an outlet of the electronic rack, where the liquid-in port of the expandable container is matable to an output port of the liquid-to-liquid exchange unit.