Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an absorption chiller includes a generator vessel to enable removal of heat from fluid returned from at least one computing component of the datacenter.

The present disclosure provides a refrigeration system and refrigeration method for a data center. The refrigeration system comprises: a first heat exchanger disposed on a back plate of an indoor cabinet of the data center, and a phase-change heat-exchange cooling tower disposed outdoor of the data center; the first heat exchanger and the phase-change heat-exchange cooling tower are communicated by a secondary refrigerant delivery pipeline; the secondary refrigerant delivery pipeline obtains a secondary refrigerant in liquid-state from the phase-change heat-exchange cooling tower and delivers the secondary refrigerant to the first heat exchanger, the secondary refrigerant absorbs heat on the first heat exchanger and becomes gas to refrigerate for the indoor of the data center where the first heat exchanger lies; the secondary refrigerant delivery pipeline further delivers the secondary refrigerant in gas-state to the phase-change heat-exchange cooling tower, and the phase-change heat-exchange cooling tower transfers heat carried in the secondary refrigerant into air and condenses the secondary refrigerant to a liquid again; the secondary refrigerant employs a phase-change heat-exchange working medium. The refrigeration system of the data center according to the present disclosure can easily achieve 100% refrigerator-free water-free highly-efficient and energy-saving refrigeration, has a simple structure and can reduce the maintenance costs.

Heat-and-cold recovery system based on liquid cooling data center (energy storage power station) includes high-temperature heat pump, pressure-less heat-storage tank, pressurized heat-storage tank, absorption-type water chiller group, compression-type water chiller group, water cold-storage tank, and PCM cold-storage tank. High-temperature heat pump forms circulating heat-exchange loops with CDU and with pressure-less heat-storage tank; hot-water output interface of pressure-less heat-storage tank connects to pressurized heat-storage tank through first circulating pump set and pipeline heater sequentially; pressurized heat-storage tank stores and outputs hot water/steam; pressurized heat-storage tank connects to absorption-type water chiller group through second circulating pump set and forms circulating heat-exchange loop with pressure-less heat-storage tank through absorption-type water chiller group; absorption-type water chiller group forms circulating heat-exchange loop with computer-room air-cooling region; compression-type water chiller group connects to water/PCM cold-storage tank, which stores cooling water of compression-type water chiller group for heat exchange to CDU and/or computer-room air-cooling region.

Disclosed are methods and compositions for alternatingly adsorbing and desorbing sorbate molecules by changing the adsorption affinity of polarizable molecular sorbent molecules attached to surfaces of conductors, attached to dielectric materials between the conductors, or attached to both. The conductors and optionally a dielectric material can be arranged as a capacitor.

An electrical system for use in powering an electrical device includes a housing, a plurality of electrical components positioned within the housing, and a cooling system coupled in flow communication with the plurality of electrical components. The cooling system includes a sorption chiller positioned proximate the housing and is configured to utilize waste heat from the plurality of electrical components to condition air within the housing such that an internal temperature of the housing is less than an ambient temperature external to the housing.

An adsorption heat pump includes: an evaporator configured to generate coolant vapor; a first adsorber and a second adsorber each containing an adsorbent to adsorb the coolant vapor generated in the evaporator; a condenser configured to condense the coolant vapor generated in any of the first adsorber and the second adsorber; and a control unit. The control unit feeds the condenser with cooling water for condensation of the coolant vapor and feeds the condenser with warm water for evaporation of the coolant at predetermined timing.

The present invention relates to a heat dissipation apparatus for an electronic device. In particular, the heat dissipation apparatus comprises: a heat conduction panel body having formed therein a refrigerant flow space in which, while charged refrigerant changes in phase, gas-liquid circulation takes place; and an absorber which is disposed in the refrigerant flow space of the heat conduction panel body, and which distributes, while absorbing and holding the liquefied refrigerant of the refrigerant, the liquefied refrigerant in the direction of gravity or at least in a direction opposite to the direction of gravity, wherein, due to the material itself, the absorber prevents shape deformation in the direction of gravity even while maintaining the absorption rate for the liquefied refrigerant, and thus, provided is the advantage of greatly improving overall heat dissipation performance.

Heat-and-cold recovery system based on liquid cooling data center (energy storage power station) includes high-temperature heat pump, pressure-less heat-storage tank, pressurized heat-storage tank, absorption-type water chiller group, compression-type water chiller group, water cold-storage tank, and PCM cold-storage tank. High-temperature heat pump forms circulating heat-exchange loops with CDU and with pressure-less heat-storage tank; hot-water output interface of pressure-less heat-storage tank connects to pressurized heat-storage tank through first circulating pump set and pipeline heater sequentially; pressurized heat-storage tank stores and outputs hot water/steam; pressurized heat-storage tank connects to absorption-type water chiller group through second circulating pump set and forms circulating heat-exchange loop with pressure-less heat-storage tank through absorption-type water chiller group; absorption-type water chiller group forms circulating heat-exchange loop with computer-room air-cooling region; compression-type water chiller group connects to water/PCM cold-storage tank, which stores cooling water of compression-type water chiller group for heat exchange to CDU and/or computer-room air-cooling region.

The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, the active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space with which a refrigerant is filled, in which the refrigerant flow space includes a first refrigerant flow path in which the thermal conduction panel body is supplied with heat from a heat generation element that is a heat dissipation target, and a plurality of second refrigerant flow paths connected to the first refrigerant flow path and configured such that a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, is uniformly supplied to the first refrigerant flow path, thereby significantly improving heat dissipation performance.

A modular datacenter has at least one cryogenic datacenter module with server blocks and pipes for providing heat transfer fluid to and from server blocks. At least one cooling generator module is provided that has a pump. Each of the at least one cooling generator module is in fluid communication with the at least one pipe such that a cooled heat transfer fluid is pumped to the at least one server block and a used heat transfer fluid flows back to the at least one cooling generator module. The used heat transfer fluid is cooled within the at least one cooling generator module. A power source is provided in communication with a power input on server boards within the server blocks and the cooling generator module.