A cryogenic system configured to cool down components and including a housing and a thermal coupling system able to thermally connect a cryogenic fluid tank and the housing, the housing being airtight and being arranged to contain at least one component. The cryogenic system includes: an inert fluid tank, the inert fluid including at least one of the inert gas or nitrogen; a first opening connected to the inert fluid tank; a second opening connected to a relief valve configured to release gas from the housing when the pressure inside the housing exceeds a predefined pressure value; a third opening connected to an exhaust line, and a shut-off valve disposed on the exhaust line. The component is thus thermally and chemically isolated from the outside of the housing without using vacuum.

Examples described in this disclosure relate to waste cold recuperation in fuel cell based power generation systems for datacenters. An example waste cold recuperation system includes a liquefied gas storage for supplying liquefied gas as a coolant to cool a first set of compute resources configurable to operate in a first cryogenic environment. The system is configurable to supply at least some of the vapor phase of the liquefied gas as a coolant to cool a second set of compute resources configurable to operate in a second cryogenic environment, resulting in the at least some of the vapor phase of the liquefied gas becoming a super-heated vapor phase of the liquefied gas. The system is configurable to supply the super-heated vapor phase of the liquefied gas as fuel to fuel cells for providing electrical power to a datacenter load including compute resources configurable to operate in a non-cryogenic environment.

A sample cell is provided for holding a sample to be placed in a cryogenically cooled environment. The sample cell comprises an airtight, openable and closable enclosure. Within said enclosure is a sample base for receiving the sample. A refrigerator attachment is provided for attaching the sample cell to a refrigerated body of a cryogenically cooled environment. The sample cell comprises a thermal connection between the sample base and the refrigerator attachment. One or more airtight connectors are provided for establishing electric connections between inside and outside of said enclosure.

A semiconductor device according to an embodiment includes: a chamber including an internal structure capable of holding a pressure in the chamber lower than atmospheric pressure; one or a plurality of cooling member provided inside of the internal structure of the chamber, the cooling member holding and cooling a semiconductor device; and a heat transfer part exchanging heat with a refrigerator cooling the cooling member.

A distributed refrigeration system is provided. The distributed refrigeration system comprises a pre-cooling system configured to be thermally coupled to two or more cryogenic devices and to provide a first cooling stage to the two or more cryogenic devices. The two or more cryogenic devices may be two or more of a dilution refrigerator, a low-temperature microscopy system, a .sup.3He refrigeration system, and/or a superconducting CMOS system.

A method for providing cold energy to one or more industrial or commercial facilities from a liquid carbon dioxide receiving facility is provided. The method includes the steps of unloading liquid carbon dioxide to the receiving facility, storing liquid carbon dioxide in temporary storage, generating boil-off gas from the temporary storage due to heat ingress, pumping and heating liquid carbon dioxide for external use or permanent geologic storage, and utilizing at least some, and preferably substantially all, of the cold energy from the liquid carbon dioxide for cooling one or more processes in the one or more industrial or commercial facilities.

In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.

An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal energy transfer device. At least one second temperature cooling manifold is in selective fluid communication with at least one second operating temperature thermal energy transfer device. A plurality of manifold interfaces is provided, each manifold interface being in fluid communication with a corresponding thermal energy transfer device. A housing includes first and second operating fluid inlets in fluid communication with first and second operating fluid outlets, respectively.

A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin. Each of the superconducting components may be configured to provide primarily a processor functionality and each of the non-superconducting components may be configured to provide primarily a storage functionality.

A cryogenic platform includes a motor, a computer processor, and a vacuum chamber with a high temperature stage and a low temperature stage. The motor is attached to a cryocooler. The computer processor is connected via one or more connections through one or more feedthrough ports to one or more electronic devices. The vacuum chamber encloses the high temperature stage and the low temperature stage, where the high temperature stage and low temperature stage are attached to the motor via a temperature stage attachment.