A computing system includes a housing, processing circuitry, one or more additional components, and a cryogen evaporator plate. The housing includes a cryogen input port, a cryogen output port, and an interior chamber. The processing circuitry and the one or more additional components are in the interior chamber of the housing. The cryogen evaporator plate is thermally coupled to the processing circuitry and configured to receive a cryogen via the cryogen input port, cool the processing circuitry using the cryogen such that the cryogen is evaporated during the cooling of the processing circuitry to provide evaporated cryogen, and provide the evaporated cryogen into the interior chamber of the housing such that the evaporated cryogen is distributed over the one or more additional components to cool the one or more additional components.

An electrical assembly includes an electrical connector mounted upon a PCB and receiving a CPU therein, and a liquid Nitrogen heat dissipation device is mounted upon the PCB and intimately seated upon the CPU to remove the heat therefrom. The liquid Nitrogen heat dissipation device includes a case forming a chamber to receive the liquid Nitrogen therein. A plurality of fixing arms extend outwardly and radially to fix the liquid Nitrogent heat dissipation device in position. A fixing seat is attached upon the PCB to precisely located the CPU in position with regard to the electrical connector.

Superconducting computing system housed in a liquid hydrogen environment and related aspects are described. An example superconducting computing system includes a housing, arranged inside a liquid hydrogen environment, where a lower pressure is maintained inside the housing than a pressure outside the housing. The superconducting computing system further includes a substrate, arranged inside the housing, having a surface, where a plurality of components attached to the surface is configured to provide at least one of a computing or a storage functionality, and the substrate further comprises a plurality of circuit traces for interconnecting at least a subset of the plurality of the components. The housing is configured such that each of the plurality of components is configured to operate at a first temperature, where the first temperature is below 4.2 Kelvin, despite the liquid hydrogen environment having a second temperature greater than 4.2 Kelvin.

A device can include a first circuit configured to be exposed to a first environment, the first circuit comprising one or more first transfer inductors, and a second circuit isolated from the first circuit and configured to be exposed to a second environment, the second circuit comprising one or more second transfer inductors. The second environment can be a harsh environment. The first circuit and the second circuit can be wirelessly coupled via the one or more first transfer inductors and the one or more second transfer inductors to allow transfer of power and/or signals between the first circuit and the second circuit.

The embodiments herein describe technologies of cryogenic digital systems with a first component located in a first non-cryogenic temperature domain, a second component located in a second temperature domain that is lower in temperature than the first cryogenic temperature domain, and a third component located in a cryogenic temperature domain that is lower in temperature than the second cryogenic temperature domain.

A pump drive device includes a box body and at least one drive pump. A liquid-phase zone module is arranged in the box body, and the drive pump is arranged in the liquid-phase zone module. A pump drive device liquid inlet, a pump drive device liquid outlet, a liquid supply port, and an exhaust port are arranged on the box body and are located outside the liquid-phase zone module. The drive pump is connected to the pump drive device liquid outlet through a delivery pipe. The pump drive device has a simple structure and a reasonable design. The pump drive device integrates driving, pressure stabilization, exhaust, cavitation prevention, liquid-level monitoring and warning, pressure monitoring and warning, temperature monitoring and warning, medium purification, and other functions, which achieves an integration, miniaturization, and lightweight design, well matches the application of liquid cooling system products in various industries.

An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

A method, system, and arrangement for resetting qubits are disclosed. An example system includes one or more quantum circuit refrigerators for resetting qubits. Each of the quantum circuit refrigerators includes a tunneling junction and a control input for receiving a control signal. Photon-assisted single-electron tunneling takes place across the respective tunneling junction in response to a control signal. Capacitive or inductive coupling elements between the qubits and the quantum circuit refrigerators couple each qubit to the quantum circuit refrigerator(s). The qubits, quantum circuit refrigerators, and coupling elements are located in a cryogenically cooled environment. A common control signal line to the control inputs crosses into the cryogenically cooled environment from a room temperature environment.

A cryostat is provided for housing for a superconducting wired circuit. The cryostat has a dividing partition (10) delimiting two internal spaces; a first and a second opening situated one on each side of the dividing partition and each configured to fix one end of a cryogenic jacket surrounding at least one superconducting wire (21a) and to allow the superconducting wire to pass into the internal spaces. A third outlet opening is provided for a cooling fluid circulating in the cryogenic jacket fixed to the first opening. A fourth inlet opening is for a cooling fluid circulating in the cryogenic jacket fixed to the second opening. The dividing partition (10) incorporates a cavity forming a partition feedthrough (T) allowing the superconducting wire to pass through and sealed against the cooling fluids by the injection, once the wire has been fed through, of an electrically insulating material (17) in polymerizable liquid form, via an access opening (16) providing access to said cavity.

Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.