A powertrain system of an aircraft includes one or more electrical components to provide electrical power to one or more electrical loads of the aircraft. The system further includes a rechargeable cryogenic heat sink containing a volume of cryogenic cooling material. The cryogenic heat sink is configured to cool the one or more electrical components. A method of operating a powertrain system of an aircraft includes generating thermal energy at one or more electrical components of the powertrain system, fluidly connecting a cryogenic heat sink to the one or more electrical components, and cooling the one or more electrical components via a volume of cryogenic cooling material of the cryogenic heat sink.

Separating temperature domains in cooled systems, including: cooling at least one first component of a circuit board using a first cooling system; and conductively coupling the at least one first component to at least one second component using a superconductive portion of a power plane of the circuit board.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

A dilution refrigerator is provided. The dilution refrigerator includes an outer vacuum chamber comprising at least one substantially planar surface and an opening in the at least one substantially planar surface configured to provide access to an interior of the outer vacuum chamber.

A dilution refrigerator is provided. The dilution refrigerator includes a first thermal stage configured to be cooled to a first temperature, a second thermal stage configured to be cooled to a second temperature lower than the first temperature, and a vacuum chamber housing the first thermal stage and the second thermal stage. The dilution refrigerator also includes a first suspension system configured to suspend the first thermal stage from the vacuum chamber, and a second suspension system configured to suspend the second thermal stage from the vacuum chamber independently from the first thermal stage.

A distributed refrigeration system is provided. The distributed refrigeration system comprises a pre-cooling system configured to be thermally coupled to two or more cryogenic devices and to provide a first cooling stage to the two or more cryogenic devices. The two or more cryogenic devices may be two or more of a dilution refrigerator, a low-temperature microscopy system, a .sup.3He refrigeration system, and/or a superconducting CMOS system.

A dilution refrigerator is provided. The dilution refrigerator includes a plurality of thermal stages configured to be cooled to a plurality of temperatures. A coldest thermal stage of the plurality of thermal stages is disposed above warmer thermal stages of the plurality of thermal stages such that the coldest thermal stage is positioned furthest from a floor supporting the dilution refrigerator.

Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

A system includes a heat exchanger mounted to the brackets and receiving cryogen, the heat exchanger having a vertical inlet coupled in parallel to a plurality of equal size horizontal tubes each traversing a width of the heat exchanger and further coupled in parallel to a vertical outlet pipe with an outlet diameter at least twice an inlet tube diameter; a temperature sensor; a thermostat that monitors the temperature sensor and maintains a predetermined temperature set point by communicating with a solenoid valve coupled to the heat exchanger; an exhaust line coupled to the outlet pipe that expels exhaust gas outside the enclosed facility; multiple fans attached to the heat exchanger; and a fail-safe oxygen sensor to protect a biological object in the enclosed facility.