Disclosed is a cooling assembly for circuit boards. In one embodiment, the assembly includes a circuit board that is thermally and physically coupled to a heat spreader by a thermal interface. In one configuration, the circuit board is formed from a semiconductor material and includes a first board surface on which integrated circuits are mounted and a second board surface opposite the first board surface. The heat spreader is formed from a thermally conductive material and includes a plurality of vanes that are spaced apart from one another. The thermal interface is coupled between at least one area of the second board surface of the circuit board and a contact area of each of the plurality of vanes. Heat generated by the integrated circuits is conducted from at least one integrated circuit to the plurality of vanes of the heat spreader through the circuit board and the thermal interface.

Devices, systems, methods, and computer-implemented methods to facilitate transmitting microwave signals to one or more cryogenic stages of a cryogenic refrigerator are provided. According to an embodiment, a device can comprise a monolithic signal carrier device comprising a thermal barrier disposed within a ground layer and a signal layer. The device can further comprise a thermal decoupling device coupled at the thermal barrier to the ground layer and the signal layer.

An embodiment of a qubit tuning device includes a first layer configured to generate a magnetic field, the first layer comprising a material exhibiting superconductivity in a cryogenic temperature range. In an embodiment, the qubit tuning device includes a qubit of a quantum processor chip, wherein the first layer is configured to magnetically interact with the qubit such that a first magnetic flux of the first layer causes a first change in a first resonance frequency of the qubit by a first frequency shift value.

An embodiment of a method for qubit tuning includes generating a first magnetic field through a portion of a first layer, the first layer comprising a material exhibiting superconductivity in a cryogenic temperature range, the portion of the first layer above a critical temperature. In an embodiment, the method includes cooling the portion of the first layer at least to the critical temperature. In an embodiment, the method includes generating, in response to cooling the portion of the first layer at least to the critical temperature, a second magnetic field to magnetically interact with a qubit of a quantum processor chip such that a first magnetic flux of the first layer causes a first change in a first resonance frequency of the qubit by a first frequency shift value.

A data center includes a refrigerant induction pipe surrounding one or more regions of the data center, a refrigerant supply device suitable for supplying a refrigerant to the refrigerant induction pipe, the refrigerant having a vaporization temperature corresponding to a pseudo cryogenic temperature, a plurality of racks disposed in the one or more regions, and a plurality of rotating devices, each rotating device being suitable for rotating a corresponding one of the plurality of racks.

An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.

Disclosed is a cooling assembly for circuit boards. In one embodiment, the assembly includes a circuit board that is thermally and physically coupled to a heat spreader by a thermal interface. In one configuration, the circuit board is formed from a semiconductor material and includes a first board surface on which integrated circuits are mounted and a second board surface opposite the first board surface. The heat spreader is formed from a thermally conductive material and includes a plurality of vanes that are spaced apart from one another. The thermal interface is coupled between at least one area of the second board surface of the circuit board and a contact area of each of the plurality of vanes. Heat generated by the integrated circuits is conducted from at least one integrated circuit to the plurality of vanes of the heat spreader through the circuit board and the thermal interface.

An electrical assembly includes an electrical connector mounted upon a PCB and receiving a CPU therein, and a liquid Nitrogen heat dissipation device is mounted upon the PCB and intimately seated upon the CPU to remove the heat therefrom. The liquid Nitrogen heat dissipation device includes a case forming a chamber to receive the liquid Nitrogen therein. A plurality of fixing arms extend outwardly and radially to fix the liquid Nitrogent heat dissipation device in position. A fixing seat is attached upon the PCB to precisely located the CPU in position with regard to the electrical connector

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

An architecture for, and techniques for fabricating, a cryogenic microwave filter having reduced Kapitza resistance are provided. In some embodiments, the cryogenic microwave filter can comprise a substrate and a conductive line. The substrate can be formed of a material having a thermal conductivity property that sufficiently reduces Kapitza resistance in the cryogenic environment. The conductive line can be formed in a recess of the substrate and facilitate a filter operation on a microwave signal propagated in a cryogenic environment. In some embodiments, the conductive line can be formed according to a sintering technique that can reduce Kapitza resistance.