Patent classifications
H05K7/20381
HEAT EXCHANGE SYSTEM USED FOR HEAT DISSIPATION OF ELECTRONIC CONTROL ASSEMBLY AND COMPUTER HOST
A heat exchange system for heat dissipation of an electronic control assembly includes: a first heat exchange portion including a first end having a first communication port and a second end having a second communication port; a second heat exchange portion including a first end having a third communication port and a second end having a fourth communication port, and at least a part of the second heat exchange portion being configured to be in contact with the electronic control assembly; a first connection tube communicating the first communication port with the third communication port; and a second connection tube communicating the second communication port with the fourth communication port. The first and second heat exchange portions and the first and second connection tubes constitute a loop, the loop has an opening, and the opening is closed when the heat exchange system is in an operative state.
MULTI-TIER COOLING SYSTEM WITHOUT LOAD PERCEPTION
The disclosed embodiments provide a cooling system with an auxiliary system that extends a main system. The auxiliary system includes a vapor container that receives vapor from the IT load, an auxiliary condenser that receives vapor from the vapor container via a compressor or a vapor valve, and condenses the vapor into liquid to be stored in a liquid container. The auxiliary system further includes a fluid pump on a cooling loop for cooling the auxiliary condenser, and a cooling controller that includes a machine learning model for regulating operations of the vapor valve, the fluid pump, and the first compressor based on a pre-created profile of the IT load and real-time information from at least one of many sources, including the vapor container and the liquid container. The auxiliary system includes multiple cooling tiers that can be partially trigger or completely trigger based on several indicators collected multiple sensors in the auxiliary system.
LIQUID IMMERSION COOLING PLATFORM AND COMPONENTS THEREOF
- John David Enright ,
- Raquel Parker ,
- Darshan Patell ,
- Randall Coburn ,
- Josh Haley ,
- Ryan Graham ,
- Jason Erickson ,
- Jacob Mertel ,
- Taylor Monnig ,
- Brian Haught ,
- Ryan Myre ,
- William Bret Boren ,
- Andrew Downs ,
- Dustin Yeatman ,
- Edward King ,
- Rick Margerison ,
- Jimil M. Shah ,
- William Hadala ,
- Josh Whitaker ,
- Seamus Egan ,
- Brad Furnish ,
- Tim Tomlin
An immersion cooling system and methods for operating the system are described. The system can comprise a vessel configured to hold thermally conductive, condensable dielectric fluid; a pressure controller to reduce or increase an interior pressure of the vessel; a computer component configured to be at least partially submerged within the dielectric fluid; and a fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter and deliver the dielectric fluid to a bath area of the vessel.
Method and system for in-situ measuring of a heat transfer fluid in a device for immersion cooling and device for immersion cooling
A method and system for controlling operation of an immersion cooling system having an immersion cooling tank adapted to contain a heat transfer fluid used to immersion cool a heat-generating object contained therein, the method including: sampling a volume of the heat transfer fluid while the object remains in an operating state; measuring at least one property or parameter of the sampled heat transfer fluid; generating and transmitting measurement data to a control unit; comparing measurement data with respective threshold data using the control unit; and controlling operation of the immersion cooling system with the control unit based on the comparison.
HEAT PIPE DRYOUT PREVENTION
Methods, apparatus, systems, and articles of manufacture are disclosed that prevent heat pipe dryout. An example apparatus includes processor circuitry to at least one of instantiate or execute machine readable instructions to: determine if a temperature of a heat pipe of an electronic device is below a first threshold temperature; cause a program to switch from a first operating mode to a second operating mode when the temperature is below the first threshold temperature, the second operating mode to use more processor circuitry bandwidth than the first operating mode; determine at least one of (1) an occurrence of an increase in a power level of the electronic device or (2) the temperature of the heat pipe satisfies a second threshold temperature; and cause the program to switch from the second operating mode to the first operating mode based on at least one of (1) the occurrence of the increase in the power level or (2) the temperature of the heat pipe satisfying the second threshold temperature.
COOLING SYSTEM, AIR REMOVAL ATTACHMENT, AIR REMOVAL METHOD, AND STORAGE MEDIUM
The present invention provides an attachment for a server rack cooling system having at least one heat exchange condenser, the attachment includes: a pipe extension configured to connect to a portion of the server rack cooling system at which air and refrigerant are able to be transferred into the attachment from the at least one heat exchange condenser; a valve on the pipe extension configured to allow exhaust to the outside through the pipe extension at an open position and to block exhaust to the outside at a closed position; and an sensor disposed at a position inside of the pipe extension between the at least one heat exchange condenser and the valve and configured to provide a detection signal determined by a presence of fluid at the position of the sensor; wherein, the valve is opened and closed based on the detection signal from the sensor.
TWO PHASE CONTAINMENT SYSTEM HAVING CONTROLLED AIR FLOW
A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with phase change liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the two phase liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. An air mover generates pressure differential within the containment passageway to direct the vapor towards the condenser.
IMMERSION COOLING SYSTEM THAT ENABLES INCREASED HEAT FLUX AT HEAT-GENERATING COMPONENTS OF COMPUTING DEVICES
An immersion cooling system includes an immersion tank that is configured to retain dielectric working fluid and to hold a plurality of computing devices submerged in the dielectric working fluid. The immersion cooling system also includes a condenser that is configured to cause condensation of vaporized working fluid. The immersion cooling system also includes a subcooling heat exchanger that is in fluid communication with a coolant source. The coolant source provides coolant having a coolant temperature that is lower than a boiling point of the dielectric working fluid. The subcooling heat exchanger is positioned so that heat transfer can occur between the dielectric working fluid and the subcooling heat exchanger. The immersion cooling system also includes a control system that controls how much of the coolant flows into the subcooling heat exchanger based at least in part on a temperature of the dielectric working fluid.
System and method for service life management based on condensation removal
A method for environmentally managing a computing device of an information handling system includes monitoring an environmental corrosion risk associated with a component of the computing device, a corrosion management component that reduces a rate of corrosion of the component due to an ambient environment in which the component resides by removing condensation from the component is associated with the component; making a determination that the component is associated with the corrosion management component; in response to the determination: estimating a corrosion risk of the component based on: the environmental corrosion risk, and a risk reduction factor associated with the corrosion management component; making a second determination that the corrosion risk of the component indicates a premature failure of the component; and remediating, in response to the second determination, the corrosion risk of the component.
Data Center Information Technololgy Cluster Design
A data center and a data center cluster have plurality of immersion cooling systems and a plurality of coolant units that provide two-phase coolant to one or more of the plurality of immersion cooling systems. Each coolant unit dispatches and manages two-phase coolant to two or more of the plurality of immersion cooling systems. The coolant units can fill or empty an immersion tank of an immersion cooling system, and can empty or fill a coolant tank in the coolant unit. A single-phase cooling fluid cools the vapor phase of the two-phase coolant in each immersion cooling system. The coolant units are modular, with a common interface to other coolant units and to immersion cooling systems to create a scalable cooling system and data center.