Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate is coupled to a condenser section of a heat pipe and to a primary computing device, with the heat pipe coupled to an auxiliary computing device at an evaporator section of the heat pipe, so that the cold plate draws heat from the primary computing device and from the heat pipe.

A system and method for controlling a cooling system for an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes an evaporator to remove heat from at least one computing device using a two-phase fluid and using a buffer to perform flow stabilization represented by different volumes or different flow rates of a two-phase fluid that is enabled to flow between an evaporator and a condensing or compressor unit located external to a cold plate.

A fluid phase change thermal management cooling method and apparatus for removing heat from a source of heat, the method comprising the steps of: filling a cooling chamber with volume V1 of a fluid phase change thermal management cooling apparatus with a fluid in its liquid phase; increasing the volume of the cooling chamber to volume V2 to va-pourise a portion of the fluid from its liquid phase to its vapour phase such that there is substantially only the fluid in its liquid phase and fluid in its vapour phase within the volume V2; allowing a dwell time that provides for at least some of the fluid in its liquid phase that has contact with a heated surface of the cooling chamber to be vaporised; and repeating the steps where timing of the steps and dwell time between steps is selected to control heat build-up within selected limits.

A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

An immersion cooling system includes an immersion tank, a first fluid reservoir, a second fluid reservoir, and a mixing device. The first fluid reservoir contains a first working fluid having a first boiling temperature. The second fluid reservoir contains a second working fluid having a second boiling temperature. The mixing device mixes at least a portion of the first working fluid and at least a portion of the second working fluid into a mixed working fluid, and the mixing device directs the mixed working fluid to the immersion tank.

Embodiments are disclosed of a cooling device. The cooling device includes a housing enclosing an internal volume, the housing having at least a heat transfer contact surface adapted to be thermally coupled to a heat-generating electronic component. A partition is positioned in the internal volume; the partition divides the internal volume into a liquid compartment and a vapor compartment, and the partition has a gap therein to allow fluid movement between the liquid compartment and the vapor compartment. A liquid inlet is fluidly coupled to the liquid compartment; a liquid outlet is fluidly coupled to the vapor compartment; and a vapor outlet is fluidly coupled to with the vapor compartment. Embodiments of cooling systems including design and operation using the cooling device are also disclosed.

Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.

The disclosure relates to the technical field of thermal management of a battery charging and swap station, and in particular to a battery charging and swap station, a thermal management system therefor, a control method for a thermal management system, a control device, and a computer-readable storage medium. The thermal management system includes: a heat pump unit including a compressor, a condenser, a throttling component, and an evaporator which form a refrigerant circulation circuit; a first liquid cooling unit including a charging module and the evaporator which form a first coolant circulation circuit; a second liquid cooling unit including a traction battery portion and the evaporator which form a second coolant circulation circuit; and a third liquid cooling unit including a charging terminal and the evaporator which form a third coolant circulation circuit, where the first and/or the third liquid cooling unit can be in communication with the second liquid cooling unit, so as to transfer heat recovered by the first and/or third liquid cooling unit to the traction battery portion. With such a configuration, a thermal management of the battery charging and swap station can be realized through liquid cooling.