The disclosed embodiments provide a cooling system with an auxiliary system that extends a main system. The auxiliary system includes a vapor container that receives vapor from the IT load, an auxiliary condenser that receives vapor from the vapor container via a compressor or a vapor valve, and condenses the vapor into liquid to be stored in a liquid container. The auxiliary system further includes a fluid pump on a cooling loop for cooling the auxiliary condenser, and a cooling controller that includes a machine learning model for regulating operations of the vapor valve, the fluid pump, and the first compressor based on a pre-created profile of the IT load and real-time information from at least one of many sources, including the vapor container and the liquid container. The auxiliary system includes multiple cooling tiers that can be partially trigger or completely trigger based on several indicators collected multiple sensors in the auxiliary system.

An apparatus for cooling a plurality of rack-mountable servers containing heat generating electronic components in a server room including a dielectric liquid cooling apparatus located inside the tank and a secondary cooling apparatus comprising a remote heat exchanger and at least one pump. The volume of dielectric liquid coolant comprises at least one passage in the tank that is outside of the vertically oriented rack-mountable servers. When the at least one pump is operated to move the dielectric liquid coolant vertically across the heat producing components on the vertically oriented servers, a circuit is formed in which a first portion of dielectric liquid coolant is moved vertically upward across the heat producing components on the vertically oriented servers and then downward outside of the rack mountable servers in the at least one passage, while a second portion of the dielectric liquid coolant flows out of the tank.

A cooling system can include an input channel from which a fluid enters the cooling system and an output channel from which the fluid exits the cooling system. The cooling system can include a vapor buffer and a liquid buffer, and the connections between the two buffers. Vapor buffer valves arranged in fluid channels of the cooling system can be controlled to, in a first mode, disconnect the vapor buffer from an input channel, and, in a second mode, connect the vapor buffer to the input channel and disconnect the vapor buffer from the input of the condenser or the port that is attachable to the input of the condenser.

A heat dissipating structure includes a cold plate configured to exchange heat with a heat dissipating device; a liquid pipe disposed at both ends of the cold plate, the liquid pipe being configured to transport heat conducting liquid; and a deformation structure configured in the liquid pipe and located at a position corresponding to the cold plate, wherein the deformation structure deforms as an ambient temperature changes. The deformation structure is configured in the heat dissipating structure to manage the flow rate of the heat conducting liquid. The deformation structure deforms at different ambient temperatures. Based on a relationship between the temperature and a deformation coefficient, the flow rate of the heat conducting liquid flowing through the liquid pipe can be controlled for different temperatures. Thus, a desired heat dissipating capacity can be provided to the heat dissipating device to satisfy the needs of users.

In some embodiments, a thermal management system includes an immersion tank defining an immersion chamber, a two-phase working fluid positioned in the immersion chamber, and a pressure trim device in fluid communication with the immersion chamber. The pressure trim device includes at least one of a cold thermal sink and a hot thermal sink. The cold thermal sink is maintained at a suppressed temperature less than a boiling temperature of the two-phase working fluid. The hot thermal sink is maintained at an elevated temperature greater than a boiling temperature of the two-phase working fluid.

According to one embodiment, a sensing system for an immersion cooling system that includes several flow sensors that are coupled to several lines that are coupled together and are arranged to sense flow rates of coolant flowing through their respective lines. The sensing system also includes a controller that is communicatively coupled to the flow sensors and is configured to receive sensor data from the sensors. The first line couples to a first pump that moves liquid coolant into an information technology (IT) enclosure, a second line couples to a second pump that moves coolant drawn from the enclosure into the second line, and the third line couples to a third pump that moves coolant drawn from a coolant source into the third line, the coolant drawn from the first lime is a combination of coolant from at least one of the second and third lines.

The embodiments of the present application provide a cooling system for data center based on a hyperbola cooling tower. The cooling system includes a compressor, a condenser, a primary fluorine pump, a secondary fluorine pump, a throttling apparatus, an evaporator, and a server. The server is configured to receive data information uploaded from the compressor, the condenser, the primary fluorine pump, the secondary fluorine pump, the throttling apparatus, and the evaporator, calculates the operation frequency of the compressor based on the data information, and control the condenser, the primary fluorine pump, the secondary fluorine pump and the throttling apparatus to transport the refrigerant to the evaporator.

Two-phase cooling systems for autonomous driving super computers (ADSC) are described herein. In some examples, a two-phase cooling system can include a flow channel configured to circulate a flow; an evaporative heat exchanger comprising an inlet for receiving fluid from the flow channel and an outlet for releasing vapor generated from the fluid, the evaporative heat exchanger being configured to collect heat from components of the ADSC and transfer the heat away via the vapor released from the first outlet; a condensing heat exchanger configured to condense the vapor and remove latent heat associated with the vapor, the condensing heat exchanger comprising an inlet to the flow channel for receiving the vapor and an outlet to the flow channel for discharging fluid generated by condensing the vapor; and a pump configured to receive the fluid from the condensing heat exchanger and circulate the fluid to the evaporative heat exchanger.

A computing device of an information handling system includes a hardware component. The hardware component is also connected to a trace. The computing device also includes a corrosion management component that is physically connected to the trace. The corrosion management component reduces a rate of corrosion of the trace due to an ambient environment in which the trace resides. The corrosion management component reduces the rate of corrosion by applying an electrical potential to the trace.

A method for environmentally managing a computing device of an information handling system includes monitoring an environmental corrosion risk associated with a component of the computing device, a corrosion management component that reduces a rate of corrosion of the component due to an ambient environment in which the component resides by removing condensation from the component is associated with the component; making a determination that the component is associated with the corrosion management component; in response to the determination: estimating a corrosion risk of the component based on: the environmental corrosion risk, and a risk reduction factor associated with the corrosion management component; making a second determination that the corrosion risk of the component indicates a premature failure of the component; and remediating, in response to the second determination, the corrosion risk of the component.