The disclosed device may include a radio frequency (RF) component and a thermal management component establishing a thermal path with the RF component. The device may also include an RF filter electrically that is coupled to the RF component and arranged away from the thermal path. The device may further include a chassis for housing the RF component. The thermal management component and the RF filter may be positioned near an exterior of the chassis. Various other devices, apparatuses, and systems are also disclosed.

A modular electronic device is formed from a plurality of stackable hexagonal or rectangular-shaped modules. Each module is locked to another adjacent unit with an indented groove inserted through their sidewalls. Each hexagonal or rectangular module can be made of one or four extrusion elements which then can be stacked in a honeycomb or brick wall configuration.

A thermally conductive band can improve the flow of heat from a first portion of a mobile computing device (e.g., the base portion of a laptop computer) to a second portion of the mobile computing device (e.g., the lid portion of the laptop). The band is removably attachable to the mobile computing device via magnets or another attachment approach. The band comprises a thermally conductive layer, a first end removably attachable to an external surface of the first device portion, and a second end removably attachable to an external surface of the second device portion. The band can comprise thermal gap pads between the thermally conductive layer and the external surfaces to aid in providing a low thermal resistance path between the device and the band.

An electronics system for an aircraft includes a mounting structure and a plate element mounted to the mounting structure with opposing face surfaces, a central region and side edge regions. A serpentine passage in the plate element contains alternating liquid slugs and vapor plugs along its length. The plate element is configured for gathering heat proximate the central region and moving the heat to the side edge regions. An electronic system is mounted on a face surface of the plate element and a heat dissipating structure is thermally coupled with the plate element and positioned along the side edge regions thereof for dissipating heat moved to the side edge regions. A cover structure covers the plate element and electronic system.

Embodiments disclosed herein include a high-frequency emission module. In an embodiment, the high-frequency emission module comprises a solid state high-frequency power source, an applicator for propagating high-frequency electromagnetic radiation from the power source, and a thermal break coupled between the power source and the applicator. In an embodiment, the thermal break comprises a substrate, a trace on the substrate, and a ground plane.

A motor controller is disclosed. The motor controller according to one embodiment of the present invention comprises a first electronic control unit which comprises a first substrate and a first connector having a first identification member and coupled to the first substrate and controls a motor, a second electronic control unit which comprises a second substrate and a second connector having a second identification member different from the first identification member and coupled to the second substrate and controls the motor, and a first heat radiation member of which one surface is coupled to the first electronic control unit and the other surface is coupled to the second electronic control unit, and which comprises a first interference member formed at a position at which the first interference member is not interfered with by the first identification member but is interfered with by the second identification member such that the one surface is not coupled to the second electronic control unit and has a plate shape.

A general purpose enclosure is provided. A general purpose enclosure for housing an internal unit and providing complete protection against an ingress of dust and water, comprising a first housing and a second housing. A plurality of cooling fins and one or more pressure ports along an exterior surface of the first housing and the second housing. One or more pressure ports comprising a pneumatic valve, pressure sensor cap and a vent membrane such that pressure venting, and pressure testing may be performed by the one or more pressure ports. A method of assembling a general purpose enclosure to an internal unit, comprising applying the first housing and the second housing to the internal unit such that the first housing and the second housing encompass the internal unit and fastening the first housing to the second house.

The present utility model relates to the technical field of heat dissipation devices, and in particular to an adjustable heat exchanger. The adjustable heat exchanger includes a fan assembly, a heatsink assembly, a semiconductor chilling plate and a conduction cooling unit connected in sequence, the conduction cooling unit includes a main conduction cooling plate and a conduction cooling fin, and the conduction cooling fin includes at least one conduction cooling sub-fin. The main conduction cooling plate is connected to the semiconductor chilling plate, the conduction cooling fin is movably connected to an outer peripheral wall of the main conduction cooling plate, the conduction cooling fin extends outward along the center of the main conduction cooling plate, and the conduction cooling fin and the main conduction cooling plate jointly form a contact surface for adapting to a heat-dispersing surface. The heat exchanger of the present utility model can adapt to hot surfaces with different curved surface radians, and form a surrounded fixed structure with the hot surface, thereby making the conduction cooling unit well contact surfaces with different radians.

Disclosed is thermal management device that combines a vapor chamber with a mechanical heat sink to provide improved cooling performance under extreme conditions—the vapor chamber and heat sink combination comprises a single-unit device where the vapor chamber side of the device is in direct contact with the heat source and the opposite side of the vapor chamber is equipped with cooling fins that mate with cooperatively sized fins on the heat sink portion of the device.

An inverter assembly for a motor vehicle includes a housing with an inlet end for receiving a flow of coolant and an outlet end for discharging the flow of coolant. The assembly further includes a first plurality of power transistors conducting and switching an electrical current and generating a first amount of heat. The assembly further includes a second plurality of power transistors conducting and switching the electrical current and generating a second amount of heat that is less than the first amount of heat. A heat sink includes a plate with a first section adjacent to the first plurality of power transistors and a second section adjacent to the second plurality of power transistors. The heat sink further includes a first plurality of fins for drawing the first amount of heat from the first section and a guide vane directing the flow of coolant toward the first plurality of fins.