A connector assembly includes a receptacle connector, a shielding cage, a heat sink and a clip. The shielding cage covers the receptacle connector. The clip assembles the heat sink to the shielding cage, is integrally formed by a metal sheet and includes a fixed plate, a movable plate and a plate spring. The fixed plate is provided to the shielding cage, and the movable plate is provided to a side surface of the heat sink. Two ends of the plate spring are respectively connected to the fixed plate and the movable plate, and the movable plate is capable of moving relative to the fixed plate by means of the plate spring.

According to one embodiment, a semiconductor storage device includes a housing, a first board, a heat generating component, an electronic component, and a thermal-conductive sheet. The housing has a first vent hole. The first board is accommodated in the housing. The heat generating component is mounted on the first board. The electronic component is disposed between the heat generating component and the first vent hole. The thermal-conductive sheet is provided to extend over the heat generating component and the electronic component, or provided to extend from a region positioned on a rear side of the heat generating component on the first board to the electronic component.

A portable electronic device including a first body, a second body, a heat source, a first heat pipe, a second heat pipe, and a heat conducting element is provided. The second body is pivotally connected to the first body. The heat source is disposed in the first body and thermally coupled to the heat source. The second heat pipe is disposed in the first body and thermally coupled to the first heat pipe. The heat conducting element is connected to and thermally coupled to the second body, and the heat conducting element slidably contacts the second heat pipe and is thermally coupled to the second heat pipe.

An inverter for a photovoltaic system includes a substantially planar baseplate having a front and a rear, wherein the rear forms an outer rear wall of the inverter, and having at least one platform-like elevation that rises in the direction of the front of the baseplate. The inverter also includes a printed circuit board having one or more heat-generating components mounted thereon, wherein the printed circuit board is installed on the baseplate such that the one or more heat-generating components are arranged on the printed circuit board in the region of the platform-like elevation and are in thermal contact with the platform-like elevation. The inverter further includes a potting compound that fills a space on the front of the baseplate and surrounds at least partially the printed circuit board, and a cover arranged on or in the potting compound that adjoins the baseplate, so that the baseplate and the cover surrounding at least part of the potting compound form a housing. The inverter also includes at least four DC connectors that are arranged in pairs on at least one of the lateral end faces of the housing and at least part of which is cast in the potting compound, and an AC connector that is arranged on one of the lateral end faces of the housing, wherein electrical contacts of the AC connector are connected to the printed circuit board.

This document describes a cooling device for cooling a heatsink having a plurality of cooling fins provided on a heatsink base. The cooling device includes a centrifugal fan having a fan inlet and a fan outlet, a support for mounting the fan above the heatsink, and a baffle locatable between the support and the heatsink base. The baffle defines an inlet pathway for feeding air between the cooling fins over the heatsink base to the fan inlet and an outlet pathway for expelling air from the fan outlet.

An electronic assembly 52 includes a plurality of circuit boards 70, 74, 78 each comprising engagement grooves 84 spaced around an outer wall. The assembly includes a plurality of spacers 72, 76 with alignment elements. The alignment elements comprise a first tab 92 and a first tab receiver 93 extending in a first axial direction. The alignment elements further comprising a second tab 90 extending in a second axial direction opposite the first and a second tab receiver 91 extending in the second axial direction. A first spacer 72 is disposed between a first circuit board 70 and a second circuit board 74. The first tab 92 of the first spacer 72 is disposed within a first engagement groove of the first circuit board 70. The second circuit board 74 is disposed between the first spacer 72 and a second spacer 76. A second tab 90 of the first spacer 72 is received in a second engagement groove 84 of the second circuit board 74 and a first tab receiver 93 of the second spacer 76.

An electronic control device includes a board including a heat sink on which a heat generation element is mounted, and a housing that is in contact with the board and dissipates heat of the heat generation element to the outside. A potential of the housing is a ground, and a potential of the heat sink is a non-ground. The board includes a first layer including a first non-ground wiring that is in direct contact with the heat sink, and a second layer including a second ground wiring that is in electrical and thermal contact with the housing. The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board.

A charging connector for an electrical vehicle has a connector base, a tubular first conductive terminal mounted in the connector base, an insulating isolation member mounted in the first conductive terminal, and a second conductive terminal mounted in a center of the isolation member and coaxially disposed in and electrically isolated from the first conductive terminal. The isolation member has at least one annular groove recessed in an upper surface of the isolation member, extending downwardly, and coaxially surrounding the second conductive terminal. A creepage distance between the first conductive terminal and the second conductive terminal is increased and a surface area for heat dissipation is increased to meet safety specifications.

Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. An apparatus may have a printed circuit board (PCB) having an edge connector. At least one integrated circuit device may be disposed on a surface of the PCB. A tubular heat spreader may be disposed along an edge of the PCB opposite the edge connector.

A heat radiating device includes a plurality of heat pipes including respective heat receiving portions that are located above an integrated circuit and that are thermally connected to the integrated circuit, and a heat sink connected to the plurality of heat pipes. A plurality of the heat receiving portions are aligned with each other in a left-right direction and are in contact with the heat receiving portions (73a) of adjacent ones of the heat pipes. The heat receiving portions each have a first width in an upward-downward direction and have a second width smaller than the width in the left-right direction. With this, cooling performance for the integrated circuit can be improved.