A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section.

An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.

Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an inner surface. A portion of the inner surface of the housing has a first emissivity. The computing device also includes a thermal management device positioned within the housing, at a distance from the portion of the inner surface of the housing. The thermal management device includes an outer surface. The outer surface of the thermal management device includes a first portion and a second portion. The first portion of the outer surface of the thermal management device has a second emissivity, and the second portion of the outer surface of the thermal management device has a third emissivity. The second emissivity is greater than the third emissivity, and the first emissivity is substantially the same as the second emissivity.

An air-cooling system (10, 110, 210) utilizing a synthetic jet or airflow generator (20, 120, 220) and airflow generators utilizing piezoelectrics (26, 126, 226) to cool heat-emitting elements (12, 112, 212). Actuation of the piezoelectrics (26, 126, 226) results in movement of one or more flexible structures (22, 24, 122, 124, 221) to increase the volume of one or more cavities (28, 30, 32, 128, 228, 230, 232) to draw air in and then decrease the volume of the one or more cavities (28, 30, 32, 128, 228, 230, 232) to push out the drawn in air.

A heat dissipation apparatus is provided, an electronic component is disposed on one side of an adjustable heat dissipation component, and a rotating shaft is disposed on another side of the adjustable heat dissipation component; and one end of a connecting component is connected to the adjustable heat dissipation component, another end of the connecting component is connected to a fixed substrate, and the connecting component drives the adjustable heat dissipation component to rotate by using the rotating shaft. The connecting component may be adjusted to rotate the electronic component together with the adjustable heat dissipation component, to reduce complexity in deploying the electronic component and the heat dissipation apparatus without affecting a heat dissipation effect, thereby improving convenience of operation.

A waterproof electronic equipment unit attached and fixed to a mounted surface having a flat mounting portion and depressed portion is reduced in size by effectively utilizing the depressed portion. A circuit substrate on which is mounted a connector housing is hermetically housed in a frame configured of a base and cover, the base includes a multiple of mounting legs fixed by screwing to a flat mounting portion, a base depressed portion disposed in a mounting surface depressed portion, and an inlet of a water-repellent filter opposing the flat mounting portion across a gap D1, and the connector housing and a high component are disposed in the base depressed portion.

An electronic device includes a cover for one or more heat generating components, with the cover providing at least a combined conductive, convective, and radiant cooling for the heat generating components while maintaining the device within a prescribed temperature range. Conductive cooling is realized by providing thermal coupling between each of two or more depression regions in the cover and one or more heat generating components. Appropriate placement of air inlets and outlets through the cover provides convective cooling of the heat generating components and the thermally coupled depression regions. Heat from the heat generating components thermally coupled to one depression region is effectively isolated from heat generated by other heat generating components thermally coupled to another adjacent depression region at least in part via the air outlets through an interior region between the two adjacent depression regions. Radiant cooling can also be improved by increasing the emissivity of the device cover material.

An insulation rib is provided above a charging circuit and a plurality of heat radiation ribs are provided on the left side of the charging circuit. A space part is formed by the insulation rib. Little of the heat generated by the charging circuit is transferred to an upper sidewall portion of a case main body portion due to a heat insulation effect of the space part. Further, heat generated by the charging circuit is likely to be transferred to a left sidewall portion of the case main body portion due to a high heat dissipation effect of the heat radiation ribs. In this way, the generation of locally heated areas in the case main body portion can be reduced through balancing of the flow of heat generated by the charging circuit.

A cooling device includes: a case that includes a supply port for supplying coolant to an interior of the case and a discharge port for discharging coolant at the interior of the case to an exterior of the case; fins that each have a plate shape, that are arrayed at the interior of the case at separations along a plate thickness direction, and that have coolant flowing between adjacent fins; a maintenance portion that is formed at the fins and that maintains a separation between the adjacent fins; and a restraint portion that is formed at the fins and that restrains relative movement of the adjacent fins being maintained at the separation by the maintenance portion.

A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.