A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.

A low profile semiconductor heat dissipation apparatus utilizing innovative three dimensional flow balancing to achieve both greater thermal efficiency and greater heat dissipation uniformity.

A water-cooled heat dissipation device and an electrical device are provided. The water-cooled heat dissipation device includes a first water-cooled plate and a sealing plate. The first water-cooled plate includes a first water-cooled substrate and multiple first heat dissipation fins arranged on the first water-cooled substrate. The sealing plate includes a sealing plate substrate and multiple second heat dissipation fins arranged on the sealing plate substrate and each arranged between two first heat dissipation fins, and the water-cooled substrate is hermetically matched with the sealing plate substrate to form a water-cooled cavity for accommodating the first heat dissipation fins and the second heat dissipation fins. In the water-cooled heat dissipation device according to the present application, the second heat dissipation fins are provided on the sealing plate substrate, so as to increase the overall heat dissipation area of the water-cooled heat dissipation device.

A cooling device for cooling electronic components comprising a primary electronic component, and one or more secondary electronic components of a circuit board is provided. The cooling device comprises a first cooling component. The first cooling component comprises a first cooling member configured to contact a surface of the primary electronic component. The first cooling member is configured to be in fluid communication with a fluid to effect an operative convection cooling of the surface of the primary electronic component. The cooling device further comprises a second cooling component. The second cooling component comprises a second cooling member configured to contact a respective thermal surface of the one or more secondary electronic components to effect an operative conduction cooling of the one or more secondary electronic components. The second cooling member is thermally coupled to the first cooling member.

A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

A vapor chamber that includes a housing defining an internal space, a first pillar arranged in the internal space of the housing to support the housing from the internal space, a working medium enclosed in the internal space of the housing, and a wick arranged in the internal space of the housing, the wick having a portion of a first main surface thereof supported by the first pillar so as to be spaced from the housing, and a thickness of the wick is partially different along a cross-section thereof.

The present disclosure provides an electrical connector comprising a housing and a radiator. The radiator is disposed on the housing, comprising a fluid flowing space, a fluid input port, and a fluid output port. The fluid input port and the fluid output port are communicating with the fluid flowing space. Fluid flows through the fluid input port to the fluid flowing space. The fluid absorbs the thermal energy generated by a mating connector plugged into the electrical connector. The fluid absorbing the thermal energy generated by the mating connector flows through the fluid output port to external.

Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.

A heat dissipation housing includes an outer casing and the heat conduction block. The heat dissipation housing includes a thickness portion and at least one first tenon extending towards the inner direction of the outer casing from the inner surface of the thickness portion. Heat conduction block includes a base and at least one second tenon extending towards the outer direction of the outer casing from the base. The first tenon and the second tenon are combined, such that the first tenon, the second tenon, and the base together form a column extending towards the inner direction of the outer casing from the inner surface of the thickness portion. The outer casing and the heat conduction block both have a thermal conductivity greater than 0.5 W/m-k.

Systems, methods, and computer-readable media are disclosed for voice activated devices with integrated heatsinks and speakers. In one embodiment, an example device may include a light ring, a first light emitting diode, a heatsink having a first side and a second side, and a speaker assembly coupled to the first side of the heatsink assembly. The heatsink and the speaker assembly together may form a first sealed cavity. The device may include a reflector component coupled to the second side and configured to direct light towards the light ring. The reflector component may optionally include a substantially linear member and a bent member.