Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.

An apparatus is described. The apparatus includes a DIMM cooling assembly. The DIMM cooling assembly includes first and second heat spreaders to be respectively disposed on first and second sides of the DIMM's circuit board. The first and second sides having respective memory chips. The DIMM cooling assembly includes a heat dissipative structure. The DIMM's circuit board is to be disposed between the heat dissipative structure and a printed circuit board that the DIMM is to be plugged into. The DIMM cooling assembly includes fixturing elements to apply compressive forces toward the respective side edges of the DIMM's circuit board to the heat spreaders.

A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.

A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

Systems and methods for controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. A system includes a mounting assembly for a thermal management device. The mounting assembly includes a fastener and a coupler. The system further includes a compression and locking interface configured to lock with the coupler and compress the mounting assembly to a predetermined loading point using a controlled force. The fastener is installed when the mounting assembly is at the predetermined loading point.

A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).

A cooling system comprises a heat sink that bears on an electronic component (120) on a printed circuit board, and a cooling channel for a coolant. The cooling channel has a cavity for the heat sink, and the heat sink is designed to be placed in the cavity based on a distance between the component and the printed circuit board such that the printed circuit board can be placed on the cooling channel at a predetermined spacing thereto, such that the component bears on the heat sink.

An electronic control device (ECU) is provided for an electric power and/or steer by wire steering system (EPS). The ECU includes a printed circuit board (PCB) carrying electronic components, electronic components on a lower side and on an upper side of the PCB, a heat sink element on the lower side of the PCB, and a cover on the upper side of the PCB. At least one cooling track element is provided as an at least partly over-molded insert within the cover in order to conduct heat from at least one electronic component on the upper side of the PCB to the heat sink element on the lower side of the PCB and/or to the air outside of the ECU.

An apparatus includes a cabinet; an air-mover attached to the cabinet; a circuit board mounted in the cabinet; and an air-cooled heat sink attached in thermal contact with a heat-generating component on the circuit board. The heat sink includes a heat sink base; primary heat removal fins protruding from the heat sink base in a direction away from the circuit board; and secondary heat removal fins protruding from the heat sink base in a direction toward the circuit board. The air-mover is configured to force air between the primary heat removal fins and between the secondary heat removal fins.

A metal member-equipped circuit board 21 includes: a printed circuit board 22 including a through hole 25; a metal member 30 including a shaft portion 31 that is inserted into the through hole 25, and a head portion 32 that is arranged outside the through hole 25, the head portion 32 having a diameter larger than a diameter A1 of the through hole 25, and a conductive bonding material 35 for bonding the shaft portion 31 and an inner wall of the through hole 25 to each other.