A heat dissipation structure adapted to dissipate heat from a heat-generating structure includes a heat dissipation unit and a liquid metal layer. The heat dissipation unit includes a heat dissipation body and an anti-corrosion metal layer formed on the heat dissipation body. The liquid metal layer is disposed between the heat-generating structure and the anti-corrosion metal layer, and is opposite to the heat dissipation body. An electronic device that adopts the heat dissipation structure is also disclosed.

The disclosure relates to an electronic component that includes a printed circuit board with two opposite flat sides and a plurality of electronic components, and a base plate. A number of the electronic components are each fixed on and electrically conductively connected to a rear flat side of the printed circuit board and a further number of the electronic components are each fixed on and electrically conductively connected to a front flat side of the printed circuit board. The base plate has at least one first cutout for receiving electronic components that are arranged on the rear flat side of the printed circuit board. The disclosure also relates to a method for producing an electronic component of this kind.

An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.

A circuit board assembly includes a printed circuit board (PCB) substrate, a cooling assembly, an intermediate layer, one or more power devices, and a plurality of conductive layers arranged within the PCB substrate. The PCB substrate has a first surface and an opposite second surface that has a first electrical pattern. The cooling assembly is thermally coupled to the second surface of the PCB substrate. The intermediate layer is sandwiched between the PCB substrate and the cooling assembly. The one or more power devices are embedded within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly. At least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.

A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.

A pluggable electrical connector includes a thermally conductive housing having an opening and a circuit board having electronic components, at least one plug contact and at least one joining surface. The circuit board is surrounded by the housing. A joining seam connects the housing and the circuit board to each other. The joining seam is located between the at least one joining surface and the housing and is produced on an exterior side of the pluggable connector such that the opening is at least partially closed by the joining seam.

To improve a substrate unit in which safety maintaining devices are mounted on a wiring substrate while suppressing manufacturing costs.

A substrate unit includes a wiring substrate, electronic components as safety maintaining devices arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film covering at least one of the plural metal components and the electronic components as the safety maintaining devices on the wiring substrate, in which the resin film has a thermal conductivity of at least 1.0 W/mk and a dielectric breakdown strength of at least 3.0 kV/mm.

An electronic component module assembly includes a printed wiring board, and a stiffener assembly affixed to a first side of the printed wiring board. The stiffener assembly includes an outer stiffener secured to the printed wiring board, an inner stiffener removably located in an opening of the outer stiffener. The inner stiffener has one or more inner stiffener pockets formed therein, and one or more electronic components are installed in one or more inner stiffener pockets, and electrically connected to the printed wiring board.

According to one embodiment, a memory system includes a substrate, a first semiconductor device, a second semiconductor device, and a label. The first semiconductor device is on a first surface side of the substrate. The second semiconductor device is also on the first surface side of the substrate. The label has a first thermal conductive portion proximate to the first semiconductor device, a second thermal conductive portion proximate to the second semiconductor device, and an insulating portion that is between the first and second thermal conductive portions.

A notebook computer cooler using a thermoelectric element includes a housing, a base plate, as an top surface of the housing, having a thermal pad made of a thermally conductive material and on which a notebook computer is seated; a thermoelectric pad disposed in the housing such that a cooling surface thereof is in contact with an inner surface of the thermal pad; a fan disposed on a side opposite the cooling surface of the thermoelectric pad; and a plurality of vent holes penetrated through the base plate and a lower surface of the housing. According to the notebook computer cooler using a thermoelectric element, it is possible to provide an excellent cooling function of the notebook computer by efficiently absorbing the heat of the notebook computer through the thermal pad of a conductive material by using the heat absorption function of the thermoelectric element.