A cooling module comprising a porous media that is at least partially inserted into a coolant channel of a heatsink. Generally the coolant is a liquid, though in some instances it may be a gas. More specific, a cooling module for providing enhanced localized cooling of a heatsink comprising a porous media having a volume and a seal plate connected to the porous media, wherein a portion of the volume of the porous media extends through a wall and/or a heatframe of the heatsink into a coolant channel such that coolant flows through the porous media extending into the coolant channel. The seal plate provides a seal for the wall and/or the heatframe so that the coolant does not flow out the wall and/or the heatframe. The seal plate provides enhanced localized cooling to a heat producing device that is at least in partial contact with the seal plate.

A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.

A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a heat pipe or a heat sink configured to receive heat from a component that generates heat. The heat dissipation structure is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.

An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards, each including first and second subassemblies. Each of the subassemblies is surrounded in a longitudinal-lateral plane by a corresponding first or second perimeter frame. The first and second subassemblies have first and second operating temperatures, respectively. A first temperature tank is formed by first perimeter frames and substantially surrounds the first subassemblies. A second temperature tank is formed by second perimeter frames and substantially surrounds the second circuit card subassemblies. A first temperature cooling supply line selectively introduces the first cooling fluid into the first temperature tank for at least partially inducing the first operating temperature. A second temperature cooling supply line selectively introduces the second cooling fluid into the second temperature tank for at least partially inducing the second operating temperature.

An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

A heatsink having enhanced localized cooling. The heatsink comprises a wall; a heatframe; a coolant channel between the wall and the heatframe, wherein a bulk coolant flows through the coolant channel; and one or more nozzles that extend into the coolant channel and proximate the wall and/or the heatframe, wherein a high-pressure coolant flows through the one or more nozzles, mixes with the bulk coolant in the coolant channel, and impinges on a cooling area of the wall and/or the heatframe proximate an outlet of the one or more nozzles to provide enhanced localized cooling to at least a portion of a heat producing device that is proximate to or in partial contact with the wall and/or the heatframe proximate to the cooling area of the wall and/or the heatframe.

A split enclosure apparatus for fan-less cooling may be provided. The apparatus may comprise a device and a housing. The device may comprise a plurality of components. The housing may enclose the device and may comprise a first external surface, a second external surface, and a joint between the first external surface and the second external surface. The first external surface may be dedicated to cooling a first one of the plurality of components. The second external surface may be dedicated to cooling a second one of the plurality of components. The joint between the first external surface and the second external surface may be electrically conductive and thermally resistive.

Separating temperature domains in cooled systems, including: cooling at least one first component of a circuit board using a first cooling system; and conductively coupling the at least one first component to at least one second component using a superconductive portion of a power plane of the circuit board.

A power supply for providing power to a power consumer includes comprising power-handling circuitry disposed in a housing that comprises a shell and a heat guide. The shell has an outer surface and an inner surface. The inner surface has a heat guide disposed therein. The heat guide has a higher thermal conductivity than that of the outer surface. The shell passively dissipates heat generated by the power-handling circuitry at a rate sufficient to maintain the power-handling circuitry at an operating temperature.

A display assembly for an imaging device including a display panel, a display, a first control unit, a second control unit and a thermally insulating layer, and a housing. The thermally insulating layer divides the housing in at least a first cavity including the first control unit and a second cavity including the second control unit. The thermally insulating layer preventing heat generated in the first cavity or the second cavity from reaching the other cavity and including an electrically conductive material to at least partially shield electromagnetic radiation generated in the first or the second cavity from reaching the other cavity.