A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.

This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

A cooling unit positioned between a first and a second gas stream, the first and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger. A housing surrounds a fan and the second fins.

An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Disclosed are an electrical apparatus, a method for manufacturing an electrical apparatus, and a motor vehicle, the electrical apparatus (100) comprising: a chamber (110), the chamber (110) at least comprising a first electrical element (120) located at a first position and a second electrical element (130) located at a second position, the first electrical element (120) and the second electrical element (130) having different heat dissipation characteristics; wherein the electrical apparatus further comprises a potting spacer (140), the potting spacer (140) separating the chamber (110) into two sub-chambers: a first sub-chamber (111) and a second sub-chamber (112), and the first electrical element (120) is located in the first sub-chamber (111), the second electrical element (130) is located in the second sub-chamber (112).

A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.

The disclosed apparatus may include (1) a split heatsink assembly that comprises (A) a first heatsink that includes a base for thermally coupling to a first heat-emitting component, wherein the base of the first heatsink forms an opening, and (B) a second heatsink that includes a pedestal for thermally coupling to a second heat-emitting component, wherein the pedestal of the second heatsink fits into the opening formed by the base of the first heatsink, and (2) an EMI absorber that at least partially encompasses the pedestal of the second heatsink and resides between the pedestal of the second heatsink and the base of the first heatsink in the opening. Various other apparatuses, systems, and methods are also disclosed.

An electronic device includes: a casing including a bottom wall and a side wall rising from the bottom wall, the side wall being attached to a manifold of an actuator in an aircraft at an opposite side to the bottom wall; a boss projecting from the bottom wall toward the opposite side to the bottom wall with respect to the side wall; and a circuit portion fixed to the boss.