This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

A heat radiation structure (10) includes a casing (4) configured to accommodate a heating element (1), and a heat-sink type component (2) configured to directly or indirectly absorb heat from the heating element (1), contactlessly face the casing (4), and conduct the heat to the casing (4) via air existing in an internal space of the casing (4), wherein at least either the heat-sink type component (2) or the casing (4) is configured in such a way that, when heat is generated from the heating element (1), a distance between the heat-sink type component (2) and the casing (4) becomes nearer in a region of the internal space (3) in which temperature does not rise relatively easily than in a region of the internal space (3) in which temperature rises relatively easily.

A data storage system may include multiple data storage devices, such as solid-state drives, an enclosure housing the devices, and a thermal bridge positioned in a gap between and in contact with each of the enclosure and a device, where the enclosure is cooler than the device. Thus, heat is conducted away from a hot spot of the device and to the enclosure. The thermal bridge may be flexible enough to bridge different sized gaps, while stiff enough to generate contact forces applied to the enclosure and the device. For example, the thermal bridge may be constructed primarily of copper and configured to function like a compression spring.

Provided is a generator that includes a housing, a high-power circuit including a power amplifier, and a low-power circuit. An air flow guidance plate divides the housing into at least two compartments including a high-power compartment and a low-power compartment. The high-power circuit is disposed within the high-power compartment and the low-power circuit is disposed within the low-power compartment.

An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

An apparatus includes a top wall and a bottom wall. The top wall and the bottom wall define and enclose a first fin area; a second fin area; and a flex region joining the first fin area to the second fin area. The flex region is connected in fluid communication with the interior of the first fin area and the interior of the second fin area. The flex region is bent or twisted at a nonzero angle around at least one axis relative to the broadest surfaces of the first and second fin areas.

A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

Disclosed is a method and apparatus for mitigating temperature spikes and dissipating heat. The apparatus for mitigating temperature spikes and dissipating heat comprises one or more heatsinks, one or more sensors, one or more phase change materials and one or more processors coupled to the one or more sensors. The one or more processors may be configured to obtain one or more sensor measurements and may be configured to determine whether to store heat or dissipate heat based on the one or more sensor measurements. In response to a determination to dissipate heat, the one or more processors may be configured to dissipate heat from the one or more processors, the one or more phase change materials or both using the one or more heatsinks. Furthermore, in response to a determination to store heat, store heat from the one or more processors using the one or more phase change materials.

A heat sink, which includes a first surface and a second surface opposite to the first surface, where the second surface includes a plurality of sub-surfaces, and each sub-surface is configured to be in contact with a surface of a heat emitting element; the plurality of sub-surfaces include a first sub-surface, a thickness between the first sub-surface and the first surface is less than a thickness between the first surface and each of the plurality of sub-surfaces except the first sub-surface; and the heat sink includes a plurality of layers of graphene sheets, each layer of graphene sheet includes a plurality of flake graphite particles, and two adjacent flake graphite particles located in a same layer of graphene sheet are covalently bonded.

An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.