A fanless cooling system for particularly fail-safe and efficient cooling of electronic modular systems in vehicles, more particularly in rail vehicles, includes a preferably frame-shaped rack or assembly carrier for holding at least one module or assembly, more particularly a processor module having high-performance multi-core processors. A heat transport body can be mounted in a heat-transferring manner on a part or component of the module. The rack has at least one heat distribution body, to which the heat transport body can be fastened in a heat-transferring manner, preferably detachably, when the module having the part coupled to the heat transfer body is held in the rack. At least one heat tube is connected to the heat distribution body in a heat-transferring manner. An electronic modular system with a fanless cooling system is also provided.

An electrical device, comprising a device housing including a skeleton-like frame structure having a plurality of columns and/or crossbeams and at least one electrical module. The module has a module housing and is detachably mounted on the frame structure. The module housing accommodates one or more electrical components generating heat when being operated, wherein the at least one electrical module is liquid cooled and is connected to a radiator for establishing a coolant circuit. The radiator and an active ventilation means are arranged in the device housing such that the radiator is positioned in an air stream generated by the active ventilation means when the active ventilation means is operated.

Heat exchanger structure for a rack assembly formed by a shaped body of thermally conductive material. The heat exchanger structure comprises a first heat exchanging portion adapted to provide a mechanical support for one or more power electronic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electronic components. The heat exchanger structure comprises a second heat exchanging portion adapted to provide a mechanical support for one or more power electromagnetic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electromagnetic components.

A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.

In some implementations, a network device is provided. The network device includes a housing and a set of switch cards, mounted within the housing. The set of switch cards includes a first set of connectors. The network device also includes a set of line cards having a second set of connectors. The set of line cards are oriented parallel to each other and oriented orthogonally to the set of switch cards. The second set of connectors is coupled to the first set of connectors to couple the set of switch cards to the set of line cards. The network device further includes a first set of power supplies disposed along a left side of the housing and a second set of power supplies disposed along a right side of the housing.

In some implementations, a network device includes a housing and a set of switch cards within the housing and including a first set of connectors. A set of line cards within the housing includes a second set of connectors. The set of line cards are oriented orthogonally to the set of switch cards. A first set of power supplies and a second set of power supplies are in the housing. A midplane includes a plurality of circuit board assemblies arranged within the housing between the set of line cards and the first and second sets of power supplies to allow air to flow through the set of line cards to the set of switch cards, first set of power supplies, and second set of power supplies.

The electronic cabinet for enclosing electronic components generally has a housing having a base and a cover being connected to one another a plurality of lateral walls, one of the plurality of lateral walls having a first opening; a lateral perforated plate being mounted to the housing and extending over the first opening, the lateral perforated plate having a plurality of perforations; and a protector plate being mounted to the housing and extending over the lateral perforated plate to cover the plurality of perforations of the lateral perforated plate, the protector plate defining at least one air inlet between the protector plate and the lateral perforated plate.

The electronic cabinet for enclosing electronic components generally has a housing having a base and a cover being connected to one another a plurality of lateral walls, one of the plurality of lateral walls having a first opening; a lateral perforated plate being mounted to the housing and extending over the first opening, the lateral perforated plate having a plurality of perforations; and a protector plate being mounted to the housing and extending over the lateral perforated plate to cover the plurality of perforations of the lateral perforated plate, the protector plate defining at least one air inlet between the protector plate and the lateral perforated plate.

Various embodiments of the present disclosure provide a heat sink for a plug-in storage card and a plug-in storage card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in storage card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in storage card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.

An apparatus, such as a transformer cabinet, includes a housing (e.g., a sheet metal enclosure) having electrical equipment (e.g., a transformer) disposed therein. A duct in the housing is configured to direct a first airflow in the housing to create a vortex that entrains a second airflow that passes over the electrical equipment. The housing may have a first opening configured to provide the first airflow and a second opening configured to provide the second airflow. The first opening may be in a side wall of the housing and the second opening may be proximate a bottom of the housing. The side wall may include a first side wall and the duct may be configured to direct the first airflow upwards and towards a second side wall of the housing.