A casing including a first body and a locking plate is provided, the locking plate is installed to the first body, and the locking plate extends inward to form a frame, so as to lock the casing to a main chassis of a desktop computer. Compared with the existing technique, the casing is directly locked to the main chassis of the desktop computer from exterior to interior through the locking plate, i.e. the casing is adapted to install the redundant power supply without changing an internal configuration of the main chassis or changing an outline dimension of the main chassis or the casing. Moreover, in terms of material purchase, it is unnecessary to purchase casings of other dimensions, but only one type of casings are used to produce general power supplies and redundant power supplies, so as to effectively save the manufacturing cost. Moreover, a redundant power supply is provided.

The invention relates to a housing for aircraft avionic equipment including a plate to the surface of which heatsinks are connected. The plate is made of composite, that includes a fibrous reinforcement densified by a polymer matrix; the heatsinks are in a metal alloy having a thermal conductivity higher than or equal to 120 W/m/K; and the heat sinks are assembled with the plate by sewing or knitting using assembling fibres made of organic material or metal.

A module for a communications cell site includes: a mounting frame; a remote radio unit (RRU) mounted to the frame; a radio frequency (RF) signal conditioning unit mounted to the frame; and a cover mounted to the frame that covers the RRU and the RF signal conditioning unit.

A printed circuit board cooling structure is provided, where a printed circuit board (PCB) is fixed to the printed circuit board cooling structure for cooling and meeting mechanical and electrical requirements. The printed circuit board cooling structure includes a cooling case in which printed circuit boards (PCB) are cooled with air or fluid, and a cold plate structure which is placed in the case made from a slit opened in the relevant board area of the cooling case, transfers the heat to chassis (case) wall, and eliminates wedge mechanism.

A cooling system for cooling the circuit boards (B), such as VPX, VME or custom PCI modules, is provided. The cooling system includes a casing (C), which includes at least two board slots (1) and at least one cooling plate (2) between the two board slots (1); at least one cover (3), which is placed on a circuit board (B) to be secured to one of the board slots (1); at least one wedge (4) placed on the cover (3). The wedge (4) provides thermal conductivity between the circuit board (B) and cooling plate (2) when the circuit board (B) is placed into the board slot (1); and at least one wedgelock (5) that secures circuit board (B) to the board slot (1).

An apparatus, such as a transformer cabinet, includes a housing (e.g., a sheet metal enclosure) having electrical equipment (e.g., a transformer) disposed therein. A duct in the housing is configured to direct a first airflow in the housing to create a vortex that entrains a second airflow that passes over the electrical equipment. The housing may have a first opening configured to provide the first airflow and a second opening configured to provide the second airflow. The first opening may be in a side wall of the housing and the second opening may be proximate a bottom of the housing. The side wall may include a first side wall and the duct may be configured to direct the first airflow upwards and towards a second side wall of the housing.

The disclosed information technology rack may include (1) a frame with a group of vertical support bars that together define an equipment bay for housing information technology modules, where each vertical support bar is oriented substantially perpendicular relative to a floor on which the information technology rack stands and (2) a mounting structure, coupled to the vertical support bars of the frame, that is configured to mount at least one information technology module to the frame within the equipment bay in a substantially non-horizontal orientation relative to the floor on which the information technology rack stands.

The rack (4), which is provided to receive electronic module that can be plugged in, has a modular construction and comprises at least two rack modules (21), each rack module (21) defining a cell (8) for receiving at least one electronic module (6), each rack module (21) having at least a side wall (22), a lower wall (24) and a rear wall (26) defining the cell (8), the lower wall (24) being configured to ensure a distribution of air inside the cell (8), the rear wall (26) being provided with connector openings (32) for fastening rack connectors (20) provided to engage with electronic module connectors (12), the rack modules (21) being positioned side by side and fastened to one another such that the rack (4) is able to be manipulated as a single unit.

The present invention relates an environmentally robust chassis design for use in high demand or mission critical environments, including power stations, sub-stations, roadside transportation, rail, and industrial applications. The present invention provides a) increased cooling and reliability for the components of electronic equipment, more particularly electronic components, which could affect the power supply, data transmission; and b) increased tolerance to excessive shock and vibration (e.g. can withstand over 20 G of force).

A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.