Aspects of the disclosure generally relate to at least one device for heat transfer or dissipation. The at least one device for heat transfer or dissipation can include an air-to-air heat exchanger. The air-to-air heat exchanger can include an air flow inlet and various slots to establish a flow-through air path.

A cooling system, in particular for electronics cabinets, comprising a casing, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, the first cooling circuit comprising a heat releasing section and the second cooling circuit comprising a heat releasing section, is provided, wherein the casing comprises at least three compartments including a cabinet side compartment, a first external side compartment and a second external side compartment, wherein the three compartments are fluidically separated from each other so that respective airflows in the cabinet side compartment, the first external side compartment and the second external side compartment do not mix, wherein the heat releasing section of the first cooling circuit is arranged in the first external side compartment and wherein the heat releasing section of the second cooling circuit is arranged in the second external side compartment.

A control cabinet arrangement, comprising a cooling device which is received in a control cabinet housing, wherein the cooling device can be slidably held on the control cabinet housing via a linear adjusting unit, particularly a bar system, and can be adjusted between a pull-out position and a slide-in position, wherein the cooling device in the slide-in position is completely received in the control cabinet housing, and in the pull-out position, the cooling device protrudes at least partially beyond a door side of the control cabinet housing from the control cabinet housing, and wherein a door element, which closes in its closed position the door side of the control cabinet housing, comprises at least one air passage opening which opens into an air outlet and/or an air inlet of the cooling device in the closed position of the door element, when the cooling device is in the slide-in position.

A heat dissipation structure is disclose, the structure includes a housing, a first air vent and a second air vent. There is a gap between two neighboring side panels, and the 2N inner-layer side panels are grouped into N groups of inner-layer side panels in an arrangement sequence. A first gap between a first inner-layer and an outer-layer side panel communicates with the inside of the cabinet, or a first gap between two neighboring inner-layer side panels in different groups and a first gap between a first inner-layer and the outer-layer side panel communicate with each other, and communicate with the inside of the cabinet, to form an internal circulation ventilation channel. Second gaps, each of which is between two inner-layer side panels in a same group, communicate with each other, and communicate with the first and the second air vent, to form an external circulation ventilation channel.

A system for managing temperature, that can be adapted to an electrical enclosure, the electrical enclosure delimiting a first volume, the system comprising: a first chamber delimiting a closed second volume and a tank housed in the first chamber and delimiting a closed third volume inside the first chamber, first air transfer means arranged between a first air inlet/outlet connected to the second volume and a second air inlet/outlet intended to be connected to the first volume, second air transfer means arranged between a third air inlet/outlet connected to the third volume and a fourth air inlet/outlet intended to be connected to the first volume, and a control and processing unit intended to apply a mode of operation of the system.

A cabinet is provided, including a case and a fin element. The case has at least one opening. The fin element is disposed in the case and is adjacent to the at least one opening and includes a main body and a plurality of fins, wherein the fins are disposed on the main body and face the at least one opening.

Aspects of the disclosure generally relate to at least one device for heat transfer or dissipation. The at least one device for heat transfer or dissipation can include an air-to-air heat exchanger. The air-to-air heat exchanger can include an air flow inlet and various slots to establish a flow-through air path.

An invention relates to a field of electrical engineering, in particular to various cabinet-type electronic devices of a general purpose with an equipment airflow cooling, conducted by virtue of a forced ventilation, and can be used in construction of various electrical devices, particularly of electric motor control stations. A claimed invention essence lies in a fact that the forced air cooling system of the power and low-current components of the electrical device contains an air heat exchanger, the power electronic components, as well as coolers, being in a thermal contact with the low-current electronic components, configured to be cooled with the single flow of previously cleaned extraneous air directed from a top of the enclosure to its bottom part. The coolers are spaced along a length of an air channel of the electronic device, forming a mixing zone of heated and cool air.

An electronic assembly includes one or more electronic components and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. The cooling airflow inlet is downward facing toward the vertically bottom surface such that the cooling airflow flows into the cooling airflow inlet an upward direction toward the vertically top surface.

An electronic assembly includes one or more electronic components, and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. One or more removable covers are positioned over the cooling airflow inlet to allow for airflow ingress into the cooling airflow inlet, while preventing impingement of debris into the cooling airflow inlet.