An arrangement for cooling a closed, sealed cabinet (1), comprising a thermosiphon heat exchanger (2) disposed inside the cabinet (1) and having an evaporator (3) and a condenser (4) for circulating a working fluid between the evaporator (3) and the condenser (4) in a closed loop, wherein the working fluid evaporated in the evaporator (3) by heat flows to the condenser (4) for cooling and the condensed working fluid flows back to the evaporator (3). The evaporator (3) is exposed to hot air flow generated inside the cabinet (1), and a heat transfer element (5) is attached to the condenser (3) in a sealed manner through a cabinet wall (6) for transferring heat to the outside of the cabinet (1).

An arrangement for cooling the inside air of an enclosure of a liquid cooled power electronic device, the arrangement comprising an air to liquid heat exchanger attached to the door of an enclosure, and means for circulating the inside air of the enclosure through an air channel of the heat exchanger. The heat exchanger comprises a cooler with internal liquid circulation, assembled inside the air channel and connected to the main liquid circulation of the enclosure, for example by flexible connection pipes, which allow the enclosure door to be opened without disturbing the liquid circulation.

An information handling system may include a chassis configured to house a plurality of information handling resources, one or more air movers internal to the chassis and arranged to drive airflow proximate to the plurality of information handling systems, and an air-to-liquid radiator internal to the chassis and arranged such that the airflow flows proximate to the air-to-liquid radiator to cool airflow internal to the chassis prior to flowing proximate to at least one of the information handling resources.

A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

A temperature-regulated cabinet (10) includes a cabinet body (1) and a temperature regulating module (2). The cabinet body (1) has a containing space (11) formed inside the cabinet body (1) and an opening (12) communicated with the containing space (11). The temperature regulating module (2) is detachably installed to the cabinet body (1) and covered onto the opening (12) and includes a temperature regulator (21), a first hood (22), a second hood (23) and an exhaust fan (24). The temperature regulator (21) has a casing (211). The first hood (22) is detachably installed to the top of the casing (211), and the second hood (23) is detachably installed to the bottom of the casing (211). The exhaust fan (24) is installed inside the first hood (22) or the second hood (23). The cabinet has the advantages of simplifying the production line and lowering the construction and operation costs.

In one embodiment, an RF impedance matching circuit is disclosed. The matching circuit is coupled between a plasma chamber and an RF source providing an RF signal having a frequency. The matching circuit includes a first electronically variable capacitor having a first variable capacitance and a second electronically variable capacitor having a second variable capacitance. A control circuit determines a first parameter related to the plasma chamber, and then determines, based on the first parameter, a first capacitance value for the first electronically variable capacitor and a second capacitance value for the second electronically variable capacitor. The control circuit then generates a control signal to alter the first variable capacitance and the second variable capacitance accordingly, causing the RF power reflected back to the RF source to decrease while the frequency of the RF source is not altered.

In one aspect, a medium voltage power converter includes a cabinet having: a power cube bay to house a plurality of power cubes, each of the plurality of power cubes adapted within a corresponding enclosure and comprising a low frequency front end stage, a DC link and a high frequency back end stage, the plurality of power cubes to couple to a high speed machine; and a plurality of first barriers adapted to isolate and direct a first flow of cooling air through one of the plurality of power cubes; and a transformer bay having at least one transformer to couple between a utility connection and the plurality of power cubes, the transformer bay including a plurality of cooling fans to cool the at least one transformer.

A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

Examples of hybrid cooling System for datacenters are disclosed. In an example, the hybrid cooling system includes a chiller plant to provide supply of coolant, an air-cooling unit (ACU), and a coolant distribution line. The coolant distribution line comprises a first portion, a second portion, and a third portion in series fluid communication. The ACU receives supply of the coolant from the chiller plant via the first portion. The hybrid cooling system further includes a coolant distribution unit (CDU) coupled to an electronic component in the data hall. The ACU and the CDU are in series fluid communication via the second portion of the coolant distribution line and the coolant egressing the ACU passes through the second portion to be fed back to the CDU. The hybrid cooling system includes a heat exchanger in series fluid communication with the CDU via the third portion of the coolant distribution line.

In one embodiment, a semiconductor processing tool includes a plasma chamber and an impedance matching circuit. The matching circuit includes a first electronically variable capacitor having a first variable capacitance, a second electronically variable capacitor having a second variable capacitance, and a control circuit. The control circuit is configured to determine a variable impedance of the plasma chamber, determine a first capacitance value for the first electronically variable capacitor and a second capacitance value for the second electronically variable capacitor, and generate a control signal to alter at least one of the first variable capacitance and the second variable capacitance to the first capacitance value and the second capacitance value, respectively. An elapsed time between determining the variable impedance of the plasma chamber to when RF power reflected back to the RF source decreases is less than about 150 sec.