The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is arranged in a first cooling room and configured to blow a hot air inside a rack into a first cooling room. The evaporator is arranged in the first cooling room. The first condenser is arranged in a second cooling room. The second fan is arranged in the second cooling room and configured to blow an outside air into the second cooling room. The water-cooling device includes a radiator. The radiator is arranged in the second cooling room and configured to receive a hot liquid from an electronic device in the rack through a third pipeline and transmit a cold liquid to the electronic device through a fourth pipeline.

An embodiment includes a cooling unit, including: a housing configured to attach to an enclosure opening in a sealed manner, where the enclosure houses heat generating electrical equipment; the housing including: a first ambient side area including a compressor, condensing coils, and an ambient air intake and outlet; a first enclosure side area situated above the first ambient side area and including an electrical box that includes one or more relays and a digital controller; a second enclosure side area extending along the rear side of the housing and communicating with the first enclosure side area, including an impeller, an enclosure air intake, an enclosure air return, and evaporator coils in fluid communication with the condenser coils; and a second ambient side area including an impeller and one or more hot air exhausts; where all components of the cooling unit are non-sparking and non-arcing; and where the first and second ambient side areas are sealed off from the first and second enclosure side areas. Other embodiments are described and claimed.

In one embodiment, a semiconductor processing tool includes a plasma chamber and an impedance matching circuit. The matching circuit includes a first electronically variable capacitor having a first variable capacitance, a second electronically variable capacitor having a second variable capacitance, and a control circuit. The control circuit is configured to determine a variable impedance of the plasma chamber, determine a first capacitance value for the first electronically variable capacitor and a second capacitance value for the second electronically variable capacitor, and generate a control signal to alter at least one of the first variable capacitance and the second variable capacitance to the first capacitance value and the second capacitance value, respectively. An elapsed time between determining the variable impedance of the plasma chamber to when RF power reflected back to the RF source decreases is less than about 150 sec.

The invention relates to a method for regulating a cooling device fitted in or to a switchgear cabinet, by means of a regulating device, wherein the temperature of the switchgear cabinet interior air is detected and an interior fan assigned thereto for generating an interior air flow through an evaporator and providing cooling air is switched on if the detected temperature of the switchgear cabinet interior air exceeds an upper setpoint temperature, and is switched off if the detected temperature falls below a lower setpoint temperature, and the invention relates to an apparatus for carrying out the method. A reduced energy consumption and an increased service life with reliable operation are achieved by virtue of the fact that after the interior fan has been switched off owing to the lower setpoint temperature being undershot, a timekeeping is started and the interior fan is switched on after a predetermined first time duration for a predetermined second time duration and is then switched off again if the detected temperature still falls below the upper setpoint temperature, as long as the second time duration proceeds, that the intermittent time-controlled mode of operation of the interior fan is cyclically repeated until the upper setpoint temperature is exceeded, after which the interior fan is operated in continuous operation, and that the timekeeping and the intermittent time-controlled mode of operation of the interior fan are started anew if the lower setpoint temperature is undershot.

An equipment cooling rack device, with a cooling cabinet, having a cooled area, adapted for holding multiple different heat creating structures to be cooled; a cooling structure, coupled to the cooling cabinet, and providing a first cooling coil for a left side of the rack and a second cooling coil for a right side of the rack, and orthogonal fans. The fans and coolant are controlled according to thermographic color of the cooling cabinet.

A cooling system for cooling air in a rack mounted equipment such as computer systems. The cooling system includes a split and staggered cooling system where the cooling is carried out by two different parallel coolers. One of the coolers is pressed against the walls of the cooling duct, but allows some amount of the air to pass around the cooler. The output of that first cooler is also constricted to a similar amount as the air output that passes around the first cooler. The second cooler is downstream of the first cooler, and receives all the air that passes around the first cooler and provides cooling to that air. In this way, two different split coolers can be used to cool the air stream.

A cooling system, in particular for electronics cabinets, is proposed, comprising a casing, wherein the casing comprises at least a cabinet side partitionment, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, wherein the second cooling circuit is an active cooling circuit, wherein the first cooling circuit and the second cooling circuit are thermally coupled, wherein the second cooling circuit is not disposed in the cabinet side partitionment.

An arrangement for cooling the inside air of an enclosure of a liquid cooled power electronic device, the arrangement comprising an air to liquid heat exchanger attached to the door of an enclosure, and means for circulating the inside air of the enclosure through an air channel of the heat exchanger. The heat exchanger comprises a cooler with internal liquid circulation, assembled inside the air channel and connected to the main liquid circulation of the enclosure, for example by flexible connection pipes, which allow the enclosure door to be opened without disturbing the liquid circulation.

The invention relates to a switch cabinet with a cooling apparatus which has a first closed coolant circuit and a second closed coolant circuit separated fluidically from the first coolant circuit, the first coolant circuit having a refrigerating machine or a cold water set and the second coolant circuit having a heat pipe arrangement.

The present disclosure discloses a container data center, which includes an outdoor unit arrangement region, a power distribution region, and an IT equipment region. Each of the regions sequentially divides adjacent regions from each other by means of shared partitions, and a main entry buffer region and a monitoring platform are arranged between a unique entrance/exit inside a container body and the IT equipment region to control temperature and humidity of each of the regions inside the container body.