Patent classifications
H05K7/20618
MODULAR CONTAINERIZED UPS
A UPS system includes a UPS module having a first housing and a first sensor outputting first data, a battery module having a second housing and a second sensor outputting second data, and a central controller that is external to the first housing of the UPS module and the second housing of the battery module. The central controller is coupled to the UPS module and the battery module and is configured to receive the first data and the second data. The UPS system further includes at least one cooling module contained within a frame structure. The at least one cooling module is configured to provide cooling to the UPS module. The frame structure includes a first vent configured to exhaust warm air.
COOLING SYSTEM FOR DATA CENTER
An objective of the present disclosure is to provide a cooling system for a data center. The system includes: a cabinet hot aisle, disposed above a cabinet; a hot airflow passage, disposed at a top of the data center, a ventilating fan being disposed between the hot airflow passage and the cabinet hot aisle; an exterior wall heat exchanging structure, disposed on an exterior wall of the hot airflow passage, a surface of the exterior wall heat exchanging structure adopting a turbulent airflow heat exchanging structure; and a cold airflow passage, communicated with the cabinet, a natural cold air supply damper being disposed between the cold airflow passage and the hot airflow passage.
Cold row encapsulation for server farm cooling system
Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.
Cooling system with desiccant dehumidification
A system for removing heat from electrical systems includes a dehumidification device including a desiccant, an evaporative cooling device, air moving devices, and an air flow control devices. The air moving device moves air through the dehumidification device, the evaporative cooling device, and the electrical systems. The air flow control device controls a rate of flow through the dehumidification device.
Multizone variable damper for use in an air passageway
A multizone variable damper for air passageways having a plurality of damper zones, a plurality of opposed blades that are rotatable about a horizontal axis, a pair of blades of the plurality of blades being provided in each zone of the plurality of damper zones, and an actuator for each pair of blades, each actuator being configured to independently rotate each of the pairs of blades of the plurality of opposed blades so as to selectively and independently control a degree of openness of each of the pairs of blades of the plurality of opposed blades in each damper zone of the plurality of damper zones.
Chassis for providing distributed airflow
A computing system includes a chassis having an airflow entrance and an airflow exhaust, a duct structure disposed in the chassis, and a redirection mechanism located on a wall of the duct structure and extending through a cutout in the wall of the duct structure. In the computing system, the duct structure has a first end facing the airflow entrance and a second end facing the airflow exhaust. The redirection mechanism has a deflector having an inlet airfoil extending away from the duct structure towards the airflow entrance and at least one exhaust airfoil extending into the duct structure.
Active perforation for advanced server cooling
Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.
Airflow guiding mechanism and electronic device
An airflow guiding mechanism includes a housing and a shielding assembly. The housing includes an airflow guiding portion and a guiding track. The shielding assembly is movably connected to the guiding track. The shielding assembly is able to move within the airflow guiding portion along the guiding track. In an embodiment, the shielding assembly may include a first shielding plate and at least one second shielding plate. The first shielding plate is connected to the housing. The at least one second shielding plate and the first shielding plate are movably connected to each other. The at least one second shielding plate are able to move with respect to each other to be folded and unfolded, so as to open and shield the airflow guiding portion.
FREE COOLING IN HIGH HUMIDITY ENVIRONMENTS
A data center includes heat producing components and an air handling system that provides reduced relative humidity air to cool the heat producing components. The air handling system includes a thermal storage unit that removes thermal energy from incoming air under a given set of ambient air conditions and releases thermal energy into incoming air under another set of ambient air conditions. Under the given set of ambient air conditions, the thermal storage unit cools the incoming air and causes water vapor to condense out of the incoming air. Under the other set of ambient air conditions, the thermal storage unit releases thermal energy into the incoming air, thus heating the incoming air.
Free cooling in high humidity environments
A data center includes heat producing components and an air handling system that provides reduced relative humidity air to cool the heat producing components. The air handling system includes a thermal storage unit that removes thermal energy from incoming air under a given set of ambient air conditions and releases thermal energy into incoming air under another set of ambient air conditions. Under the given set of ambient air conditions, the thermal storage unit cools the incoming air and causes water vapor to condense out of the incoming air. Under the other set of ambient air conditions, the thermal storage unit releases thermal energy into the incoming air, thus heating the incoming air.