A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.

Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.

Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.

A cooling module includes an electroosmotic pump. The electroosmotic pump includes a first electrode which is permeable to a cooling fluid, a second electrode which is located with an interval from the first electrode and is permeable to the fluid, and a dielectric layer which is located between the first electrode and the second electrode and includes a microchannel which is permeable to the fluid. The first electrode and the second electrode have different polarities.

Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.

A method of assembling a switching module may arrange a first pressing member on a first supporting member, stack a plurality of switches and a plurality of cooling plates on the first pressing member along a vertical direction, arrange a second pressing member and a supporting member on the uppermost cooling plate, support the first supporting member and a second supporting member using a plurality of supporting rods, press the first pressing member using a pressing device to separate between the first pressing member and the first supporting member, and insert a third pressing member between the first pressing member and the first supporting member.

A flow detection device comprises a fluidic input port connected to a fluidic output port via a channel and a float located within the channel. A specific weight of the float exceeds a specific weight of a fluid injected in the flow detection device. Respective locations of the fluidic input port, of the channel and of the fluidic output port on the flow detection device cause the float to rise within the channel when a sufficient flow of the fluid is injected in the flow detection device. A sensor is provided to detect a position of the float within the channel. The flow detection device may be integrated in a cooling circuit having a cooling device for an electronic device to detect an eventual lack of a flow of a cooling fluid in the cooling circuit. A status of the flow of the cooling fluid is reported to a processor.

A negative pressure liquid cooling system and a method for controlling a negative pressure liquid cooling system are provided, and the negative pressure liquid cooling system separately controls pressures at an inlet and an outlet of a cold plate, so that the pressures at the inlet and the outlet of the cold plate remain negative. In this way, when a pipeline between the inlet and the outlet of the cold plate is perforated, a pressure at the outlet of the cold plate can be separately controlled to remain negative, so that a coolant is suppressed in the pipeline, and a coolant leakage phenomenon is avoided. Therefore, damage or a security threat to a to-be-cooled electronic device that is caused by leakage of a conductive operating medium such as water is avoided.

A system may include a plurality of information handling systems and a manifold fluidically coupled to each of the plurality of information handling systems via respective fluidic conduits and further configured to couple to a cooling distribution unit, the manifold comprising a plurality of variable valves wherein the variable valves are programmable to control a flow rate of coolant fluid through the variable valves in order to independently control a first flow rate of the coolant fluid to a first information handling system of the plurality of information handling systems and a second flow rate of the coolant fluid to a second information handling system of the plurality of information handling systems.