Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decouplable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decouplable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.

Systems and methods for mitigating temperature excursion for IT equipment within a data center using a liquid cooling system are disclosed. A supply temperature control routine to a server rack is configured to alert a coolant distribution unit and a heat rejection plant when the temperature of a given server rack is reaching a critical temperature, due to increased demand of the computing resources within the server rack. Using a temperature sensor that is located at the server rack, the computing device controller is configured to receive up-to-date temperature readings. Thus, the computing device controller is able to locally monitor return temperature of the server rack and provide alerts to the coolant system when needed.

Methods, systems, and devices for managing a data processing system that provides computer implemented services are disclosed. To provide the computer implemented services, a system may include a chassis adapted to house hardware components of the data processing system. To dissipate heat generated by the hardware components, the system may further include a quick connection adapted to place the chassis in fluid communication with a manifold through which cooling fluid flows, a fluid management mechanism adapted to, while the chassis is positioned in the rack system at a predetermined location, reversibly reposition the quick connection with respect to the chassis to establish the fluid communication or terminate the fluid communication.

The described technology provides a coolant system for a computing system rack, the coolant system including a hose configured to deliver coolant to and from a computing system rack, one or more sensors configured to measure one or more parameters of the coolant flowing through the hose and to communicate the one or more measured parameters to a hose controller, and an auto-valve configured on the hose to control the flow of coolant through the hose. The hose controller may be configured on the computing system rack and may be configured to control the auto-valve based on one or more of temperature of the coolant, flow level of the coolant, and pressure of the coolant.

A pipeline guiding module includes a base, a floating member and a first elastic member. The base has an accommodating hole and a first restraining structure. The floating member is floatingly disposed in the accommodating hole. The first elastic member is disposed along an axial direction of the accommodating hole and sandwiched between the first restraining structure and the floating member. The pipeline guiding module may be applied to a liquid cooling device and a data processing system to offset a bending stress of a pipeline and avoid leakage at a connection between the pipeline and a connector.