Embodiments of the present disclosure describe servers having thermal management features and thermal management systems for servers. These embodiments include heat sinks to be thermally coupled by one or more heat pipes to transfer heat from hotter downstream heat sinks to cooler upstream heat sinks in order to distribute thermal loading across multiple devices. In one embodiment a single heat pipe may be used to thermally couple two heat sinks, whereas in other embodiments a modular heat pipe arrangement may be used. Techniques for thermally coupling modular heat pipes to one another such that vapor sections of adjacent heat pipes overlap are also disclosed. Other embodiments may be described and/or claimed.

Modular thermal truss plates carry heat in multiple directions. Framing around an array of flat heat pipes provides mechanical and thermal connections to other truss plates, and a base, such as a satellite, thereby supporting thermally active equipment. Walls sandwich banks of flat heat pipes and may bond to a honey comb, metal core conducting heat between multiple walls. Each bank of flat heat pipes passes heat best in one direction, and may be formed of corrugated copper sheets spaced apart by a metal mesh, such as an expanded metal or screen, also stamped or otherwise formed into a corrugated configuration. Joining methods (e.g., brazing, soldering, etc.) increase stiffness, pressure containment, and strength, by binding the two layers of metal sheet to one another.

Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.

An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.

Embodiments of the present disclosure describe servers having thermal management features and thermal management systems for servers. These embodiments include heat sinks to be thermally coupled by one or more heat pipes to transfer heat from hotter downstream heat sinks to cooler upstream heat sinks in order to distribute thermal loading across multiple devices. In one embodiment a single heat pipe may be used to thermally couple two heat sinks, whereas in other embodiments a modular heat pipe arrangement may be used. Techniques for thermally coupling modular heat pipes to one another such that vapor sections of adjacent heat pipes overlap are also disclosed. Other embodiments may be described and/or claimed.

A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

A data center system includes a multi-floor housing having a first floor and a second floor housings which house a number of electronic racks of information technology (IT) components operating therein. The system includes a first set of indirect evaporative cooling units (IDECs) coupled to a first portion of the multi-floor housing through a first side of the multi-floor housing to direct exterior air through heat exchangers of corresponding IDECs to cool a first portion of interior air which cools a first set of the electronic racks. The system includes a second set of IDECs coupled to a second portion of the multi-floor housing through a second side of the multi-floor housing to direct exterior air through heat exchangers of corresponding IDECs to cool a second portion of interior air which cools a second set of the electronic racks. The system includes various DEC couplings/layouts and air flow management.

An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.

An electronic device cooling apparatus equipped with a vapor-liquid pump, including: an impeller located in a vapor-liquid receiving part that receives a vapor-liquid; a motor stator which is located outside separated from the vapor-liquid receiving part and transfers the driving force to the impeller; a sealed injection cover, in which an impeller shaft is formed on one side; a motor stator insertion rod, which is formed to protrude from the axis to the outer center of the impeller shaft such that the motor stator is inserted thereinto, is formed on the other side; a top plate, which is formed by extending from an edge of the motor stator insertion rod to separate the impeller from the motor stator, is formed; and an inlet through which the vapor-liquid flows in and an outlet through which the vapor-liquid flows out are formed on one side of the top plate; a heat transfer base, which is fused or attached to the bottom of the impeller along the rim of the top plate such that the vapor-liquid receiving part is formed; an inlet pipe, which is fused or attached to the inlet such that the vapor-liquid is flowed in; an outlet pipe, which is fused or attached to the outlet such that the vapor-liquid is flowed out; and a condenser, which is located between the inlet pipe and the outlet pipe and condenses the gas in the vapor-liquid, wherein the inner space, which is a closed loop that leads to the vapor-liquid receiving part, the inlet pipe, the outlet pipe and the condenser, forms a vacuum.

Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.