A solid state relay module configured to be coupled to an electronics enclosure. The solid state relay module includes a body with a first side and an opposite second side and two cable channels extending from the first side of the body. Each of the two cable channels is sized to receive a heating cable. The solid state module also includes a solid state relay platform defined between the two cable channels, where the solid state relay platform is sized to receive a solid state relay. The solid state relay module further includes a heat sink extending from the second side of the body.

A power electronics system comprising a environmentally sealed electronics compartment for housing power electronics equipment is provided. The system includes a plenum within the sealed electronic compartment for circulating air. A first liquid cooling loop is configured to cool air flowing through the plenum. A second liquid cooling loop configured to directly cool the power electronics equipment. The system includes a controller configured to independently control the flow rate of the first liquid cooling loop and the second liquid cooling loop.

A method for determining the level of efficiency of a ventilation system of an electrical enclosure intended to house one or more electrical devices, the method including a learning step including a step for determining a profile of the power dissipated via the Joule effect by each electrical device, an evaluation step for evaluating the level of efficiency of the ventilation system, including a step for determining the average air flow rate of a fan from a profile of the temperature of the air outside the enclosure obtained over an evaluation period, a profile of the temperature of the air at the outlet of the enclosure, and the dissipated power profile determined during the learning step, a step for comparing the average air flow rate with one or more threshold values in order to determine the level of efficiency of the ventilation system.

A method and computer program product are provided for controlling the airflow direction through a device enclosure. A first device enclosure is positioned adjacent a second device enclosure, wherein both enclosures have an airflow pathway extending from the front to the back, and a fan for moving air through the airflow pathway, wherein the fan of the first device enclosure is a reversible rotary fan. The method automatically determines whether the first device enclosure is in a first orientation with its front facing in the same direction as the front of the adjacent second device enclosure or in a second orientation with the front facing in the same direction as the back of the adjacent second device enclosure. The airflow direction imparted by a reversible rotary fan is then controlled according to the determined orientation of the first device enclosure relative to the second device enclosure.

Optimized conditioning of Information and Communication Technology (ICT) centers containing sensible heat generating equipment is achieved by indirect air-side economizing. In this process, the conditioned primary air stream is recirculated through a plate-type cross-flow heat exchanger, in which the cross-flow consists of a completely segregated cooler secondary ambient air stream. The air-to-air cross-flow heat exchanger comprises a series of parallel square or rectangular plates, which define a series of orthogonally alternating air passageways. This cross-flow design effectively prevents the mixing or blending of the primary and secondary air streams and thus avoids the efficiency losses and process airstream cross-contamination due to leakage, which is inherent in wheel type heat exchangers. The unique modular tunnel design of the cross-flow plate heat exchanger arrangement offers unit scalability and adjustability for various capacities and space demands. Real-time sensing of thermal demands and variable capacity control, coupled with on-demand mechanical cooling and humidification provisions, facilitate continuous operational optimization in all demands and ambient conditions.

An equipment cooling rack device, with a cooling cabinet, having a cooled area, adapted for holding multiple different heat creating structures to be cooled; a cooling structure, coupled to the cooling cabinet, and providing a first cooling coil for a left side of the rack and a second cooling coil for a right side of the rack, and orthogonal fans. The fans and coolant are controlled according to thermographic color of the cooling cabinet.

The present disclosure provides materials and methods related to passive cooling systems. In particular, the present disclosure provides a condensorator heat exchanger with a single microchannel coil that integrates the evaporator and condenser into one assembly. The passive heat exchanger systems of the present disclosure provide enhanced cooling capacity and airflow in environments ranging from outdoor electronic enclosures to commercial and residential buildings.

A system for determining and displaying in a graphical user interface one or more of air temperature, pressure, or velocity in an information technology (IT) room including an IT equipment rack comprises a processor configured to receive an input comprising airflow resistance parameters through the rack, an IT equipment airflow parameter, a heat-dissipation parameter, an external pressure, and an external temperature, to run the input through a flow-network solver that solves for airflow velocities through at least one face of the rack and a rack air outflow temperature based on the input, provide an output including the airflow velocities and the rack air outflow temperature, and generate, based on the output, a display in a graphical user interface of the system illustrating one or more of air temperatures, air pressures, or airflow velocities within the IT room.

Systems and methods for managing airflow for cooling computing devices (e.g. in a data center) in normal and cold environments are disclosed. In one embodiment, the method comprises positioning the computing devices on a plurality of racks with air barriers to create hot and cold aisles. The computing devices may be configured in a first mode to draw in cool air the cold aisles and exhaust heated air into the hot aisles. Temperatures in the cold aisles may be periodically measured. In response to temperatures below a predetermined threshold, one or more of the cold aisles may be converted into a temporary hot aisle by adjusting ventilation openings and configuring a subset of the computing devices to temporarily draw in warm air from the temporary hot aisle.

Systems, methods, and other embodiments associated with unified control of cooling in computers are described. In one embodiment, a method locks operation of first and second cooling mechanisms configured to cool one or more components in the computer. In response to a first condition, the method unlocks the operation of the first cooling mechanism to allow the first cooling mechanism to make cooling adjustments while the operation of the second cooling mechanism is locked. In response to a second condition, the method unlocks the operation of the second cooling mechanism to allow the second cooling mechanism to make cooling adjustments while the operation of the first cooling mechanism is locked. In the method, the first cooling mechanism and the second cooling mechanism are prevented from making the cooling adjustments simultaneously.