A power electronics system comprising a environmentally sealed electronics compartment for housing power electronics equipment is provided. The system includes a plenum within the sealed electronic compartment for circulating air. A first liquid cooling loop is configured to cool air flowing through the plenum. A second liquid cooling loop configured to directly cool the power electronics equipment. The system includes a controller configured to independently control the flow rate of the first liquid cooling loop and the second liquid cooling loop.

An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed and an optimal processor clock rate based on a first relationship between cost of the electronic rack and clock rate of the processors and a second relationship between energy consumption of the electronic rack, clock rate of the processors and pump speed.

A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

In accordance with the embodiments of the present disclosure, a rack comprising a frame having first vertical posts on a first side and second vertical posts on a second side, between which a plurality of RF amplifier modules are mounted, is provided. The RF power outputs of the RF amplifier modules are connected to inputs of an RF power combiner to deliver a combined RF power output. The RF power combiner is arranged at least partially in at least one of a first volume between the first vertical posts of the frame or a second volume between the second vertical posts of the frame, thereby reducing a footprint of the rack.

A modular enclosure for housing various computing devices is provided. The modular enclosure includes a platform and a housing module mounted on the base module. The housing module has lateral sides, a front side, a rear side and a roof defining an interior volume for receiving the various computing devices and fan cassettes. Each fan cassette is provided with its own controller which is configured to adjust the rotational speed of the fan based on the power consumption of the one or more computing devices. When connected in a cluster, the fan cassettes provide a N+1 redundancy, wherein each cassette as an adjacent fan cassette configured as an active backup. The fan cassettes of a cluster communicate via a communication bus. The fan cassettes may include dampers to redirect air drawn from the computing devices back toward them in cold whether conditions, or toward the outdoors, in hot weather conditions.

An environmental control system for a telecom shelter integrates with a native HVAC system for exchanging interior air in a conditioned space in a machine room, telecom enclosure, or other closed machine environment by forcing or directing cooler outside air to replace interior air without active refrigeration by the native HVAC system. Primary cooling and heating of the conditioned space in the enclosure is performed by an exchange system and control logic that identifies, based on sensory input, when outside air exchange is more efficient than native AC (Air Conditioner) operation. The native AC system is suppressed or inhibited, and primary environmental control performed by fan driven exchange of outside air with air in the enclosure. Sensors and timers identify appropriate periods to defer control to the native AC system for cooling demand in excess of outside air exchange capability, and also identify ongoing suppression, or “takeback” of cooling control from the native system when erroneous, erratic or mistaken operation results in excessive or insufficient cooling, resulting from such factors as equipment failure, operator error, and environmental/disaster occurrences.

Techniques for selective cooling based on external temperature are disclosed. An equipment rack includes a rack enclosure, at least one fan configured to provide airflow through the rack enclosure, an air conditioner disposed within the rack enclosure, and a controller. The controller is configured to perform operations including: receiving a temperature outside the rack enclosure from a temperature sensor configured to sense the temperature outside the rack enclosure, and controlling (a) a power status of the at least one fan and (b) a power status of the air conditioner disposed within the rack enclosure, based at least on the temperature outside the rack enclosure.

According to one embodiment, an edge cooling system with an IT container having an edge device partially submerged within a liquid coolant. The device generates heat that is transferred into liquid coolant thereby causing the liquid coolant to vaporize into vapor. The system includes a condenser that condenses vapor into liquid coolant, a vapor buffer configured to buffer and provide vapor to the condenser, a liquid accumulator configured to accumulate condensed liquid coolant and provide liquid coolant to the IT container, a main liquid supply line that couples the condenser and IT container to the liquid accumulator, and a main vapor return line that couples the condenser and IT container to the vapor buffer to create a heat exchanging loop. The system design includes the liquid accumulator and vapor buffer, and functions multiple cooling modes including a supplemental cooling. Each of the components are fully enclosed within an edge container.

An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed and an optimal processor clock rate based on a first relationship between cost of the electronic rack and clock rate of the processors and a second relationship between energy consumption of the electronic rack, clock rate of the processors and pump speed.

A system for determining and displaying in a graphical user interface one or more of air temperature, pressure, or velocity in an information technology (IT) room including an IT equipment rack comprises a processor configured to receive an input comprising airflow resistance parameters through the rack, an IT equipment airflow parameter, a heat-dissipation parameter, an external pressure, and an external temperature, to run the input through a flow-network solver that solves for airflow velocities through at least one face of the rack and a rack air outflow temperature based on the input, provide an output including the airflow velocities and the rack air outflow temperature, and generate, based on the output, a display in a graphical user interface of the system illustrating one or more of air temperatures, air pressures, or airflow velocities within the IT room.