An apparatus for dynamic thermal control is provided. The apparatus includes a fan module with multiple fan units, a deflection member configured to direct airflow received from the fan module, and a system component. The apparatus also includes a chassis management controller (CMC). The CMC is coupled to the fan module, deflection member, and the system component. The CMC is configured to dynamically control the deflection member to direct airflow from the fan module to the system component by accounting for at least one environmental element within the apparatus.

The disclosed systems and methods are directed to providing the mobile robot-assisted thermal monitoring of server racks in a datacenter. The thermal monitoring comprises a plurality of thermal sensors to detect temperature data of each of the server racks, a plurality of power distribution units (PDUs) to detect electrical power consumption of each of the servers, a datacenter operations controller configured to generate a temperature gradient profile over time for each of the server racks, determine a potential anomalous thermal condition of a server rack, and identify the server rack as a point-of-interest (POI). The thermal monitoring further comprises a mobile robot configured to travel to and capture the surface temperature image data of the identified POI server rack based on a provided navigation transit route and the datacenter operations controller updating the temperature gradient profile based on the capture the surface temperature image data.

A system may include a plurality of information handling systems and a manifold fluidically coupled to each of the plurality of information handling systems via respective fluidic conduits and further configured to couple to a cooling distribution unit, the manifold comprising a plurality of variable valves wherein the variable valves are programmable to control a flow rate of coolant fluid through the variable valves in order to independently control a first flow rate of the coolant fluid to a first information handling system of the plurality of information handling systems and a second flow rate of the coolant fluid to a second information handling system of the plurality of information handling systems.

According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.

A cold plate assembly includes a thermally conductive cold plate having a first surface attachable to a heat generating electronic component of an information processing system. An opposite second surface includes an array of hollow riser columns extending orthogonally and filled with a saturated working fluid for heat transfer. The cold plate assembly includes a stacked arrangement of fins physically attached perpendicularly to at least one of the riser columns. The vertical levels of fins are spaced apart, substantially in parallel with each other and the second surface to form a fin stack. An encapsulating lid of the cold plate assembly is attached to the second surface to form a liquid cooling cavity that encloses the fin stack. The encapsulating lid includes an intake port and an exhaust port that are laterally positioned and aligned with the fin stack to create liquid flow through the fin stack for liquid cooling.

A rack liquid cooling manifold (RLCM) system includes a supply manifold to receive a cooling liquid for cooling heat-generating electronic components via a cold plate and a return manifold to exhaust the cooling liquid from the cold plate. The RLCM system includes a manifold control unit (MCU) integrated into the supply manifold or the return manifold that is communicatively coupled to a supply control valve and a datacenter control system. The MCU includes a memory with rack temperature and liquid control (RTLC) code and a processor that processes the RTLC code to cause the MCU to: receive node-level liquid telemetry data originating from one or more liquid telemetry sensors integrated at a respective node; trigger actuation of the supply control valve to control a rate of cooling liquid flow into the supply manifold, partly based on the liquid telemetry data; and communicate rack level information with the datacenter control system.

The selection support system selects components constituting a machine tool including a drive system having a motor and a motor drive device configured to drive and control the machine tool, and a housing part configured to house at least a part of the drive system. The selection support system includes an information reception unit configured to receive operation information on operation of the machine tool, machine information on a configuration of the machine tool, and housing part information on the housing part, and a calculation unit. The calculation unit has a temperature estimation unit configured to estimate a temperature of an inside of the housing part, on the basis of the operation information, the machine information, and the housing part information received by the information reception unit.

A method for determining the level of efficiency of a ventilation system of an electrical enclosure intended to house one or more electrical devices, the method including a learning step including a step for determining a profile of the power dissipated via the Joule effect by each electrical device, an evaluation step for evaluating the level of efficiency of the ventilation system, including a step for determining the average air flow rate of a fan from a profile of the temperature of the air outside the enclosure obtained over an evaluation period, a profile of the temperature of the air at the outlet of the enclosure, and the dissipated power profile determined during the learning step, a step for comparing the average air flow rate with one or more threshold values in order to determine the level of efficiency of the ventilation system.

A rack fan speed regulation method based on a fan table provided in a node BMC is provided, which includes: providing a fan table reflecting a rack fan speed regulation policy in a BMC of each node server; acquiring, by the node BMC, a parameter reflecting a heat dissipation condition of a node motherboard; and acquiring, by the node BMC based on the speed regulation policy, a fan rotation speed corresponding to the parameter rapidly. With the rack fan speed regulation method, the node BMC can rapidly obtain parameters reflecting a heat dissipation condition of a node motherboard, and rapidly obtain a corresponding fan rotation speed based on the speed regulation policy. In this case, heat dissipation of the node can be controlled effectively in a timely manner, thereby ensuring heat dissipation of the rack.

The invention relates to a heat exchanger for cooling a switch cabinet, with a first line system for a first coolant and with a second line system, separated fluidically from the first line system, for a second coolant, in which the first and the second line system are coupled thermally to one another, and to a corresponding switch cabinet.