A data center thermal control system includes a local cooler configured to cool a local coolant used for cooling electronic hardware, an outer heat exchanger configured to exchange heat from fluid to outside air, and a fluid circulation system configured to convey heat from the local cooler to the outer heat exchanger by circulating at least one fluid cooling medium, the fluid circulation system including a cold portion directed to the air cooler. The thermal control system also includes one or more processors and a non-transitory computer-readable medium storing instructions that, when executed by the one or more processors, would cause the one or more processors to govern the outer heat exchanger to cool fluid in the cold portion to a first target temperature during a hot season, and cool fluid in the cold portion to a lower target temperature during a cold season.

According to one embodiment, an InRow liquid cooling module for a database center includes a main fluid distribution manifold and a mounting section. The manifold has a main supply line that is configured to receive coolant from a coolant source and a main return line that is configured to return warmed coolant to the coolant source. The mounting section is configured to receive cooling modules, each module is configured to 1) couple to the main supply line and the main return line to circulate the coolant through the module and 2) couple to a piece of IT equipment in an electronic rack to create a heat-transfer loop that transfers thermal energy away from the equipment and into the coolant that circulates through the module. In one embodiment, the InRow concept may be deployed as part of a data center infrastructure or combined as part of an electronic IT rack.

A node sled is for installation into an electronics chassis. The node sled includes a housing that contains electronic components. The housing includes a front bracket and a catch mechanism. The node sled further includes a lever having an engagement arm, an actuation arm, and a mounting portion. The mounting portion is pivotably mounted to the housing. The actuation arm is manually moveable between a first position in which the engagement arm locks the node sled into the electronics chassis, and a second position in which the engagement arm is released from the electronics chassis. The actuation arm has a latch that engages the catch mechanism in response to the actuation arm being in the first position.

A storage apparatus mounted in a rack includes: a battery that is placed on a front surface side of a power supply and supplies power during a backup operation; a drive mounting unit that is placed in front of the battery and has drives mounted thereon; a midplane that is placed between the battery and the drive mounting unit and relays signals and power; and a sub-midplane that is placed between the midplane and the battery and relays signals and power from the power supply and the battery, wherein the midplane and the sub-midplane are coupled to each other by a bus bar for supplying the power from the power supply, and an air passage that is capable of supplying cooling air from an intake port, formed on the front surface, to the battery without allowing the cooling air to pass around a periphery of the drives is provided.

An information handling system includes an enclosure having a front portion and a rear portion. An exhaust duct is located in between a first central processing unit and a first set of downstream components within the rear portion. The exhaust duct directs first airflow from the first central processing unit out of the information handling system without the first airflow reaching an inlet of the first set of downstream components. A first top cover is attached to the rear portion. The first top cover includes a first hole cut above the exhaust duct. The first hole enables the first airflow to escape from the rear portion.

A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.

Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.

A multi-floor data center can include a data center building having a plurality of floors, a single centralized air intake module spanning each of the plurality of floors, a number of cooling coil modules, a centralized liquid cooling system, and a number of IT modules. Each of the floors includes at least one of the cooling coil modules configured to receive external air from the single air intake module to cool a cooling coil. The centralized liquid cooling system is configured to circulate cooling liquid to the cooling coil for each of the cooling coil modules. Each of the floors includes one of the IT modules configured to house computing systems, and internal air is cooled at each of the cooling coil modules and introduced into each of the IT modules to cool the computing systems. Each floor can be equipped with different modular cooling systems with different cooling capacities.

A multi-floor data center can include a data center building having a plurality of floors, a single centralized air intake module spanning each of the plurality of floors, a number of cooling coil modules, a centralized liquid cooling system, and a number of IT modules. Each of the floors includes at least one of the cooling coil modules configured to receive external air from the single air intake module to cool a cooling coil. The centralized liquid cooling system is configured to circulate cooling liquid to the cooling coil for each of the cooling coil modules. Each of the floors includes one of the IT modules configured to house computing systems, and internal air is cooled at each of the cooling coil modules and introduced into each of the IT modules to cool the computing systems. Each floor can be equipped with different modular cooling systems with different cooling capacities.

A base station includes a first area and a second area that are obtained by partitioning closed space by a partition wall. The first area includes a first device that controls communication and a liquid cooling device that sends a cooled liquid refrigerant to the first device. The second area includes a radiator that cools a liquid refrigerant by performing heat exchange with air, that supplies the cooled liquid refrigerant to the liquid cooling device, and that discharges the air used for heat exchange into the second area, and includes a second device that radiates heat by using the air discharged from the radiator and that performs a wireless process in accordance with control performed by the first device.