A data center provides containment walls of an operation technology (OT) interior compartment, such as a meet me room, positioned between cold and hot aisles in an information technology (IT compartment. The OT interior compartment limits air flow so that IT components outside of the OT interior compartment receive sufficient supply air for moderating or cooling a temperature of the IT components. Pressure differential is measured on an exterior and interior of door(s) to the OT interior compartment. Air flow regulation device(s) are positioned in a supply air passage to the OT interior compartment and/or in a return air passage out of the OT interior compartment are controlled to limit the pressure differential between an exterior and interior of the containment wall. Limiting the pressure differential ensures that door(s) facing the cold aisle are not difficult to open and door(s) facing the hot aisle are not difficult to close.

A modular data center has an air handling unit (AHU) that is coupled to a first panel that is engaged over a first opening in a volumetric container. The AHU directs pressurized supply air through a supply air outlet into a cold aisle causing the supply air to pass through a first side of the IT component(s) installed in an interior of the volumetric container. A chimney of a return air plenum captures return air from a second side of the IT component(s), directing the return air to a return air duct of the return air plenum that is connected to a return air inlet of the AHU. In one or more embodiments, a second AHU is coupled to a second panel that is engaged to a second opening in a second side, directing pressurized supply air via a supply air plenum to the opposing first side.

An environmental control system is provided. The environmental control system can include a cooling device and a heating device. The cooling device can lower the temperature of fluid contained within a cold reservoir and the heating device can raise the temperature of fluid contained within a hot reservoir.

A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Examples of the disclosure relate to a cooling system for cooling one or more electronic components. The cooling system comprises at least one two-phase cooling system configured to cool one or more electronic components that are thermally coupled to the at least one two-phase cooling system and at least one air-cooling system configured to cool one or more electronic components. The at least one air-cooling system comprises at least one heat exchanger within the at least one air-cooling system wherein the at least one heat exchanger is coupled to a two-phase cooling system or a liquid phase cooling system. The at least one air-cooling system also comprises recirculation means configured to re-circulate air through the at least one air-cooling system to the one or more electronic components.

An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

A modular mounting for a computer motherboard. An outer cabinet is designed to provide a protective enclosure for electrical components, and designed to permit throughhole drilling to facilitate mounting on a wall while avoiding disturbance of contents to be mounted within the outer cabinet. A subpanel plate is designed to detachably and securely attach a computer motherboard and cage assembly, and designed to removably mount the motherboard and cage assembly within the outer cabinet as a modular component, mounting of the motherboard and cage assembly being independent of power supply and nonvolatile storage. An inner cage is designed to protectably mount and enclose a computer motherboard and heat sink, and mount to the subpanel plate. A multipole switch may have a set of contacts for each conductor of a network cable entering the outer cabinet, one throw of the switch connecting all conductors of the cable, another throw of the switch disconnecting all contacts of the cable.

A structure for mounting a cooling fan easily and conveniently and in the correct orientation only includes a chassis and at least one fan module. The chassis has a block, a first nut, and a second nut. The fan module has at least one accessory. The block is mounted on the first nut or the second nut. When the block is fixed on the first nut, the fan module can only be placed and installed so as to blow air into the chassis, and when the block is fixed on the second nut, the fan module can only be installed so as to extract air out of the chassis, thereby ensuring the correct mode of operation. An electronic device and a server using the structure is also disclosed.

A portable server data center and server rack system, includes a carrying case sized to allow the carrying case to be carried onboard an aircraft. A server tray rack rail apparatus is disposed within the carrying case to accommodate a plurality of server trays that are slidable along the rack rail apparatus. Each of the server trays are capable of accommodating a motherboard section and its components, a power supply section and its components, and a cooling apparatus for the motherboard and power supply sections.

A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack ((OR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56 Gbps using non-return to zero (NRZ) encoding and each cable may he about of less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine. Connections between adjacent server racks can provide for additional compute bandwidth when needed.