A switch cabinet arrangement which includes a switch cabinet (1) with an installation frame (2) accommodated therein, which delimits an accommodation space (3) for switch cabinet fixtures and which comprises a cooling air duct (5, 6, 7), wherein the installation frame (2) comprises two parallel separated vertical profiles (4) which establish a first attachment plane (a) for the switch cabinet fixtures and wherein the cooling air duct (5, 6, 7) comprises a partition (5) which extends between the vertical profiles (4) and a respective associated switch cabinet side wall (12), characterized in that the partition (5) comprises at least one perforation (6) to which at least one air supply channel (7) is fluidically connected, which leads cooling air introduced via the perforation (6) into the air supply channel (7) in the direction of the accommodation space (3).

A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

Optimized conditioning of Information and Communication Technology (ICT) centers containing sensible heat generating equipment is achieved by indirect air-side economizing. In this process, the conditioned primary air stream is recirculated through a plate-type cross-flow heat exchanger, in which the cross-flow consists of a completely segregated cooler secondary ambient air stream. The air-to-air cross-flow heat exchanger comprises a series of parallel square or rectangular plates, which define a series of orthogonally alternating air passageways. This cross-flow design effectively prevents the mixing or blending of the primary and secondary air streams and thus avoids the efficiency losses and process airstream cross-contamination due to leakage, which is inherent in wheel type heat exchangers. The unique modular tunnel design of the cross-flow plate heat exchanger arrangement offers unit scalability and adjustability for various capacities and space demands. Real-time sensing of thermal demands and variable capacity control, coupled with on-demand mechanical cooling and humidification provisions, facilitate continuous operational optimization in all demands and ambient conditions.

A portable, EMI-shielded data center and server rack system, includes a carrying case sized to allow the carrying case to be carried onboard an aircraft. A server tray rack rail apparatus is disposed within the carrying case to accommodate one or more server trays that are slidable along the rack rail apparatus. An EMI gasket is disposed within each of the EMI channels on the front-side and back-side of the carrying case. A front-side lid and a back-side lid are removably attached to the carrying case via a latching mechanism, such that when the front-side lid and back-side lid are latched to the carrying case, and the EMI gasket is disposed with the EMI front-side and back-side channels, the carrying case is sealed from EMI occurrences.

A modular cooling system includes a fluid pump in fluid communication with one or more cooling elements to cool electronics components; a heat exchanger in fluid communication with the fluid pump; a heat exchanger valve upstream of the heat exchanger; and a fluid supply valve positioned between a cooling fluid supply and the one or more cooling elements. When the heat exchanger valve and the fluid supply valve are in a first position, fluid is directed from the cooling fluid supply to the one or more cooling elements, bypassing the heat exchanger and the fluid pump. When the heat exchanger valve and the fluid supply valve are in a second position, fluid is cut off from the cooling fluid supply and a cooling fluid return and circulated through the heat exchanger and the fluid pump.

An electronic equipment enclosure includes a frame structure and a customizable side air dam kit. The frame structure includes a front frame, a rear frame, front-to-back frame members connecting corners of the front and rear frames together, reinforced bracket structures located near ends of the cross members, and extruded horizontal mounting rails parallel to, but inward from, the front-to-back frame members. The ends of the horizontal mounting rails are connected to the reinforced bracket structures. Panels are installed in longitudinal slots in the front-to-back frame members and horizontal mounting rails, each of which is extruded. The customizable side air dam kit includes a framework of horizontal and vertical frame pieces, adapted to connect to the frame structure, and a customizable air dam panel supported by the framework. A plurality of the frame pieces are provided to an installer for use in constructing the framework to fit the specific frame structure.

Cooling arrangement of data center configured for backup operation, the arrangement including an active cooling system having: fluid cooling systems. The arrangement further including an intake louvers assuming a closed position separating interior space of the data center from the exterior environment during normal mode of operation and an open position enabling free flow of outside air into the interior space during backup operation; exhaust louvers assuming a closed position separating interior space of the data center from the exterior environment and an open position enabling free flow of interior air out to the exterior environment; and controller configured to direct the intake louvers and exhaust louvers to assume the open position when electrical power supply to the active cooling system has been interrupted. The arrangement further includes a fluid system which functions as an open loop in the normal mode and a closed loop in the backup mode.

An overall efficient heat dissipation system for a high power density cabinet comprises a pump-driven two-phase circulation loop high-power-chip direct heat dissipation system and a cabinet air-cooling system. The cabinet air-cooling system comprises a refrigerant circulation loop and a cabinet internal air circulation loop. The refrigerant circulation loop includes a pump-driven two-phase circulation loop and a vapor compression circulation loop. The pump-driven two-phase circulation loop high-power-chip direct heat dissipation system performs fixed-point heat dissipation for main heating elements, such as CPU and GPU, in a server, and the cabinet air-cooling system performs air-cooling heat dissipation for other heating elements in the server.

A closed cold pool system is disclosed. The closed cold pool system may include a first closing assembly, a cabinet assembly and a second closing assembly. The first closing assembly is provided on a front side of the cabinet assembly to form a first closed cold aisle, and the second closing assembly is provided on a rear side of the cabinet assembly to form a second closed cold aisle. The cabinet assembly may include a power distribution cabinet, an in-row air conditioner and a main device unit that are provided side by side. The in-row air conditioner may include a front air supply opening, a rear air supply opening and a top air return opening. The front air supply opening is communicated with the first closed cold aisle, and the rear air supply opening is communicated with the second closed cold aisle.

When an enclosed space is formed, by at least one of surfaces forming an exterior shape of a shielding member and an intake or exhaust surface among surfaces forming an exterior shape of heat-generating housings, in such a way that a taken-in airflow and an exhausted airflow of the heat-generating housings installed in at least two rows can be separated or substantially separated, a cooling system includes: a duct formed to be able to separate or substantially separate a first airflow and a second airflow being intake/exhaust of a specific heat-generating housing among the heat-generating housings, and heat-generating housings other than the specific heat-generating housing, respectively; and a cooling enhancement unit enhancing cooling for the specific heat-generating housing by acting on the first airflow, thereby avoiding occurrence of a hot spot due to a high-heat-generating housing, in a system building an air-conditioning environment such as aisle capping.